TWI625530B - 形成探針銷之裝置及方法 - Google Patents

形成探針銷之裝置及方法 Download PDF

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Publication number
TWI625530B
TWI625530B TW106108685A TW106108685A TWI625530B TW I625530 B TWI625530 B TW I625530B TW 106108685 A TW106108685 A TW 106108685A TW 106108685 A TW106108685 A TW 106108685A TW I625530 B TWI625530 B TW I625530B
Authority
TW
Taiwan
Prior art keywords
wire
pair
grinding wheels
forming
probe pin
Prior art date
Application number
TW106108685A
Other languages
English (en)
Chinese (zh)
Other versions
TW201734470A (zh
Inventor
金學駿
白炳善
朴賢辰
朴成偶
朴載範
Original Assignee
璽韓微技術股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 璽韓微技術股份有限公司 filed Critical 璽韓微技術股份有限公司
Publication of TW201734470A publication Critical patent/TW201734470A/zh
Application granted granted Critical
Publication of TWI625530B publication Critical patent/TWI625530B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Measuring Leads Or Probes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
TW106108685A 2016-03-17 2017-03-16 形成探針銷之裝置及方法 TWI625530B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160032379A KR101755281B1 (ko) 2016-03-17 2016-03-17 프로브핀 제조장치 및 제조방법
??10-2016-0032379 2016-03-17

Publications (2)

Publication Number Publication Date
TW201734470A TW201734470A (zh) 2017-10-01
TWI625530B true TWI625530B (zh) 2018-06-01

Family

ID=59427348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106108685A TWI625530B (zh) 2016-03-17 2017-03-16 形成探針銷之裝置及方法

Country Status (4)

Country Link
KR (1) KR101755281B1 (ko)
CN (1) CN109073678B (ko)
TW (1) TWI625530B (ko)
WO (1) WO2017160090A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732612B (zh) * 2020-06-30 2021-07-01 財團法人金屬工業研究發展中心 探針加工方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101976997B1 (ko) * 2018-10-12 2019-05-10 주식회사 새한마이크로텍 프로브핀 제조장치 및 제조방법
CN110320390B (zh) * 2019-08-08 2021-12-10 深圳市研测科技有限公司 一种引脚保护型二极管测试用夹持工装
TWI752749B (zh) * 2020-12-07 2022-01-11 中華精測科技股份有限公司 提高垂直探針卡之微探針研磨效率的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209232A (ja) * 1997-01-22 1998-08-07 Tokyo Electron Ltd プローブ装置及びプローブ針の研磨方法
JP2006234511A (ja) * 2005-02-23 2006-09-07 Seiko Instruments Inc マイクロプローブの製造方法
US7195535B1 (en) * 2004-07-22 2007-03-27 Applied Materials, Inc. Metrology for chemical mechanical polishing
TW200730297A (en) * 2005-12-19 2007-08-16 Tokyo Electron Ltd Polishing method of probe and polishing member of the same
US20100285210A1 (en) * 2009-05-08 2010-11-11 University Of North Texas Multifunctional micropipette biological sensor

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JP3752398B2 (ja) * 1998-03-27 2006-03-08 三菱マテリアル神戸ツールズ株式会社 ねじれ溝成形研削加工の補正方法及びねじれ溝成形研削加工装置
JP2000009750A (ja) 1998-06-23 2000-01-14 Micronics Japan Co Ltd プローブ針のテーパ加工機
JP2005001027A (ja) 2003-06-10 2005-01-06 Kojo Seiko Kk プローブ針の加工用研削装置
JP4838545B2 (ja) 2005-07-25 2011-12-14 ベックマン コールター， インコーポレイテッド プローブの製造方法
JP4868577B2 (ja) * 2006-03-28 2012-02-01 独立行政法人理化学研究所 Ｅｌｉｄホーニング装置及び方法
KR100764631B1 (ko) * 2006-04-13 2007-10-08 (주)티에스이 프로브 팁 라운드 형상 가공 방법
CN2889608Y (zh) * 2006-04-18 2007-04-18 林正江 石材回转面磨抛机
KR20090030426A (ko) * 2007-09-20 2009-03-25 세크론 주식회사 프로브 카드의 프로브 연마 방법
JP5191312B2 (ja) * 2008-08-25 2013-05-08 東京エレクトロン株式会社 プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置
CN201271825Y (zh) * 2008-10-10 2009-07-15 华映视讯（吴江）有限公司 探针研磨装置
CN201287289Y (zh) * 2008-10-10 2009-08-12 华映视讯（吴江）有限公司 探针研磨装置
CN101602183B (zh) * 2009-06-26 2011-02-16 北京航空航天大学 一种制备近场光学探针的研磨装置及其方法
CN201728570U (zh) * 2010-05-19 2011-02-02 上海依然半导体测试有限公司 探针研磨装置
JP6298674B2 (ja) 2014-03-24 2018-03-20 株式会社ディスコ 切削装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209232A (ja) * 1997-01-22 1998-08-07 Tokyo Electron Ltd プローブ装置及びプローブ針の研磨方法
US7195535B1 (en) * 2004-07-22 2007-03-27 Applied Materials, Inc. Metrology for chemical mechanical polishing
JP2006234511A (ja) * 2005-02-23 2006-09-07 Seiko Instruments Inc マイクロプローブの製造方法
TW200730297A (en) * 2005-12-19 2007-08-16 Tokyo Electron Ltd Polishing method of probe and polishing member of the same
US20100285210A1 (en) * 2009-05-08 2010-11-11 University Of North Texas Multifunctional micropipette biological sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732612B (zh) * 2020-06-30 2021-07-01 財團法人金屬工業研究發展中心 探針加工方法

Also Published As

Publication number Publication date
TW201734470A (zh) 2017-10-01
CN109073678A (zh) 2018-12-21
CN109073678B (zh) 2020-11-03
WO2017160090A3 (ko) 2018-09-07
WO2017160090A2 (ko) 2017-09-21
KR101755281B1 (ko) 2017-07-19

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