JP2009125913A - Grinding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for grinding the front end of a very thin workpiece like a probe pin. <P>SOLUTION: The grinding device 1 comprises: a grinding wheel holding unit 10 holding the grinding wheel 11 and rotating it around a central axis 12 of the grinding wheel 11; a workpiece holding unit 20 holding a workpiece 5 so that the front end 6 of the workpiece is exposed forward, and moving the workpiece 5 forward along a central axis 7 of the workpiece 5 while rotating it around the central axis 7 of the workpiece 5, for contacting the front end 6 of the workpiece 5 with a peripheral surface 13 of the grinding wheel 11; an angle adjusting unit 40 adjusting an angle formed by the central axis 12 of the grinding wheel 11 and the central axis 7 of the workpiece 5; and a guide unit 50 oppositely located to the peripheral surface 13 of the grinding wheel 11 with respect to the front end 6 of the workpiece 5, and having a guide surface guiding in contact with the front end 6 of the workpiece 5 when the workpiece 5 moves forward. The guide surface includes an inclined surface inclined to be symmetrical to the peripheral surface 13 of the grinding wheel 11 with respect to the central axis 7 of the workpiece 5. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an apparatus for polishing a tip of an elongated rod-shaped workpiece such as a probe pin.

  Patent Document 1 describes a probe pin polishing apparatus that polishes a probe pin used for electrical inspection or the like of a semiconductor substrate or a liquid crystal display device. This polishing apparatus includes a grindstone rotating mechanism that rotates a disc-shaped grindstone, a pin holding jig that rotates the probe pin around its axis while holding the probe pin with its one end exposed, and a probe pin. A pin holding jig moving mechanism that moves the pin holding jig so that one end thereof can be brought into contact with the polishing surface in a state of extending along a direction orthogonal to the polishing surface of the grindstone, and a pin holding jig A pin holding jig rotating mechanism for rotating the pin holding jig on a plane that is on a plane including the axis of the held probe pin and the axis of the grindstone and is substantially parallel to the radial direction of the grindstone. And a rotation axis adjustment mechanism for adjusting the position of the rotation axis A along the axis of the probe pin held by the pin holding jig.

In Patent Literature 1, the probe pin is held by a pin holding jig, and one end portion of the probe pin is brought into contact with the grinding surface of the grindstone, the grindstone is rotated, and the probe pin is pivoted on the shaft. The probe pin is tilted at a predetermined angle around the point separated from the polishing surface in the direction of the back of the grindstone while rotating around the rotation axis, so that one end of the probe pin is polished into a substantially conical shape or a substantially spherical shape. It is described that the probe pin can be easily polished.
JP 2005-3516 A

  Semiconductor substrates and display devices to be inspected have been miniaturized, and the probe pin is not limited to a diameter of 0.25 mm, and a thinner one with a diameter of 0.1 mm or less is desired. Yes. Further, the tip of the probe pin is also required to be sharpened more sharply than the spherical shape. For example, the tip of the probe pin (full angle) θ is very sharp with 2 ° to 4 ° (degrees). Is desired.

  The probe pin that is thin and has a sharp tip has a high accuracy with the apparatus and method for polishing the tip with the probe pin extending in a direction orthogonal to the grinding surface of the grindstone. I can't polish. For example, even if the probe pin has a high rigidity such as tungsten, when the diameter is as thin as less than 0.25 mm, for example, when the diameter is 0.2 mm or less, the probe pin is easily bent in a minute range. Accordingly, it is difficult to polish the tip into a sharp conical shape having a tip angle θ of about 2 ° to 4 ° simply by pressing the tip against the diamond grindstone to polish the tip.

