TWI628043B - 彈性膜、基板保持裝置、及研磨裝置 - Google Patents

彈性膜、基板保持裝置、及研磨裝置 Download PDF

Info

Publication number
TWI628043B
TWI628043B TW106116286A TW106116286A TWI628043B TW I628043 B TWI628043 B TW I628043B TW 106116286 A TW106116286 A TW 106116286A TW 106116286 A TW106116286 A TW 106116286A TW I628043 B TWI628043 B TW I628043B
Authority
TW
Taiwan
Prior art keywords
peripheral wall
edge
polishing
elastic film
pressure chamber
Prior art date
Application number
TW106116286A
Other languages
English (en)
Chinese (zh)
Other versions
TW201808531A (zh
Inventor
Makoto Fukushima
福島誠
Hozumi Yasuda
安田穗積
Keisuke Namiki
並木計介
Osamu Nabeya
鍋谷治
Shingo Togashi
富樫真吾
Satoru Yamaki
山木暁
Shintaro Isono
磯野慎太郎
Original Assignee
Ebara Corporation
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corporation, 日商荏原製作所股份有限公司 filed Critical Ebara Corporation
Publication of TW201808531A publication Critical patent/TW201808531A/zh
Application granted granted Critical
Publication of TWI628043B publication Critical patent/TWI628043B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106116286A 2014-03-27 2015-03-20 彈性膜、基板保持裝置、及研磨裝置 TWI628043B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014066999 2014-03-27
JP2014-066999 2014-03-27

Publications (2)

Publication Number Publication Date
TW201808531A TW201808531A (zh) 2018-03-16
TWI628043B true TWI628043B (zh) 2018-07-01

Family

ID=54158041

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106116286A TWI628043B (zh) 2014-03-27 2015-03-20 彈性膜、基板保持裝置、及研磨裝置
TW104108920A TWI589396B (zh) 2014-03-27 2015-03-20 彈性膜、基板保持裝置、及研磨裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104108920A TWI589396B (zh) 2014-03-27 2015-03-20 彈性膜、基板保持裝置、及研磨裝置

Country Status (6)

