CN109073678A - probe manufacturing device and manufacturing method - Google Patents
probe manufacturing device and manufacturing method Download PDFInfo
- Publication number
- CN109073678A CN109073678A CN201780022830.6A CN201780022830A CN109073678A CN 109073678 A CN109073678 A CN 109073678A CN 201780022830 A CN201780022830 A CN 201780022830A CN 109073678 A CN109073678 A CN 109073678A
- Authority
- CN
- China
- Prior art keywords
- grindstone
- pair
- probe
- wire clamp
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Measuring Leads Or Probes (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The present invention relates to a kind of probe manufacturing device and manufacturing methods, more specifically, are related to a kind of point of abrasive metal silk to manufacture the device and method of probe.According to the present invention, a kind of probe manufacturing device is provided, the end of abrasive metal silk manufactures probe, and the probe manufacturing device includes: support construction, with X-axis, Y-axis and Z-direction；A pair of of grindstone, the mode mutually opposed using the outer peripheral surface as abradant surface configures, and is respectively provided with the rotary shaft parallel with Y-axis；Grinding stone transfer device is set to the support construction, and the pair of grindstone and X-axis is made to be moved linearly in parallel to adjust the spacing between the pair of grindstone；Wire clamp is set to the support construction in a manner of moving linearly along Z axis, and is configured to fixing line and rotates the line by rotary shaft of Z axis；And controller, by wire clamp control to decline the line between the pair of grindstone while rotating, and so that the spacing between the pair of grindstone is gradually become remote to decline with the line control of grinding stone transfer device.
Description
Technical field
The present invention relates to a kind of manufacturing device of probe and manufacturing methods, more specifically, are related to a kind of abrasive metal silk
Point manufacture the device and method of probe.
Background technique
Probe be widely used in inspection be formed in including liquid crystal display device (Liquid Crystal Display, LCD), etc.
The property of semiconductor element on the panel display apparatus or wafer of ion display panel (Plasma Display Panel, PDP)
Energy.Exploration card is used to make to fulfil the check device (Probe Station) of required function in the inspection of inspected body and is detected
Physical examination electrical connection comprising the set of the probe (Probe Pin) directly contacted with inspected body.With regard to simple item (bar) shape
For the linear type probe of state, the reproducibility of product is good when due to simple shape, thus being easy management precision, and making, separately
On the one hand, photoetch engineering or the easy production such as photoetching engineering or press-moulding die be can use, thus use scope is just gradually expanded.
Shrilly done tapered (tapering) in the end of probe.For probe, grown by providing wire
Degree cutting, and keep its tapered using etching or machining so that end gradually becomes thin and sharp completes.
As previous machining process, the end for making wire is used obliquely to contact the disc grinding stone of rotation
Surface or outer peripheral surface after rotation wire come the method processed.However, the problems of be, with the weldering of semiconductor chip
The distance between disk gradually shortens, and the thickness of probe is also elongated, thus is difficult with previous machining process.
Existing technical literature
Ebrean Registered Patent: 10-1073829,
Japanese Laid-Open Patent: 2006-234511.
Summary of the invention
Technical problem
The object of the present invention is to provide a kind of probe manufacturing methods for improving through previous machining process
The problem of new probe manufacturing method and device.It is further an object that providing a kind of process velocity than previous
The fast new probe manufacturing method and device of machining process.
Technical solution
To reach above-mentioned purpose, according to the present invention, a kind of probe manufacturing device is provided, the end of abrasive metal silk is made
Probe is made, the probe manufacturing device includes: support construction, with X-axis, Y-axis and Z-direction；A pair of of grindstone,
The mode mutually opposed using the outer peripheral surface as abradant surface configures, and is respectively provided with the rotary shaft parallel with Y-axis；Grinding stone transfer dress
It sets, is set to the support construction, and it is the pair of to adjust so that the pair of grindstone is moved linearly in parallel with X-axis
Spacing between grindstone；Wire clamp is set to the support construction in a manner of moving linearly along Z axis, and is configured to solid
Alignment simultaneously rotates the line by rotary shaft of Z axis；And controller, make the line in the same of rotation wire clamp control
When decline between the pair of grindstone, and by grinding stone transfer device control for the line decline, make the pair of
Spacing between grindstone gradually becomes remote.
In addition, the controller makes the control of the pair of grindstone in probe manufacturing device provided by the invention
The pair of grindstone rotates to grind the point of the line in same direction.