  One aspect of the present invention is an apparatus for polishing the tip of a long and narrow bar-shaped workpiece, which holds a cylindrical or disk-shaped grindstone and rotates the grindstone around the central axis of the grindstone in a first direction. Hold the unit and the workpiece so that the tip of the workpiece is exposed forward, and rotate the workpiece in the second direction around the workpiece's central axis while moving the workpiece forward along the workpiece's central axis. A workpiece holding unit that moves the workpiece tip in contact with the grinding wheel circumferential surface, an angle adjustment unit that adjusts the angle between the grinding wheel central axis and the workpiece central axis, and the grinding stone circumferential surface with respect to the workpiece tip And a guide unit provided with a guide surface that contacts the tip of the workpiece and guides the tip of the workpiece when the workpiece moves forward. Furthermore, the guide surface includes an inclined surface that is inclined with respect to the central axis of the workpiece so as to be symmetric with respect to the circumferential surface of the grindstone with which the tip of the workpiece contacts.

  This apparatus is an apparatus that polishes the tip of a long or thin member such as a probe pin using the peripheral surface of a rotating grindstone. The angle formed by the central axis of the grindstone and the central axis of the workpiece can be set by the angle adjusting unit so that the angle of the tip of the workpiece after polishing becomes a desired angle. A typical angle adjustment unit includes a mechanism for turning the grindstone holding unit around the grindstone or the vicinity thereof. By rotating the grindstone holding unit around the grindstone or its vicinity, the angle of the circumferential surface of the grindstone can be controlled with almost no change in the position where the workpiece and the grindstone contact each other. A typical grindstone holding unit is equipped with a motor for rotationally driving the grindstone. By turning the motor side away from the grindstone, variation due to a small angle increases, making angle adjustment easy. Become.

  Furthermore, this apparatus has a guide unit having a guide surface, and supports the tip of the workpiece being polished by the peripheral surface of the grindstone with the guide surface. Therefore, it is possible to suppress the tip of the workpiece from being distorted or curved by the guide surface when being polished by the grindstone. For this reason, even if it is a very thin rod-shaped workpiece, the tip can be polished so as to have a conical shape with a desired angle.

  Further, as the tip of the workpiece is polished, the surface around the tip of the workpiece being polished can be guided or slid forward along the guide surface. For this reason, even a very thin workpiece can be accurately polished over a long range with respect to the workpiece diameter, and the tip of the workpiece can be machined into a sharp and sharp shape with a small tip angle θ.

  It is desirable that the guide surface further includes a surface that is disposed on the side in contact with the tip of the workpiece before the inclined surface and is parallel to the central axis of the workpiece. The tip of the workpiece sent forward can be smoothly guided to the slope. Further, it is desirable that a part of the parallel surface is opposed to the circumferential surface of the grindstone. It is possible to prevent the slope of the guide surface from being damaged by applying the tip of the workpiece sent forward to the slope of the guide surface with the grindstone first shaved. At the same time, since the slope of the guide surface and the tip of the workpiece come into contact with each other by a surface or a line, the tip of the workpiece can be more reliably guided by the slope of the guide surface.

  Furthermore, the guide unit preferably includes a guide plate that forms a guide hole through which the tip of the workpiece passes immediately before the guide surface. And it is desirable for the front-end | tip of the workpiece | work which passed the guide hole to contact a guide surface. Since the guide hole can suppress the tip of the workpiece from moving, the tip of the workpiece can be processed with higher accuracy.

  In this apparatus, a typical grindstone and workpiece rotation direction is the reverse direction. That is, it is desirable that the first direction and the second direction are opposite directions. A typical workpiece is a probe pin.

  Another aspect of the present invention is a method for polishing the tip of an elongated rod-shaped workpiece using a polishing apparatus. The polishing apparatus holds a grindstone in a cylindrical or disc shape, holds a grindstone holding unit that rotates the grindstone in a first direction around the central axis of the grindstone, and holds the workpiece such that the tip of the workpiece is exposed forward. A workpiece holding unit that rotates in the second direction around the workpiece center axis, an angle adjustment unit that adjusts an angle formed by the center axis of the grindstone and the center axis of the workpiece, and the circumference of the grindstone with respect to the tip of the workpiece And a guide unit having a guide surface that guides the tip of the workpiece, and the guide surface is symmetrical to the peripheral surface of the grindstone with which the tip of the workpiece is in contact with the center axis of the workpiece. Including sloping slopes. Furthermore, the method includes moving the workpiece forward along the central axis of the workpiece while holding the workpiece by the workpiece holding unit, and bringing the tip of the workpiece into contact with the circumferential surface of the grindstone and the guide surface.

