TWI625530B - Apparatus and method for forming a probe pin - Google Patents

Abstract

An apparatus and method for forming a probe pin. The apparatus for forming a probe pin includes: a support structure having an X-axis, a Y-axis, and a Z-axis direction; and a pair of grinding wheels arranged to face each other as an outer peripheral surface of the polishing surface, and each having a rotation axis parallel to the Y-axis a grinding wheel transfer device disposed in the support structure and adjusting a space between the pair of grinding wheels by linearly moving the pair of grinding wheels in parallel with the X axis; the wire holder is disposed in a linear manner along the Z axis in the support structure, And the fixed wire is configured to rotate the Z axis as a rotating shaft; and the controller controls the wire socket to rotate the wire one side to face between the pair of grinding wheels, and controls the grinding wheel transfer device to make a pair of grinding wheels The interval between them gradually moves away as the wire descends.

Description

Device and method for forming probe pin

The present invention relates to an apparatus and method for forming a probe pin, and more particularly to an apparatus and method for forming a probe pin by grinding a tip end portion of a metal wire.

The probe card is commonly used for performance inspection of a flat panel display including a liquid crystal display (LCD), a plasma display panel (PDP), or a semiconductor element formed on a wafer. The probe card electrically connects the inspection device (Probe Station) that performs the functions required for the inspection of the inspection object with the inspection object, and includes a collection of probe pins that directly contact the inspection object. The straight linear probe pin in the form of a simple bar has a simple shape and is easy to manage precision, and on the one hand, the reproducibility of the product is good, and on the one hand, a photolithography process, a photolithography process, a stamper, or the like can be used. Easy to make, so the scope of use is expanding.

The probe pin is manufactured in a taper shape at the tip end. The probe pin is completed by cutting the metal wire from a certain length and using etching or machining to make the portion of the tip more subtle and sharp.

The prior machining method uses a method in which the side end of the metal wire is obliquely contacted to the surface or the outer peripheral surface of the rotating disk-shaped grinding wheel, and then the metal wire is rotated to be processed. However, as the distance between the mats of the semiconductor wafer is gradually shortened, the thickness of the probe pin is also thinned, so there is a problem that it is difficult to utilize the prior machining method.

[Previous Technical Literature]

Registered patent 10-1073829

Japanese public patent 2006-234511

It is an object of the present invention to provide a new method and apparatus for forming a probe pin for improving the problem of the method of manufacturing a probe pin by prior machining methods. Moreover, it is an object to provide a new method and apparatus for forming a probe pin that is faster than prior machining methods.

In order to achieve the above object, according to the present invention, there is provided a device for forming a probe pin which is a device for grinding a tip end portion of a metal wire to form a probe pin, and includes: a support structure having an X-axis, a Y-axis, and a Z-axis direction; a pair of grinding wheels are disposed such that the outer peripheral surfaces of the polishing surfaces face each other, and each has a rotating shaft parallel to the Y-axis; the grinding wheel transfer device is disposed in the support structure, and the pair of grinding wheels and the X-axis are Adjusting the interval between the pair of grinding wheels by linearly moving in parallel; the wire holder is disposed in such a manner that the support structure is linearly moved along the Z axis, and the Z axis is rotated as a rotating shaft by fixing the wire; Controller, control above a wire holder for rotating the wire to face between the pair of grinding wheels and controlling the grinding wheel transfer device such that the interval between the pair of grinding wheels is gradually separated as the wire is lowered.

In one embodiment, the controller controls the pair of grinding wheels such that the pair of grinding wheels rotate in the same direction while grinding the tip end portion of the wire.

In one embodiment, the controller controls the lead frame and the pair of grinding wheels such that the ratio of the rotational speed of the pair of grinding wheels to the rotational speed of the lead frame is 1:1 to 15:1.

In one embodiment, the lead wire holder includes: a main body formed hollow in an axial direction; a support ferrule inserted into a hollow side end of the main body, and having a support surface parallel to an axial direction of the main body; and a clamping rod at one end Forming a protruding surface configured to press the lead wire against the support surface of the support ferrule to fix the lead wire, and forming a locking claw extending toward the center of the hollow at the other end, the central portion of which is pivotally disposed on the main body; The upper portion of the support ferrule is inserted so as to be movable in a straight line, and the hollow inner portion is locked to the locking claw with the lower end thereof when moving linearly in a direction away from the support ferrule. And protruding from the main body; and the first elastic providing portion is disposed on the main body to apply an elastic force in a direction in which the axial direction of the shaft and the supporting ferrule are away from each other.