In addition, in probe manufacturing device provided by the invention, the controller is by the wire clamp and a pair of of grindstone control
It is made as making the ratio of the rotation speed of the rotation speed of the pair of grindstone and the wire clamp to become 1:1 to 15:1.
In addition, the wire clamp includes: ontology in probe manufacturing device provided by the invention, it has been axially formed hollow；
Supporting sleeve, is inserted into the hollow end of the ontology, and has the supporting surface parallel with the axial direction of the ontology；Folder
Bar is formed with is configured to press the line towards the supporting surface of the supporting sleeve to fix the projecting surface of the line at one end,
The boss extended towards the hollow center is formed in the other end, and the center portion thereof is connect with the ontology hinge；Main shaft,
In a manner of being located at the supporting sleeve top, be inserted in a manner of being able to carry out linear movement it is described hollow, and in institute
The mode that its lower end is locked to the boss when hollow inside moves linearly along the direction far from the supporting sleeve is stated to protrude；
And first elasticity provide mechanism, with the direction towards the main shaft far from the supporting sleeve to the main shaft apply elasticity
The mode of power is set to the ontology.
In addition, the wire clamp further includes cylinder-shaped guide sleeve, the guide sleeve in probe manufacturing device provided by the invention
Pipe be inserted into it is hollow between the supporting sleeve and the main shaft, and have line can by through hole.
In addition, the wire clamp further includes that the second elasticity provides mechanism, this second in probe manufacturing device provided by the invention
Elasticity provides outside of the mechanism between the outside of the ontology and the central part and boss of the clamping bar, towards the clamping bar
Boss close to the hollow center direction to the clamping bar apply elastic force so that the projecting surface is far from the support
Face.
In addition, first elasticity provides the elastic force that mechanism provides and is greater than in probe manufacturing device provided by the invention
Second elasticity provides the elastic force that mechanism provides, to make the projecting surface of the clamping bar relative to described when not applying external force
Supporting surface presses the line.
In addition, probe manufacturing device provided by the invention further includes driver, which is configured to be directed away from described
The direction of supporting sleeve presses the main shaft of the wire clamp.
In addition, being formed with disc guiding in the end of the supporting sleeve in probe manufacturing device provided by the invention
Portion, the guide part formed it is wired can by through hole.
In addition, according to the present invention, a kind of probe manufacturing method is provided, the end of abrasive metal silk manufactures probe, described
Probe manufacturing method includes: to be provided as the step for a pair of of grindstone that the mutually opposed mode of outer peripheral surface of abradant surface configures
Suddenly；The step of rotating the pair of grindstone in same direction；The step of rotating the wire；Make the wire of rotation
Point to the step of decline between a pair of of grindstone of rotation；And as the wire declines, increase described one
The step of to spacing between grindstone.
In addition, in probe manufacturing method provided by the invention, the rotation speed of the pair of grindstone and the metal
The ratio of the rotation speed of silk is 1:1 to 15:1.
The effect of invention
Probe manufacturing device of the invention and manufacturing method have following features, that is, the process velocity of probe is very fast.
Detailed description of the invention
Fig. 1 is the concept map of an embodiment of probe manufacturing device of the invention.
Fig. 2 is the concept map in the illustrated grindstone portion Fig. 1.
Fig. 3 is the partial sectional view of the illustrated wire clamp of Fig. 1.
Fig. 4 is the perspective view of Fig. 3 illustrated guide sleeve and supporting sleeve.
Specific embodiment
The embodiment of the present invention is described in detail with reference to the accompanying drawings.But the embodiment of the present invention can be become
Shape is various other forms, cannot be construed to the scope of the present invention and be limited by example detailed below.Implementation of the invention
Example is the general technical staff into this field more completely illustrates the present invention and provides.Therefore, in figure element shape etc.
It is exaggerated to emphasize clearer explanation, identical element is meant with the element that identical symbol indicates in figure.
Fig. 1 is the front elevation of an embodiment of probe manufacturing device of the invention.As illustrated in fig. 1, probe of the invention
One embodiment of manufacturing device includes support construction 60, the grindstone portion 10 for being set to support construction 60, wire clamp 20 and structure
As the wire clamp driving portion 30 for making wire clamp 20 rotate and move linearly.Support construction 60 have X-axis as shown in Figure 1, Y-axis and
Z-direction.
Fig. 2 is the plan view in the illustrated grindstone portion 10 Fig. 1.As illustrated in Figure 2, grindstone portion 10 includes a pair
Grindstone 11a, 11b and a pair of of grinding stone transfer device 13a, 13b.