  Yet another embodiment of the present invention is a method for manufacturing a probe pin. This manufacturing method includes a step of polishing the tip of the probe pin using a polishing apparatus. The polishing apparatus is the above-described polishing apparatus that holds a probe pin as a workpiece. In the polishing step, the workpiece is moved forward along the center axis of the workpiece while the probe pin is held as a workpiece by the workpiece holding unit, and the tip of the workpiece is brought into contact with the circumferential surface and the guide surface of the grindstone. including.

  FIG. 1 is a plan view showing the arrangement of the polishing apparatus, and FIG. 2 is a side view showing the arrangement of the polishing apparatus centering on the grindstone. The polishing apparatus 1 uses a probe pin as a work 5 and a tip 6 of the work is polished in a conical shape with a grindstone 61. The polishing apparatus 1 includes a grindstone holding unit 10 that holds a grindstone 61, a work holding unit 20 that holds a work 5, a work mounting unit 30 that mounts the work 5 on the work holding unit 20, and a grindstone holding unit 10. An angle adjustment unit 40 that adjusts the angle, a guide unit 50 that guides the tip 6 of the workpiece 5, and an exhaust unit 60 that discards foreign matters during polishing are disposed on the base 2. .

  The grindstone holding unit 10 includes a motor base 15, a motor 16 disposed thereon, and a thin cylindrical (disk-shaped) grindstone 11 held so as to be rotated by a shaft 16 s of the motor 16. The grindstone 11 is rotated around its central axis 12 by a motor 16, for example, counterclockwise (first direction) when viewed from the side opposite to the motor 16. The grindstone 11 is typically a diamond grindstone (# 1000), which is arranged so that the peripheral surface 13 is parallel to the central axis 12, and the tip 6 of the workpiece 5 is polished by the peripheral surface 13. The motor base 15 extends along the base 2 so as to reach the lower side of the grindstone 11, and is supported so as to pivot in the horizontal direction with respect to the base 2, with the center (rotation center) 17 being almost directly below the grindstone 11. Has been.

  The side of the motor base 15 opposite to the grindstone 11 is supported with respect to the base 2 via the angle adjustment unit 40. The angle adjustment unit 40 includes a rail 41 arranged on the base 2 so as to draw an arc centered on the turning center 17, wheels 42 that move along the rail 41 while supporting the motor base 15, And a stopper (not shown) that stops the movement of the wheel 42. By the angle adjustment unit 40, the motor base 15 can be moved with respect to the base 2 so as to turn around the turning center 17. Therefore, the angle of the central axis 12 of the grindstone 11 can be changed within the range where the rail 41 is laid, and the angle formed by the central axis 7 of the workpiece 5 and the central axis 12 of the grindstone 11 can be controlled. Since the turning center 17 of the motor base 15 is disposed almost directly below the grindstone 11, the angle of the peripheral surface 13 of the grindstone 11 can be changed without greatly changing the position of the grindstone 11. For this reason, by turning the grindstone holding unit 10 by the angle adjusting unit 40, the angle at which the tip 6 of the workpiece 5 is polished can be controlled by finely adjusting the position of the tip 6 of the workpiece 5.