In one embodiment, the lead frame further includes a cylindrical guide ferrule inserted into the hollow between the support ferrule and the shaft, and has a through hole through which the wire can pass.

In one embodiment, the wire holder further includes a second elastic providing portion for locking the clamping rod to the clamping rod by surrounding an outer surface of the main body and an outer surface between the clamping rod and the locking claw An elastic force is applied in a direction close to the center of the hollow to move the protruding surface away from the supporting surface.

In an embodiment, when no external force is applied, the elastic force of the first elastic providing portion is greater than the elastic force of the second elastic providing portion, so that the protruding surface of the clamping rod presses the wire to the support surface.

In one embodiment, the means for forming the probe pin further includes an actuator configured to bias the shaft of the lead seat in a direction away from the support ferrule.

In one embodiment, a cylindrical guide portion is formed, and a through hole through which the wire can pass is formed at a side end of the support ferrule.

According to the present invention, there is provided a method of forming a probe pin as a method of forming a probe by grinding a tip end portion of a metal wire, comprising the steps of: providing a pair of grinding wheels arranged in such a manner that outer peripheral faces of the polishing faces face each other a step of rotating the pair of grinding wheels in the same direction; a step of rotating the metal wire; a step of lowering a tip end portion of the rotating metal wire between the rotating pair of grinding wheels; and following the metal wire The step of lowering the interval between the pair of grinding wheels described above.

In one embodiment, the ratio of the rotational speed of the pair of grinding wheels to the rotational speed of the metal wire is 1:1 to 15:1.

Advantages of the apparatus and method for forming a probe pin in accordance with the present invention result in a faster processing speed of the probe pin.

10‧‧‧ grinding wheel

11a, 11b‧‧‧ grinding wheel

12a, 12b‧‧‧ spindle

13a, 13b‧‧‧Wheel transfer device

20‧‧‧ wire holder

21‧‧‧ hollow

22‧‧‧Guided ferrule

23‧‧‧Support ferrule

24‧‧‧Pinch

25‧‧‧Axis

26‧‧‧First Elastic Provisioning Department

27‧‧‧ Subject

28‧‧‧Second Elasticity Department

30‧‧‧ lead wire drive unit

60‧‧‧Support structure

111a, 111b‧‧‧ rotating shaft

112a, 112b‧‧‧ polished surface

221, 234, 251‧‧ ‧ through holes

231‧‧‧Support

232‧‧‧Guide

235‧‧‧ Curve Department

236‧‧‧Support surface

241‧‧‧Outstanding face

242‧‧‧ Central Department

243‧‧‧Locking claws

252‧‧‧Bottom

253‧‧‧ upper end

271‧‧‧ upper end

W‧‧‧ wire

X, Y, Z‧‧ Direction

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of an embodiment of a device for forming a probe pin in accordance with the present invention.

Fig. 2 is a schematic view of the grinding wheel portion shown in Fig. 1.

Figure 3 is a cross-sectional view showing a portion of the lead frame shown in Figure 1.

4 is a perspective view of the guide ferrule and the support ferrule shown in FIG. 3.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention may be variously modified, and the scope of the invention should not be construed as being limited to the embodiments described below. The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated for the purpose of emphasizing the more detailed description, and the elements indicated by the same reference numerals in the drawings refer to the same elements.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of an embodiment of a device for forming a probe pin in accordance with the present invention. As shown in FIG. 1, an embodiment of a device for forming a probe pin according to the present invention includes a support structure 60, a grinding wheel portion 10 disposed in the support structure 60, a wire holder 20, and a rotation and linear movement of the wire holder 20 The wire holder driving portion 30 is constructed in a manner. The support structure 60 has an X-axis, a Y-axis, and a Z-axis direction as shown in FIG.

Fig. 2 is a plan view of the grinding wheel portion 10 shown in Fig. 1 . As shown in Fig. 2, the grinding wheel portion 10 includes a pair of grinding wheels 11a, 11b and a pair of grinding wheel transfer devices 13a, 13b.