A pair of of grindstone 11a, 11b are respectively provided with the rotary shaft parallel with the Y-axis of support construction 60.A pair of of grindstone
Rotary shaft 111a, 111b of 11a, 11b are separated from each other.A pair of of grindstone 11a, 11b are disc, and are formed in outer peripheral surface
Abradant surface 112a, 112b.Abradant surface 112a, 112b are set to a pair of of grindstone 11a, 11b in mutually opposed mode.It is a pair of
Grindstone 11a, 11b are respectively in connection in the center roller as the driving portion for high speed rotation grindstone 11a, 11b
12a、12b。
A pair of of grinding stone transfer device 13a, 13b are set to support construction 60.Distinguish in a pair of of grinding stone transfer device 13a, 13b
It is provided with the mandrel 12 connecting with grindstone 11.A pair of of grinding stone transfer device 13a, 13b play linear movement rotation mill respectively
Stone 11 adjusts the effect of the spacing between a pair of of grindstone 11a, 11b.A pair of of grinding stone transfer device 13a, 13b make a pair of of rotation
Go round and round a millstone stone 11a, 11b moves linearly with X-axis in parallel respectively.
Grinding stone transfer device 13 can be Linear actuator.It is linear that Linear actuator for example can diversely be configured to screw rod
Driver (Lead screw linear actuator), electromagnetic driver (Solenoid actuator), pneumatic cylinder
(Pneumatic cylinder), air pressure are without bar Linear actuator (Pneumatic rodless linear actuator), tooth
Gear mechanism (Rack and pinion mechanism) etc. is diversely constituted.
Fig. 3 is the partial sectional view of the illustrated wire clamp 20 of Fig. 1.
Wire clamp 20 plays the role of the fixed line w for being used in manufacture probe.The diameter for being used in the line of manufacture probe can be with
It is 20~500 μm or so.Line has defined elasticity, in order to avoid being broken off in pressurization, and is formed by conductive material.
For example, can be made by metal materials such as tungsten, rhenium tungsten, platinum, silver or palldium alloys.
The generally hollow cylindrical conformation of the ontology 27 of wire clamp 20.In hollow 21 lower end of wire clamp 20 inserted with having diameter
The columnar guide sleeve (Ferrule) of through hole 221 (referring to Fig. 4) than about 10 μm of the diameter of line or so, and in circle
The lower end of the guide sleeve 22 of tubular is configured with supporting sleeve 23.
Fig. 4 is the perspective view of Fig. 3 illustrated guide sleeve 22 and supporting sleeve 23.As illustrated in figure 4, supporting sleeve 23
Semicylindrical support portion 231 and columnar guide part 232 including the lower end in contact with guide sleeve 22.Support portion 231
It is integrally formed with guide part 232.Through hole 234 is formed in guide part 232.The section of the support portion 231 of supporting sleeve 23
Form is to make circle divided form amesialityly on the basis of diameter, and supporting surface 236 is made of straight line portion.Curve part
235 with the inner faces contact of wire clamp 20.Guide sleeve 22 and supporting sleeve 23 can be made by aluminium oxide or zirconium oxide.Supporting sleeve
23 methods that can be removed with a part of cutting guide sleeve 22 make.
Referring again to FIGS. 3, the end side in wire clamp 20 is provided with clamping bar 24, which has for relative to support
The projecting surface 241 of 236 pusher wire of supporting surface of the support portion 231 of casing 23.For clamping bar 24, central part 242 and wire clamp 20
Hinge connection, and can be that fulcrum carries out seesaw movement with central part 242.It is formed with projecting surface 241 in the lower end of clamping bar 24,
The boss 243 towards hollow 21 center protrusion is formed in upper end.
In addition, hollow 21 in wire clamp 20 are provided with main shaft 25.Main shaft 25 is formed in length direction whole or part
For accommodating the through hole 251 of line.To master in a manner of the boss 243 of upper end of the lower end 252 of main shaft 25 to be locked to clamping bar 24
It protrudes in the outside of axis 25.