  3, 4, and 5 show an outline of the work mounting unit 30. 3 is a diagram showing a planar arrangement, FIG. 4 is a side view of the unit 30 viewed from a direction perpendicular to the workpiece 5, and FIG. 5 is viewed from the central axis direction of the workpiece 5. 3 is a side view of a unit 30. FIG. The workpiece 5 processed as a probe pin by processing the tip with the polishing apparatus 1 is a rod-shaped member made of tungsten having a diameter (wire diameter) of 0.25 mm or less, for example, a diameter of 0.1 mm. The workpiece mounting unit 30 includes a parallel chuck 31 for gripping the workpiece 5, a guide 32 having a V-shaped cross-section so that the tip 6 of the workpiece 5 is held in a predetermined position, and an end on the opposite side of the workpiece 5 ( A pusher 34 that pushes the other end) 8 to bring the tip 6 of the workpiece 5 into contact with the reference surface 33, and a rotary cylinder 35 that pivots the parallel chuck 31 that holds the workpiece 5 sideways by 90 degrees. It is mounted on the base 36.

  In a state where the parallel chuck 31 is opened, the work 5 is set on the V-shaped guide 32 so that the tip is accommodated. In this state, the other end 8 of the work 5 is pushed toward the tip 6 by the pusher 34. The tip 6 of the workpiece 5 slides on the V-shaped guide 32 and hits the reference surface 33, and the position of the tip 6 on the base 2 is determined with high accuracy. Next, the workpiece 5 is gripped by the parallel chuck 31, turned 90 degrees toward the workpiece holding unit 20, and the workpiece 5 is transferred to the workpiece holding unit 20.

  As shown in FIGS. 1 and 2, the workpiece holding unit 20 rotates the chuck 21 holding the workpiece 5 with two claws and the chuck 21 holding the workpiece 5 with two claws around the central axis 7 of the workpiece 5. Motor 22, an actuator 23 for moving the chuck 21 in the direction of the peripheral surface 13 of the front grindstone 11 while rotating, and a unit base 24 on which these are mounted. The motor 22 has the chuck 21 viewed from the side opposite to the rotation direction of the grindstone 11 (the direction opposite to the motor 16, that is, counterclockwise when viewed from the workpiece holding unit 20 side), that is, from the motor 22 side. It rotates around the central axis 7 of the workpiece 5 in the clockwise direction (second direction).

  The grindstone 11 is covered with a hood 61 of an exhaust unit 60, and the inside of the hood 61 is maintained at a lower pressure than the surroundings by an exhaust fan 62 disposed on the back side of the base 2. Therefore, the waste when the workpiece 5 is polished is not dissipated to the surroundings but is collected by the exhaust fan 62.

  FIG. 6 shows an enlarged view of the chuck 21 of the workpiece holding unit 20. The two claws 25a and 25b of the chuck 21 grip the workpiece 5 with the tip 6 of the workpiece 5 exposed forward. The two claws 25a and 25b pivot around the fulcrum 26, and the rod 28b accommodated in the body 27 of the chuck 21 moves back and forth by the cam 28a, and the two claws 25a are moved by the movement of the rod 28b. And 25b turn. As a result, the work 5 is gripped by the opening and closing of the toes 29 of the two claws 25a and 25b.

  A gap 25c is opened between the claws 25a and 25b of the chuck 21 except for the toe 29. The parallel chuck 31 of the workpiece mounting unit 30 rotates 90 degrees in the direction of the workpiece holding unit 20 after gripping the workpiece 5 so that the tip 6 of the workpiece 5 is in a predetermined position. The workpiece holding unit 20 is in a state in which the claws 25a and 25b of the chuck 21 are opened, and the workpiece holding unit 20 moves the parallel chuck 31 of the workpiece mounting unit 30 up and down by the claws 25a and 25b of the chuck 21. To the position where the workpiece 5 is sandwiched. The workpiece mounting unit 30 may move to the workpiece holding unit 20 side. The polishing apparatus 1 is configured using an XY table, and the unit base 24 of the work holding unit 20 can move in the X and Y directions on the base 2.