Each of the pair of grinding wheels 11a, 11b has a rotation axis parallel to the Y axis of the support structure 60. The rotating shafts 111a and 111b of the pair of grinding wheels 11a and 11b are located at spaced positions. The pair of grinding wheels 11a and 11b have a disk shape, and the polishing surfaces 112a and 112b are formed on the outer peripheral surface. The pair of grinding wheels 11a, 11b are disposed such that the polishing faces 112a, 112b face each other. The pair of grinding wheels 11a and 11b are respectively coupled to a pair of main shafts 12a and 12b which are driving portions for rotating the grinding wheels 11a and 11b at high speed.

A pair of grinding wheel transfer devices 13a, 13b are provided in the support structure 60. Spindles 12a and 12b connected to the grinding wheels 11a and 11b are provided in each of the pair of grinding wheel transfer devices 13a and 13b. The pair of grinding wheel transfer devices 13a and 13b function to adjust the interval between the pair of grinding wheels 11a and 11b by linearly moving the grinding wheels 11a and 11b, respectively. The pair of grinding wheel transfer devices 13a and 13b linearly move the pair of grinding wheels 11a and 11b in parallel with the X-axis.

The grinding wheel transfer devices 13a, 13b may be linear actuators. The linear actuator can be, for example, a Lead screw linear actuator, a Solenoid actuator, a Pneumatic cylinder, a Pneumatic rodless linear actuator. And various configurations are realized by a Rack and pinion mechanism or the like.

3 is a cross-sectional view of a portion of the lead frame 20 shown in FIG. 1.

The lead frame 20 functions to be fixed to the wire W used when forming the probe pin. The diameter of the wire used in forming the probe pin may be from about 20 μm to 500 μm. The wire has a specific elasticity to prevent it from being broken when pressurized, and is made of an electrically conductive material. For example, it can be made of a metal material such as tungsten, tantalum tungsten, platinum, silver or a palladium alloy.

The body 27 of the leadframe 20 is generally hollow cylindrical in shape. A cylindrical guide ferrule is inserted into the lower end of the hollow portion 21 of the lead frame 20, and has a through hole 221 (refer to FIG. 4) which is slightly larger than the diameter of the wire and has a diameter of about 10 μm (see FIG. 4). The lower end of the guide ferrule 22 is provided with a support ferrule 23.

4 is a perspective view of the guide ferrule 22 and the support ferrule 23 shown in FIG. As shown in FIG. 4, the support ferrule 23 includes a semi-cylindrical support portion 231 adjacent to the lower end of the guide ferrule 22 and a cylindrical guide portion 232. The support portion 231 is integrated with the guide portion 232. Formed in the guiding portion 232 Through hole 234. The cross section of the support portion 231 that supports the ferrule 23 is a form in which the circle is divided into one side with respect to the diameter, and the straight portion constitutes the support surface 236. The curved portion 235 is adjacent to the inner face of the lead frame 20. The lead ferrule 22 and the support ferrule 23 may be made of alumina or zirconia. The support ferrule 23 can be manufactured in such a manner as to cut off a part of the guide ferrule 22.

Referring again to FIG. 3, a clamping lever 24 is provided on one side of the side end of the lead frame 20, and is provided with a protruding surface 241 for pressing the lead wire against the supporting surface 236 of the supporting portion 231 of the supporting ferrule 23. The clamp lever 24 has its center portion 242 pivoted to the lead frame 20, and can perform vertical movement with the center portion 242 as a fulcrum. A protruding surface 241 is formed at a lower end of the clamp bar 24, and a locking claw 243 that protrudes toward the center of the hollow 21 is formed at the upper end.

Further, a shaft 25 is provided in the hollow 21 of the lead frame 20. A through hole 251 for receiving a wire for the entire length direction or a part of the shaft 25 is formed in the shaft 25. The lower end 252 of the shaft 25 protrudes toward the outside of the shaft 25 in such a manner as to lock the locking claw 243 at the upper end of the clamp bar 24.