Country Link
US (2) US9573244B2 (https=)
JP (2) JP6165795B2 (https=)
KR (2) KR101819792B1 (https=)
CN (2) CN109093507B (https=)
SG (2) SG10201700888YA (https=)
TW (2) TWI628043B (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6383152B2 (ja) * 2014-01-10 2018-08-29 平田機工株式会社 移載方法、保持装置及び移載システム
TWI628043B (zh) * 2014-03-27 2018-07-01 Ebara Corporation 彈性膜、基板保持裝置、及研磨裝置
TWI730044B (zh) * 2016-03-15 2021-06-11 日商荏原製作所股份有限公司 基板研磨方法、頂環及基板研磨裝置
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
US12285839B2 (en) * 2016-04-01 2025-04-29 Joon Mo Kang Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
CN107813220A (zh) * 2016-09-13 2018-03-20 清华大学 压力加载膜
US11179823B2 (en) 2016-10-28 2021-11-23 Ebara Corporation Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane
JP6833591B2 (ja) 2016-10-28 2021-02-24 株式会社荏原製作所 基板保持装置、弾性膜、研磨装置、および弾性膜の交換方法
US11088011B2 (en) 2017-04-12 2021-08-10 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
JP7141222B2 (ja) * 2017-04-12 2022-09-22 株式会社荏原製作所 弾性膜、基板保持装置、及び研磨装置
TWI673786B (zh) * 2017-08-25 2019-10-01 台灣積體電路製造股份有限公司 化學機械研磨設備及半導體裝置之製造方法
CN109420968B (zh) * 2017-08-25 2022-04-05 台湾积体电路制造股份有限公司 化学机械研磨设备及半导体装置的制造方法
KR102052878B1 (ko) * 2017-12-01 2019-12-10 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드 및 이에 사용되는 멤브레인
USD918161S1 (en) 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
CN108188865B (zh) * 2018-03-16 2020-01-10 中国工程物理研究院激光聚变研究中心 一种激光晶体抛光装置
CN108161702B (zh) * 2018-03-16 2019-09-06 中国工程物理研究院激光聚变研究中心 一种抛光机
KR102121728B1 (ko) * 2018-05-03 2020-06-12 주식회사 케이씨텍 유지링 및 이를 포함하는 캐리어 헤드
KR102712571B1 (ko) * 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
JP7158223B2 (ja) 2018-09-20 2022-10-21 株式会社荏原製作所 研磨ヘッドおよび研磨装置
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
KR102637833B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
JP7300297B2 (ja) * 2019-04-02 2023-06-29 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
SG10202008012WA (en) * 2019-08-29 2021-03-30 Ebara Corp Elastic membrane and substrate holding apparatus
CN112792728B (zh) * 2021-02-03 2022-11-22 华海清科股份有限公司 一种用于化学机械抛光的柔性膜、承载头及抛光设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013111679A (ja) * 2011-11-28 2013-06-10 Ebara Corp 弾性膜及び基板保持装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
JP2002187060A (ja) 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
JP4515047B2 (ja) * 2003-06-06 2010-07-28 株式会社荏原製作所 弾性膜、基板保持装置、研磨装置、及び研磨方法
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US7654888B2 (en) 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
JP2009131920A (ja) 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
US7959496B2 (en) * 2008-01-03 2011-06-14 Strasbaugh Flexible membrane assembly for a CMP system and method of using
KR100897226B1 (ko) * 2008-02-12 2009-05-14 황병렬 화학기계 연마장치의 내부 세척식 연마헤드
JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
KR20100108820A (ko) 2009-03-30 2010-10-08 주식회사리온 화학기계 연마 헤드용 가요성 박막
KR101113748B1 (ko) 2009-12-08 2012-02-27 전남대학교산학협력단 수소 저장 착물의 제조방법
US8591286B2 (en) * 2010-08-11 2013-11-26 Applied Materials, Inc. Apparatus and method for temperature control during polishing
KR101196652B1 (ko) * 2011-05-31 2012-11-02 주식회사 케이씨텍 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드
KR20140028287A (ko) * 2012-08-28 2014-03-10 주식회사 엘지실트론 웨이퍼 연마 장치
KR101286009B1 (ko) * 2011-12-16 2013-07-15 주식회사 엘지실트론 웨이퍼 연마 장치 및 웨이퍼 연마방법
KR20130131120A (ko) * 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
TWI628043B (zh) * 2014-03-27 2018-07-01 Ebara Corporation 彈性膜、基板保持裝置、及研磨裝置
SG10201606197XA (en) * 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013111679A (ja) * 2011-11-28 2013-06-10 Ebara Corp 弾性膜及び基板保持装置

Also Published As

Publication number Publication date
US20170144267A1 (en) 2017-05-25
SG10201700888YA (en) 2017-03-30
KR20150112837A (ko) 2015-10-07
KR20180006483A (ko) 2018-01-17
JP6480510B2 (ja) 2019-03-13
JP2017164901A (ja) 2017-09-21
US20150273657A1 (en) 2015-10-01
CN104942704B (zh) 2018-10-02
JP6165795B2 (ja) 2017-07-19
US10213896B2 (en) 2019-02-26
SG10201502293TA (en) 2015-10-29
TW201536475A (zh) 2015-10-01
KR101996747B1 (ko) 2019-07-04
CN109093507B (zh) 2021-08-03
TW201808531A (zh) 2018-03-16
JP2015193070A (ja) 2015-11-05
US9573244B2 (en) 2017-02-21
TWI589396B (zh) 2017-07-01
CN109093507A (zh) 2018-12-28
CN104942704A (zh) 2015-09-30
KR101819792B1 (ko) 2018-01-17

Similar Documents

Publication Publication Date Title
TWI628043B (zh) 彈性膜、基板保持裝置、及研磨裝置
KR101969600B1 (ko) 기판 보유 지지 장치
KR101767272B1 (ko) 연마 장치
US12068189B2 (en) Elastic membrane, substrate holding device, and polishing apparatus
US9815171B2 (en) Substrate holder, polishing apparatus, polishing method, and retaining ring
TWI658899B (zh) 研磨裝置及研磨方法
JP2013111679A (ja) 弾性膜及び基板保持装置
JP5856546B2 (ja) 研磨装置および研磨方法
KR102564628B1 (ko) 연마 장치 및 연마 방법
JP7219009B2 (ja) 基板保持装置およびドライブリングの製造方法
JP3902715B2 (ja) ポリッシング装置
KR20200041161A (ko) 리테이너링 및 이를 포함하는 기판 캐리어