  Next, the chuck 21 of the work holding unit 20 holds the work 5 held by the parallel chuck 31 by closing the toe 29 from above and below. Since the parallel chuck 31 fits in the gap 25c of the chuck 21, the work 5 can be changed without interfering between the chuck 31 and the chuck 21. Thereafter, the parallel chuck 31 is opened, and the workpiece 5 is held by the claws 25 a and 25 b of the chuck 21. When the workpiece 5 is held alone by the chuck 21 and the parallel chuck 31 of the workpiece mounting unit 30 is rotated back to the original position, the motor 22 of the workpiece holding unit 20 moves the chuck 21 around the central axis 7 of the workpiece 5. Rotate. Thereby, preparation for starting the operation | work which grind | polishes the front-end | tip 6 of the workpiece | work 5 with the surrounding surface 13 of the grindstone 11 is completed.

  As shown in FIG. 1, a gate-shaped base 70 is provided on the base 2 so as to straddle the grindstone holding unit 10, and an actuator 71 that supports the guide unit 50 is mounted on the base 70. Yes. The actuator 71 is a second XY table and can move the guide unit 50 in the X and Y directions. The guide unit 50 is supported by an arm 75 extending from the actuator 71 in the direction of the peripheral surface 13 of the grindstone 11, and is disposed in the vicinity of the peripheral surface 13 of the grindstone 11. More specifically, the guide unit 50 is positioned on the opposite side of the peripheral surface 13 of the grindstone 11 with respect to the tip 6 of the workpiece 5 by the arm 75 and the actuator 71, and the workpiece 5 is attached to the chuck 21 of the workpiece holding unit 20. When it is moved forward (in the direction of the grindstone 11) while being held, the tip 6 of the workpiece 5 is brought into contact with the tip 6 of the workpiece 5 and guided.

  FIG. 7 shows the guide unit 50 as viewed from the side in the circumferential direction of the grindstone 11. FIG. 8 shows the guide unit 50 as viewed from the direction of the workpiece 5. FIG. 9 shows the guide unit 50 as viewed from the circumferential direction of the grindstone 11. Further, FIGS. 10 to 12 show the vicinity of the guide surface of the guide unit 50 in an enlarged manner. The guide unit 50 is in contact with the tip 6 of the workpiece 5 and has a main body 52 having a guide surface 51 for guiding the tip 6 of the workpiece 5, and a guide hole 53 through which the tip 6 of the workpiece 5 passes immediately before the guide surface 51. A guide plate 54 is provided. When the workpiece 5 is held by the chuck 21 of the workpiece holding unit 20 and the workpiece 5 is advanced forward (in the direction of the grinding stone 11) so that the tip 6 of the workpiece 5 is substantially parallel to the peripheral surface 13 of the grinding stone 11, the workpiece 5 The leading end 6 of the workpiece 5 passes through the guide hole 53, and the leading end 6 of the workpiece 5 is in contact with the guide surface 51. At the same time, the tip 6 of the workpiece 5 comes into contact with the peripheral surface 13 of the grindstone 11 and is polished by the grindstone 11.

  The peripheral surface 13 of the grindstone 11 and the workpiece 5 are actually a small angle, for example, about 1 degree (1 °) which is a half angle of the apex angle θ, and the center axis 12 of the grindstone 11 and the center of the workpiece 5. Contact with the shaft 7 in an inclined state. For this reason, the tip 6 of the workpiece 5 is polished in a conical shape by the peripheral surface 13 of the rotating grindstone 11. In FIG. 9, the angle θ / 2 is schematically indicated by a line 7 ′ parallel to the central axis 12 of the grindstone 11 and the central axis 7 of the workpiece 5. This angle θ / 2 can be freely changed within a range that the angle adjustment unit 40 can handle by turning the grindstone holding unit 10 by the angle adjustment unit 40. Many of the probe pins manufactured by the polishing apparatus 1 have a diameter (wire diameter) of 0.07 mm to 0.28 mm, an apex angle θ of 2 degrees (2 °) to 4 degrees (4 °), and a total length of 30 mm. To about 100 mm.