Further, a coil spring as the first elastic supply portion 26 is provided between the upper end 253 of the shaft 25 and the upper end 271 of the main body 27 of the lead frame 20, and is provided to apply an elastic force in a direction in which the shaft 25 is raised. Further, a coil spring as a second elastic supply portion 28 is provided between the center portion 242 of the clamp lever 24 and the upper end of the clamp lever 24, which applies an elastic force to the clamp lever 24 to facilitate the projecting surface 241 of the lower end of the clamp lever 24. The support surface 236 of the support portion 231 of the self-supporting ferrule 23 is distant, and the upper end of the clamp rod 24 moves the clamp rod 24 up and down in a direction approaching the center portion of the lead frame 20. The coil spring is disposed to surround the center portion 242 of the clamp bar 24 and the upper end and the outer peripheral surface of the wire holder 20. At this time, since the elastic force of the first elastic providing portion 26 is greater than the elastic force of the second elastic providing portion 28, the protruding surface 241 of the clamping lever 24 always presses the wire against the supporting ferrule 23 when no external force is applied. The support portion 231 is fixed. And, the shaft 25 is pressed in the downward direction by an external force. In the case of the shape, the elastic force applied to the clamp bar 24 by the first elastic supply portion 26 is released by the shaft 25, and the protrusion of the clamp bar 24 faces the support portion of the self-supporting ferrule 23 by the elastic force of the second elastic supply portion 28. The support surface 236 of the 231 moves away from the direction. Therefore, the wires can be separated from the lead frame 20.

The wire before the processing is supplied to the wire holder 20, or when the processed wire is separated from the wire holder 20, the shaft 25 is pressed in the downward direction by an external force. In the support structure 60 or the wire holder 20, a solenoid actuator (not shown) is provided to provide an external force for pressing the shaft 25.

Referring to FIG. 1, the lead frame 20 is driven by a lead frame driving portion 30 provided to the support structure 60.

The lead frame driving portion 30 linearly moves the lead frame 20 along the Z axis of the support structure 60, and rotates the Z axis as a rotating axis.

The lead frame driving portion 30 includes a lifting device configured to be able to elevate and lower the lead frame 20 in the Z-axis direction. The lifting device can be constructed in various forms. For example, the lifting device can be a Z-axis linear actuator. The Z-axis actuator can be constituted by a servo motor (Servo Motor), a lead screw, a ball nut (Ball Nut), a carrier (Carriage), and a linear guide rail (LM guide).

Further, the lead frame driving portion 30 includes a Z-axis rotating device that causes the lead frame 20 to rotate the Z-axis as a rotating shaft. The Z-axis rotating device is coupled in parallel to the wire holder 20, and may include a motor having a driving shaft parallel to the Z-axis; a pulley having a rotating shaft parallel to the driving shaft of the motor; and a belt disposed on the driving shaft and the pulley. The lead frame 20 is rotated when the side surface of the upper end portion of the lead frame 20 is in close contact with the belt driven by the rotation of the motor. Of course, the lead frame 20 can be rotated by providing a pulley at the upper end portion of the lead frame 20 and a belt on the pulley of the drive shaft and the lead frame 20.

The controller (not shown) controls the lead frame 20 in such a manner that one side of the wire rotates and faces down between the pair of grinding wheels 11a, 11b. Further, as the wire is lowered, the grinding wheel transfer devices 13a, 13b are controlled such that the interval between the pair of grinding wheels 11a, 11b is gradually separated. What is important is that the pair of grinding wheels 11a, 11b are rotated in the same direction and the tip end portion of the wire is polished. When the pair of grinding wheels 11a, 11b are rotated in different directions from each other, the following problems are caused. When the left grinding wheel 11a rotates in the clockwise direction and the right grinding wheel 11b rotates in the counterclockwise direction, the metal wire may come off. Conversely, when the left grinding wheel 11a rotates in the counterclockwise direction and the right grinding wheel 11b rotates in the clockwise direction, the edge portion of the metal wire is worn, so there is a problem that a desired shape cannot be obtained.

Further, the controller controls the lead frame 20 and the pair of grinding wheels 11a, 11b such that the ratio of the rotational speed of the pair of grinding wheels 11a, 11b to the rotational speed of the lead frame 20 is 1:1 to 15:1. For example, when the lead frame 20 is rotated at about 100 rpm, the grinding wheels 11a and 11b are preferably rotated at about 100 rpm to 1500 rpm. If the ratio of the rotational speed of the grinding wheels 11a, 11b to the rotational speed of the lead frame 20 is out of this range, the polishing efficiency is lowered.

