SG2013065842A - Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine - Google Patents

Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine

Info

Publication number
SG2013065842A
SG2013065842A SG2013065842A SG2013065842A SG2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A SG 2013065842 A SG2013065842 A SG 2013065842A
Authority
SG
Singapore
Prior art keywords
manufacturing
same
grinding machine
shaped workpiece
thin disk
Prior art date
Application number
SG2013065842A
Inventor
Sibanaka Atsushi
Original Assignee
Koyo Machine Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Ind Co Ltd filed Critical Koyo Machine Ind Co Ltd
Publication of SG2013065842A publication Critical patent/SG2013065842A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG2013065842A 2012-09-05 2013-09-02 Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine SG2013065842A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012195611A JP6033614B2 (en) 2012-09-05 2012-09-05 Thin-walled disk-shaped workpiece carrier device, manufacturing method thereof, and double-side grinding device

Publications (1)

Publication Number Publication Date
SG2013065842A true SG2013065842A (en) 2014-04-28

Family

ID=49003679

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013065842A SG2013065842A (en) 2012-09-05 2013-09-02 Carrier apparatus of thin disk-shaped workpiece, method of manufacturing the same, and both-side grinding machine

Country Status (5)

Country Link
EP (1) EP2705930B1 (en)
JP (1) JP6033614B2 (en)
KR (1) KR102093680B1 (en)
SG (1) SG2013065842A (en)
TW (1) TWI632987B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6197580B2 (en) * 2013-10-29 2017-09-20 株式会社Sumco Double-side polishing machine for carrier plate and workpiece
CN104493689B (en) 2014-12-16 2017-01-11 天津大学 Double-disc straight-groove grinding disc for surfaces of cylindrical parts
CN114406853A (en) * 2022-02-17 2022-04-29 安徽申容压力容器有限公司 Clamping mechanism for processing end cover of gas storage tank based on multidimensional rotation
CN115070604B (en) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 Double-sided polishing apparatus and double-sided polishing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555222Y2 (en) * 1976-05-19 1980-02-06
US6296553B1 (en) * 1997-04-02 2001-10-02 Nippei Toyama Corporation Grinding method, surface grinder, workpiece support, mechanism and work rest
JP3207787B2 (en) * 1997-04-04 2001-09-10 株式会社日平トヤマ Wafer processing method, surface grinder and work support member
JPH11221760A (en) * 1998-02-06 1999-08-17 Nippei Toyama Corp Cracking occurrance predicting method of workpiece, wafer working method utilizing the same, and grinder
JPH11333707A (en) * 1998-05-26 1999-12-07 Toshiba Ceramics Co Ltd Carrier
JP2000288921A (en) * 1999-03-31 2000-10-17 Hoya Corp Polishing carrier, polishing method and manufacture of information recording medium substrate
JP2003071704A (en) * 2001-08-29 2003-03-12 Nippei Toyama Corp Drive plate for rotating wafer
JP2003124167A (en) * 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd Wafer support member and double-ended grinding device using the same
US6899595B2 (en) * 2002-03-29 2005-05-31 Maurice J. Moriarty Seal assembly manufacturing methods and seal assemblies manufactured thereby
JP4881798B2 (en) * 2007-06-20 2012-02-22 清水建設株式会社 Member joining method and panel structure
JP2009178780A (en) * 2008-01-29 2009-08-13 Seiko Instruments Inc Carrier, device and method of grinding wafer, piezoelectric transducer and its manufacturing method, oscillator, electric instrument and atomic clock

Also Published As

Publication number Publication date
EP2705930A3 (en) 2014-08-13
EP2705930B1 (en) 2022-02-16
KR20140031816A (en) 2014-03-13
KR102093680B1 (en) 2020-03-26
JP2014050901A (en) 2014-03-20
TW201417951A (en) 2014-05-16
EP2705930A2 (en) 2014-03-12
TWI632987B (en) 2018-08-21
JP6033614B2 (en) 2016-11-30

Similar Documents

Publication Publication Date Title
EP2957613A4 (en) Polishing composition, production method for polishing composition, and production method for polished article
EP2834040A4 (en) Abrasive particles, method of making abrasive particles, and abrasive articles
EP3013526A4 (en) Abrasive particles, method of making abrasive particles, and abrasive articles
EP2851937A4 (en) Polishing composition, polishing method using same, and method for producing substrate
SG11201405091TA (en) Polishing agent, polishing agent set, and substrate polishing method
SG11201501334RA (en) Polishing agent, polishing agent set and method for polishing base
EP2872292A4 (en) Abrasive pad and method for abrading glass, ceramic, and metal materials
EP2868780A4 (en) Diamond single crystal and production method thereof, and single crystal diamond tool
HK1208559A1 (en) Slurry for chemical mechanical polishing and chemical mechanical polishing method
EP2703919B8 (en) Machining process and apparatus for machining
HK1200759A1 (en) Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same
EP2857476A4 (en) Method for manufacturing alumina-based abrasive grains for abrasive material, and alumina-based abrasive grains for abrasive material manufactured thereby
SG11201405381WA (en) Abrasive composition and method for producing semiconductor substrate
EP2884525A4 (en) Diamond semiconductor device and method for manufacturing same
SG11201607115QA (en) Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method
SG10201407353UA (en) Substrate holder, polishing apparatus, polishing method, and retaining ring
EP2839936A4 (en) Edged tool, manufacturing method therefor, and plasma device for manufacturing same
EP2853350A4 (en) Polishing pad and method for manufacturing same
SG11201600902WA (en) Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate
HUE039648T2 (en) Process and apparatus for electrochemically machining workpieces
EP3083145A4 (en) Abrasive, abrasive article and the method for preparing the same
SG2013084256A (en) Process for polishing a semiconductor wafer, comprising the simultaneous polishing of a front side and of a reverse side of a substrate wafer
SG11201406456XA (en) Outer periphery polishing apparatus for disk-shaped workpiece
SG11201407086TA (en) Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
GB201215469D0 (en) Diamond constructions, tools comprising same and method for making same