  FIG. 10 shows an enlarged guide surface 51 of the guide unit 50. The guide surface 51 includes an inclined surface 55 that is inclined by an angle θ / 2 so as to be symmetric with respect to the peripheral surface 13 of the grindstone 11 with which the tip 6 of the workpiece 5 is in contact with the central axis 7 of the workpiece 5. Further, the guide surface 51 is a surface 56 disposed on the side (the guide hole 53 side) in contact with the tip 6 of the work 5 before the inclined surface 55, and is a surface 56 parallel to the central axis 7 of the work 5. including. The main body 52 of the guide unit 50 is provided on the opposite side of the guide surface 51, that is, on the side of the motor 16 that drives the grindstone 11 (the side of the shaft 16s) and the inclined surface 55 of the guide surface 51 to avoid contact with the grindstone 11. A flank 59 having a reverse taper is provided. The guide unit 50 is made of a cemented carbide material with extremely excellent wear resistance, typically SKD11 (JIS G4404: 2006 alloy tool steel).

  As shown in FIG. 11, the chuck 21 (see FIG. 9) of the work holding unit 20 that holds the work 5 is advanced forward. Since the tip 6 of the workpiece 5 is held by the chuck 21 so as to be exposed forward, the tip 6 of the workpiece 5 passes through the guide hole 53 of the guide plate 54, and the tip 6 of the workpiece 5 is flat on the guide surface 51. Touching the flat surface 56. Further, when the workpiece 5 is advanced forward, the edge of the tip 6 of the workpiece 5 comes into contact with the peripheral surface 13 of the grindstone 11 and the edge of the tip 6 of the workpiece 5 is polished. By passing the workpiece 5 through the guide hole 53, it is possible to prevent the tip 6 of the workpiece 5 from shaking when the tip 6 of the workpiece 5 contacts the circumferential surface 13 of the grindstone 11. Therefore, the processing of the tip 6 of the workpiece 5 can be started with higher accuracy.

  The parallel surface 56 of the guide surface 51 fulfills the function of receiving the tip 6 of the workpiece 5 and guiding it so that the edge of the tip 6 of the workpiece 5 contacts the peripheral surface 13 of the grindstone 11. The position of the tip 6 of the work 5 is moved with respect to the peripheral surface 13 of the grindstone 11 by advancing the work 5 so as to pass through the guide hole 53 and further contact the guide surface 51 or slide the guide surface 51. Therefore, it is possible to prevent a situation in which the tip 6 of the workpiece 5 hits the edge of the circumference of the grindstone 11 or a portion other than the edge of the tip 6 of the workpiece 5 contacts the grindstone 11 in advance.

  It is desirable that a part of the parallel surface 56 of the guide surface 51 is opposed to the peripheral surface 13 of the grindstone 11. That is, after the edge of the tip 6 of the workpiece 5 guided by the parallel surface 56 of the guide surface 51 is polished by the peripheral surface 13 of the grindstone 11, the tip 6 of the workpiece 5 hits the inclined surface 55 of the guide surface 51. It is desirable that they are arranged as follows. The tip 6 of the workpiece 5 is fed forward in a state where the edge angle (corner) is chamfered to a desired angle θ and hits the inclined surface 55 of the guide surface 51. Therefore, the tip 6 of the workpiece 5 can be prevented from coming into contact with the inclined surface 55 of the guide surface 51 from the beginning with a surface or a line, and with a point. For this reason, it can suppress that the slope 55 of the guide surface 51 is damaged. At the same time, since the tip 6 of the work 5 initially contacts the inclined surface 55 of the guide surface 51 by a surface or a line, the work 5 can be guided more reliably by the inclined surface 55 of the guide surface 51 than when contacted by a point, It is possible to prevent the tip 6 of the workpiece 5 from shaking or vibrating when starting polishing.

  As shown in FIG. 12, when the chuck 21 (see FIG. 9) of the workpiece holding unit 20 that holds the workpiece 5 is further advanced, the workpiece 5 being polished by the peripheral surface 13 of the grindstone 11 is The guide surface 51 can be supported by the inclined surface 55 and the parallel (flat) surface 56. The inclined surface 55 of the guide surface 51 is inclined so as to be symmetric with the peripheral surface 13 of the grindstone 11 with respect to the central axis 7 of the workpiece 5, and therefore the tip 6 of the workpiece 5 whose shape continuously changes as polishing progresses. Can be supported continuously or continuously by the slope 55. Therefore, when the tip 6 of the workpiece 5 is polished by the grindstone 11, the tip 6 of the workpiece 5 is not distorted or curved. It can be polished into an angle cone.