The embodiments described above are only illustrative of the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above embodiments, and can be realized by those skilled in the art within the technical idea and patent scope of the present invention. Various changes, modifications, and permutations are included, and such embodiments are to be understood as being within the scope of the invention.

Claims (11)

A device for forming a probe pin as a device for forming a probe pin by grinding a tip end portion of a metal wire, comprising: a support structure having an X-axis, a Y-axis, and a Z-axis direction; and a pair of grinding wheels as an outer peripheral surface of the polishing surface Arranged facing each other, and each having a rotation axis parallel to the Y-axis; a grinding wheel transfer device disposed in the support structure, and adjusting the one by linearly moving the pair of grinding wheels in parallel with the X-axis a spacing between the grinding wheels; the wire holder is disposed in such a manner that the supporting structure moves linearly along the Z axis, and the Z axis is rotated as a rotating shaft by fixing the wire; and a controller controls the wire a seat for rotating the wire to face between the pair of grinding wheels, and controlling the grinding wheel transfer device such that the interval between the pair of grinding wheels gradually moves away as the wire descends. The apparatus for forming a probe pin according to the first aspect of the invention, wherein the controller controls the pair by rotating the tip end portion of the wire while rotating the same direction on one side of the pair of grinding wheels Grinding wheel. The apparatus for forming a probe pin according to claim 1, wherein the controller has a ratio of a rotation speed of the pair of grinding wheels to a rotation speed of the wire holder of 1:1 to 15:1. The wire holder and the pair of grinding wheels are controlled in a manner. The device for forming a probe pin according to claim 1, wherein the lead wire holder comprises: a main body, which is hollow in an axial direction; a supporting ferrule inserted into the hollow side end of the main body and having a supporting surface parallel to the axial direction of the main body; the clamping rod is formed at one end to fix the wire to the supporting surface of the supporting ferrule and fixed The wire is formed by a protruding surface, and at the other end is formed a locking claw extending toward the center of the hollow, the central portion of which is pivotally disposed on the main body; and the shaft is located at the upper portion of the supporting ferrule, Inserting in a manner in which the hollow linear movement is performed, and in a hollow interior thereof, when moving linearly toward a direction away from the support ferrule, protruding in a manner that a lower end thereof is locked to the locking claw; and An elastic providing portion is provided to the main body to apply an elastic force to a direction in which the axial direction of the shaft and the supporting ferrule are away from each other. The apparatus for forming a probe pin according to claim 4, wherein the lead frame further comprises a cylindrical guide ferrule inserted into the hollow between the support ferrule and the shaft, and a through hole through which the wire can pass. The apparatus for forming a probe pin according to claim 4, wherein the lead frame further includes a second elastic providing portion surrounding an outer surface of the main body and a center portion of the clamping rod and the locking claw The outer portion of the clamping lever applies an elastic force to the locking claw of the clamping lever in a direction approaching the center of the hollow to move the protruding surface away from the supporting surface. The apparatus for forming a probe pin according to claim 6, wherein the elastic force of the first elastic providing portion is greater than the elastic force of the second elastic providing portion when no external force is applied, The protruding surface of the clamping rod presses the wire against the support surface. The apparatus for forming a probe pin according to claim 4, further comprising an actuator configured to press a shaft of the lead seat in a direction away from the support ferrule. The apparatus for forming a probe pin according to claim 4, wherein a cylindrical guide portion is formed, and a through hole through which the wire can pass is formed at a side end of the support ferrule. A method of forming a probe pin as a method of forming a probe by grinding a tip end portion of a metal wire, comprising the steps of: providing a pair of grinding wheels arranged to face each other as an outer peripheral surface of the polishing surface; a step of rotating a pair of grinding wheels in the same direction; a step of rotating the metal wire; a step of lowering a tip end portion of the rotating metal wire toward the rotating pair of grinding wheels; and The step of lowering the metal wire to increase the spacing between the pair of grinding wheels. The method of forming a probe pin according to claim 10, wherein a ratio of a rotational speed of the pair of grinding wheels to a rotational speed of the metal wire is 1:1 to 15:1.