WO2017160090A3 - 프로브핀 제조장치 및 제조방법 - Google Patents

프로브핀 제조장치 및 제조방법 Download PDF

Info

Publication number
WO2017160090A3
WO2017160090A3 PCT/KR2017/002829 KR2017002829W WO2017160090A3 WO 2017160090 A3 WO2017160090 A3 WO 2017160090A3 KR 2017002829 W KR2017002829 W KR 2017002829W WO 2017160090 A3 WO2017160090 A3 WO 2017160090A3
Authority
WO
WIPO (PCT)
Prior art keywords
axis
probe pin
pair
wire
manufacturing
Prior art date
Application number
PCT/KR2017/002829
Other languages
English (en)
French (fr)
Other versions
WO2017160090A2 (ko
Inventor
김학준
백병선
박현진
박성우
박재범
Original Assignee
주식회사 새한마이크로텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 새한마이크로텍 filed Critical 주식회사 새한마이크로텍
Priority to CN201780022830.6A priority Critical patent/CN109073678B/zh
Publication of WO2017160090A2 publication Critical patent/WO2017160090A2/ko
Publication of WO2017160090A3 publication Critical patent/WO2017160090A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Measuring Leads Or Probes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)

Abstract

본 발명은 프로브핀의 제조장치 및 제조방법에 관한 것으로서, 더욱 상세하게는, 금속 와이어의 첨단부를 연마하여, 프로브핀을 제조하는 장치 및 방법에 관한 것이다. 본 발명에 따르면, 금속 와이어의 끝단을 연마하여 프로브핀을 제조하는 장치로서, X축, Y축 및 Z축 방향을 가지는 지지구조와, 연마면인 외주면이 서로 마주보도록 배치되며, 각각 Y축과 나란한 회전축을 가지는 한 쌍의 회전 숫돌과, 상기 지지구조에 설치되며, 상기 한 쌍의 회전 숫돌을 X축과 나란하게 직선 이동시켜, 상기 한 쌍의 회전 숫돌 사이의 간격을 조절하는 숫돌 이송장치와, Z축을 따라 직선이동 하도록 상기 지지구조에 설치되며, 와이어를 고정해 Z축을 회전축으로 하여 회전시키도록 구성된 와이어 홀더와, 상기 와이어가 회전하면서 상기 한 쌍의 회전 숫돌 사이로 하강하도록, 상기 와이어 홀더를 제어하며, 상기 와이어가 하강함에 따라 상기 한 쌍의 회전 숫돌 사이의 간격이 점점 멀어지도록 숫돌 이송장치를 제어하는 제어기를 포함하는 프로브핀 제조장치가 제공된다.
PCT/KR2017/002829 2016-03-17 2017-03-16 프로브핀 제조장치 및 제조방법 WO2017160090A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780022830.6A CN109073678B (zh) 2016-03-17 2017-03-16 探针制造装置及制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160032379A KR101755281B1 (ko) 2016-03-17 2016-03-17 프로브핀 제조장치 및 제조방법
KR10-2016-0032379 2016-03-17

Publications (2)

Publication Number Publication Date
WO2017160090A2 WO2017160090A2 (ko) 2017-09-21
WO2017160090A3 true WO2017160090A3 (ko) 2018-09-07

Family

ID=59427348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/002829 WO2017160090A2 (ko) 2016-03-17 2017-03-16 프로브핀 제조장치 및 제조방법

Country Status (4)