  In particular, the inclined surface 55 of the guide surface 51 advances the polishing of the tip 6 of the workpiece 5 and supports the tip 6 of the workpiece 5 being polished and the surrounding surface behind it, and sends the tip 6 forward ( Slide). Therefore, the workpiece holding unit 20 is advanced forward so that the workpiece 5 comes into contact with the guide surface 51, whereby the tip 6 and the rear surface of the workpiece 5 are pressed against the peripheral surface 13 of the grindstone 11 to advance the polishing. Can do. Therefore, even a very thin workpiece 5 can be accurately polished over a long range with respect to the diameter of the workpiece 5, and the tip 6 of the workpiece 5 is sharply pointed with a small tip angle θ of several degrees. Can be processed into a shape. Further, the angle θ / 2 formed by the peripheral surface 13 of the grindstone 11 and the central axis 7 of the workpiece (workpiece) 5 can be adjusted (controlled) by the angle adjusting unit 40. The guide unit 50 can be replaced with one having an inclined surface 55 that matches the adjusted angle θ / 2. Even if the probe pin has a different apex angle θ of the tip 6 of the work 5, this polishing is performed. The tip 6 can be polished and manufactured to a desired conical shape by the apparatus 1.

  Thus, this polishing apparatus 1 is suitable for tapering the tip of a rod-like (round bar-like) member having a wire diameter of about 0.05 mm to 1 mm. In particular, the probe pin is suitable for processing the tip of a probe pin having a wire diameter of less than 0.25 mm and further having a wire diameter of 0.08 mm to 0.20 mm into a tapered shape. The tip angle (full angle of the apex angle) θ can be processed to a very acute angle of 2 ° to 4 °, and the probe pin has a sharp conical tip corresponding to a product with advanced miniaturization. Can be manufactured. The long and thin member that can be manufactured by the polishing apparatus 1 is not limited to the probe pin, but may be used in other fields, for example, a microfabrication processing instrument such as MEMS, or an experimental or medical cell manipulation instrument. Applicable. Moreover, the size of the ultrafine member that can be manufactured is not limited to the above.

  Furthermore, the inclined surface 55 and the parallel surface 56 of the guide surface 51 may be a surface in which a portion in contact with the work 5 extends on the inclined surface and flatly. The entire guide surface 51 has a cross section in the traveling direction of the work 5. They may be curved or processed into a V shape within a range where interference with the peripheral surface 13 of the grindstone 11 can be avoided.

The top view which shows arrangement | positioning of a grinding | polishing apparatus. Sectional drawing which shows arrangement | positioning of a grinding | polishing apparatus. The top view which shows arrangement | positioning of a workpiece | work mounting unit. The side view which shows arrangement | positioning of a workpiece | work mounting unit. The side view which shows arrangement | positioning of a workpiece | work mounting unit (axial direction). The figure which shows the chuck | zipper of a workpiece holding unit. The figure which looked at the guide unit from the circumferential direction of the grindstone. The figure which looked at the guide unit from the axial direction of the grindstone. The figure which looked at the guide unit from the circumferential direction (above) of a grindstone. The enlarged view of a guide unit. The figure which shows a mode that grinding | polishing was started using the guide unit. The figure which shows the state which advanced grinding | polishing using the guide unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Polishing device, 5 Workpiece (probe pin), 6 Tip, 7 Center axis of workpiece 10 Grinding wheel holding unit, 11 Grinding stone, 12 Center axis of grinding wheel, 13 Peripheral surface 20 Work holding unit, 21 Chuck 30 Work mounting unit, 40 angle Adjustment unit 50 Guide unit 51 Guide surface 55 Slope 56 Parallel surface 60 Exhaust unit

Claims (8)

An apparatus for polishing the tip of an elongated rod-shaped workpiece,
A grindstone holding unit that holds a cylindrical or disc-shaped grindstone, and rotates the grindstone in a first direction around a central axis of the grindstone;
Holding the workpiece so that the tip of the workpiece is exposed forward, rotating the workpiece in the second direction around the central axis of the workpiece, moving the workpiece forward along the central axis of the workpiece, A workpiece holding unit for bringing the tip of the workpiece into contact with the peripheral surface of the grindstone;
An angle adjustment unit for adjusting an angle formed by the central axis of the grindstone and the central axis of the workpiece;
A guide unit that is located on the opposite side of the peripheral surface of the grindstone with respect to the tip of the workpiece and includes a guide surface that contacts the tip of the workpiece and guides the tip of the workpiece when the workpiece moves forward. And
The guide surface includes an inclined surface that is inclined with respect to a central axis of the workpiece so as to be symmetric with respect to a circumferential surface of the grindstone with which a tip of the workpiece contacts.   2. The apparatus according to claim 1, wherein the guide surface further includes a surface that is disposed on a side in contact with a tip of the workpiece before the inclined surface and is parallel to a central axis of the workpiece.   3. The guide unit according to claim 1, wherein the guide unit includes a guide plate that forms a guide hole through which the tip of the workpiece passes immediately before the guide surface, and the tip of the workpiece that has passed through the guide hole is A device that comes in contact with the guide surface.   4. The apparatus according to claim 1, wherein the angle adjustment unit includes a mechanism for turning the grindstone holding unit around the grindstone or the vicinity thereof.   The apparatus according to claim 1, wherein the first direction and the second direction are opposite directions.   6. The apparatus according to claim 1, wherein the workpiece is a probe pin. A method for polishing the tip of an elongated rod-shaped workpiece using a polishing apparatus,
The polishing apparatus comprises:
A grindstone holding unit that holds a cylindrical or disc-shaped grindstone, and rotates the grindstone in a first direction around a central axis of the grindstone;
A workpiece holding unit that holds the workpiece so that a tip of the workpiece is exposed forward, and rotates the workpiece in a second direction around a central axis of the workpiece;
An angle adjustment unit for adjusting an angle formed by the central axis of the grindstone and the central axis of the workpiece;
A guide unit provided on a side opposite to the peripheral surface of the grindstone with respect to the tip of the workpiece, and having a guide surface for guiding the tip of the workpiece, wherein the guide surface is relative to a central axis of the workpiece , Including a slope inclined so as to be symmetric with the peripheral surface of the grindstone with which the tip of the workpiece contacts,
The method is
Moving the workpiece forward along the central axis of the workpiece while holding the workpiece by the workpiece holding unit, and bringing the tip of the workpiece into contact with the circumferential surface of the grindstone and the guide surface, Method. A method for manufacturing a probe pin, comprising: a step of polishing a tip of the probe pin using a polishing device;
The polishing apparatus comprises:
A grindstone holding unit that holds a cylindrical or disc-shaped grindstone, and rotates the grindstone in a first direction around a central axis of the grindstone;
A workpiece holding unit that holds the probe pin as a workpiece, holds the tip of the workpiece so as to be exposed forward, and rotates in a second direction around the central axis of the workpiece;
An angle adjustment unit for adjusting an angle formed by the central axis of the grindstone and the central axis of the workpiece;
A guide unit provided on a side opposite to the peripheral surface of the grindstone with respect to the tip of the workpiece, and having a guide surface for guiding the tip of the workpiece, wherein the guide surface is relative to a central axis of the workpiece , Including a slope inclined so as to be symmetric with the peripheral surface of the grindstone with which the tip of the workpiece contacts,
The polishing step includes
While holding the probe pin as the workpiece by the workpiece holding unit, the workpiece is moved forward along the central axis of the workpiece, and the tip of the workpiece is brought into contact with the circumferential surface of the grindstone and the guide surface. Including the method.

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