Country Link
KR (1) KR101755281B1 (ko)
CN (1) CN109073678B (ko)
TW (1) TWI625530B (ko)
WO (1) WO2017160090A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101976997B1 (ko) * 2018-10-12 2019-05-10 주식회사 새한마이크로텍 프로브핀 제조장치 및 제조방법
CN110320390B (zh) * 2019-08-08 2021-12-10 深圳市研测科技有限公司 一种引脚保护型二极管测试用夹持工装
TWI732612B (zh) * 2020-06-30 2021-07-01 財團法人金屬工業研究發展中心 探針加工方法
TWI752749B (zh) * 2020-12-07 2022-01-11 中華精測科技股份有限公司 提高垂直探針卡之微探針研磨效率的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000009750A (ja) * 1998-06-23 2000-01-14 Micronics Japan Co Ltd プローブ針のテーパ加工機
JP2005001027A (ja) * 2003-06-10 2005-01-06 Kojo Seiko Kk プローブ針の加工用研削装置
JP3752398B2 (ja) * 1998-03-27 2006-03-08 三菱マテリアル神戸ツールズ株式会社 ねじれ溝成形研削加工の補正方法及びねじれ溝成形研削加工装置
JP2007033150A (ja) * 2005-07-25 2007-02-08 Olympus Corp プローブの製造方法
JP2015182166A (ja) * 2014-03-24 2015-10-22 株式会社ディスコ 切削装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3144672B2 (ja) * 1997-01-22 2001-03-12 東京エレクトロン株式会社 プローブ装置及びプローブ針の研磨方法
US7195535B1 (en) * 2004-07-22 2007-03-27 Applied Materials, Inc. Metrology for chemical mechanical polishing
JP2006234511A (ja) * 2005-02-23 2006-09-07 Seiko Instruments Inc マイクロプローブの製造方法
JP4745814B2 (ja) * 2005-12-19 2011-08-10 東京エレクトロン株式会社 プローブの研磨部材
JP4868577B2 (ja) * 2006-03-28 2012-02-01 独立行政法人理化学研究所 Ｅｌｉｄホーニング装置及び方法
KR100764631B1 (ko) * 2006-04-13 2007-10-08 (주)티에스이 프로브 팁 라운드 형상 가공 방법
CN2889608Y (zh) * 2006-04-18 2007-04-18 林正江 石材回转面磨抛机
KR20090030426A (ko) * 2007-09-20 2009-03-25 세크론 주식회사 프로브 카드의 프로브 연마 방법
JP5191312B2 (ja) * 2008-08-25 2013-05-08 東京エレクトロン株式会社 プローブの研磨方法、プローブ研磨用プログラム及びプローブ装置
CN201271825Y (zh) * 2008-10-10 2009-07-15 华映视讯（吴江）有限公司 探针研磨装置
CN201287289Y (zh) * 2008-10-10 2009-08-12 华映视讯（吴江）有限公司 探针研磨装置
US8602644B2 (en) * 2009-05-08 2013-12-10 University Of North Texas Multifunctional micropipette biological sensor
CN101602183B (zh) * 2009-06-26 2011-02-16 北京航空航天大学 一种制备近场光学探针的研磨装置及其方法
CN201728570U (zh) * 2010-05-19 2011-02-02 上海依然半导体测试有限公司 探针研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3752398B2 (ja) * 1998-03-27 2006-03-08 三菱マテリアル神戸ツールズ株式会社 ねじれ溝成形研削加工の補正方法及びねじれ溝成形研削加工装置
JP2000009750A (ja) * 1998-06-23 2000-01-14 Micronics Japan Co Ltd プローブ針のテーパ加工機
JP2005001027A (ja) * 2003-06-10 2005-01-06 Kojo Seiko Kk プローブ針の加工用研削装置
JP2007033150A (ja) * 2005-07-25 2007-02-08 Olympus Corp プローブの製造方法
JP2015182166A (ja) * 2014-03-24 2015-10-22 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
TWI625530B (zh) 2018-06-01
TW201734470A (zh) 2017-10-01
CN109073678A (zh) 2018-12-21
CN109073678B (zh) 2020-11-03
WO2017160090A2 (ko) 2017-09-21
KR101755281B1 (ko) 2017-07-19

Similar Documents

Publication Publication Date Title
WO2017160090A3 (ko) 프로브핀 제조장치 및 제조방법
EP2839927A3 (en) A surface processing system for a work piece
JP2014528846A5 (ko)
EP3120379A4 (en) Abrasive pad and glass substrate abrading method
PH12014000029A1 (en) Polishing apparatus, and method for polishing and manufacturing glass substrate
MY181618A (en) Colloidal silica polishing composition and method for manufacturing synthetic quartz glass substrates using the same
JP2013184270A5 (ko)
EP3492546A4 (en) ABRASIVE GRAIN, MANUFACTURING METHOD THEREFOR, POLISHING SLURRY WITH THESE GRINDING GRAINS AND POLISHING METHOD USING THIS POLISHING SLURRY
WO2016207002A3 (de) Verfahren zum bearbeiten mehrerer werkstücke sowie fertigungseinrichtung
SG165292A1 (en) Method of manufacturing a substrate for a magnetic disk
WO2015046543A8 (ja) 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法、並びに研削工具
EP3929155A4 (en) SILICA PARTICLES AND METHOD FOR PRODUCTION THEREOF, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, SEMICONDUCTOR WAFER PRODUCTION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
MY186027A (en) Cmp compositions and methods for polishing rigid disk surfaces
CN104858753A (zh) 一种能自动调整加工角度的打磨装置
CN102935611A (zh) 砂轮机
EP3441185A4 (en) POLISHING PAD AND MANUFACTURING METHOD THEREOF, AND ABRASIVE MANUFACTURING METHOD
CN102773797A (zh) 齿轮中孔精磨夹具
CN104493708A (zh) 一种有效控制轴承套同轴度的定位芯轴及其使用方法
CN205074828U (zh) 环形工件外圆槽铣削用工装
SG2013065842A (en) Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine
SG10202102010YA (en) Method for producing polishing slurry, polishing abrasive particles, polishing slurry, and method for manufacturing glass substrate
SG11202001636RA (en) Polishing liquid, method for manufacturing glass substrate, and method for manufacturing magnetic disk
MY168094A (en) Grindstone, method for manufacturing magnetic-disk glass substrate, and method for manufacturing magnetic disk
EP3929154A4 (en) SILICA PARTICLES AND METHOD FOR PRODUCTION THEREOF, SILICA SOL, POLISHING COMPOSITION, POLISHING METHOD, SEMICONDUCTOR WAFER PRODUCTION METHOD AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
WO2014079883A3 (de) Maschinenbaugruppe, fertigungsmaschine mit maschinenbaugruppe sowie verwendung und verfahren zur fertigung von rotationsbauteilen

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17766991

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 17766991

Country of ref document: EP

Kind code of ref document: A2