In addition, being provided between the upper end of main shaft 25 253 and the upper end 271 of the ontology 27 of wire clamp 20 as the first elasticity
The helical spring of mechanism 26 is provided, which provides the direction application elasticity that mechanism 26 is provided towards the rising of main shaft 25
Power.The spiral shell of mechanism 28 is provided as the second elasticity in addition, being provided between the central part 242 of clamping bar 24 and the upper end of clamping bar 24
Spring is revolved, which provides mechanism 28 and apply elastic force to clamping bar 24, so that clamping bar 24 is towards the convex of the lower end of clamping bar 24
Appear 241 support portions 231 far from supporting sleeve 23 supporting surface 236 and clamping bar 24 upper end close to wire clamp 20 central part
Direction carries out seesaw movement.The helical spring is set as between the central part 242 and upper end of package clamping bar 24 and wire clamp 20
Outer peripheral surface.At this point, providing what mechanism 28 provided greater than the second elasticity since the first elasticity provides the elastic force that mechanism 26 provides
Elastic force, when not applying external force, the projecting surface 241 of clamping bar 24 presses simultaneously relative to the support portion 231 of supporting sleeve 23 always
Fixing line.In addition, providing mechanism 26 when main shaft 25 presses to lower section direction by external force by the first elasticity originally and being applied by main shaft 25
The elastic force for adding to clamping bar 24 is released from, and provides the elastic force that mechanism 28 provides, the projecting surface of clamping bar 24 by the second elasticity
It moves in direction along the supporting surface 236 of the support portion 231 far from supporting sleeve 23.Thus, it is possible to from 20 defiber of wire clamp.
When separating the line processed to the line before the supply processing of wire clamp 20 or from wire clamp 20, pass through external force direction downwards
Press main shaft 25.It is provided in support construction 60 or wire clamp 20 for providing the electromagnetic driver of the external force for pressing main shaft 25
(not shown).
With reference to Fig. 1, wire clamp 20 is driven by the wire clamp driving portion 30 for being set to support construction 60.
Wire clamp driving portion 30 makes wire clamp 20 move linearly along the Z axis of support construction 60, and revolves by rotary shaft of Z axis
Turn.
Wire clamp driving portion 30 includes the lifting device for being configured to go up and down wire clamp 20 along Z-direction.Lifting device can be with
It is configured to variform.For example, lifting device can be Z axis Linear actuator.Z axis Linear actuator can be by servo motor
(Servo Motor), screw rod (Lead Screw), ball nut (Ball Nut), balladeur train (Carriage) and rolling linear are led
Rail (LM guide) is constituted.
In addition, wire clamp driving portion 30 includes the Z axis rotating device for rotating wire clamp 20 using Z axis as rotary shaft.Z axis rotating device
It is combined side by side with wire clamp 20, and may include the motor for having the drive shaft parallel with Z axis, with flat with the drive shaft of motor
The pulley of capable rotary shaft and the transmission belt for being set to drive shaft and pulley.If the side of the upper end of wire clamp 20 is closely attached on
By the rotation of motor come the transmission belt of traveling, then wire clamp 20 rotates.It is slided it is of course also possible to be arranged in the upper end of wire clamp 20
Wheel, and transmission belt is set to the pulley of drive shaft and wire clamp 20 to rotate wire clamp 20.
The control of wire clamp 20 is made line while rotating between a pair of of grindstone 11a, 11b by controller (not shown)
Decline.In addition, by the control of grinding stone transfer device 13 to decline with line, make spacing between a pair of of grindstone 11a, 11b by
Gradual change is remote.Importantly, being to make a pair of of grindstone 11a, 11b in same direction by a pair of of grindstone 11a, 11b control
Rotation carrys out the point of abrasive wire.When a pair of of grindstone 11a, 11b are rotated along different directions from each other, appearance is asked as follows
Topic.That is, the problems of be that when left side, grindstone 11a is rotated in a clockwise direction, and right side grindstone 11b is along inverse
When clockwise rotates, wire falls off and discards.On the contrary, when grindstone 11a in left side is rotated in the counterclockwise direction, and right side
When grindstone 11b is rotated in a clockwise direction, the end of wire is ground, thus is unable to get desired shape.
In addition, wire clamp 20 and a pair of grindstone 11a, 11b control are to make a pair of of grindstone 11a, 11b by controller
The ratio of rotation speed and the rotation speed of wire clamp 20 is 1:1 to 15:1.For example, when wire clamp 20 is rotated with the revolving speed of 100rpm or so
When, preferably grindstone 11 is rotated with 100 to 1500rpm or so revolving speed.This is because if the rotation speed of grindstone 11
Ratio with the rotation speed of wire clamp 20 is more than the range, then grinding efficiency can decline.
Embodiments illustrated above merely illustrates the preferred embodiment of the present invention, and interest field of the invention is not limited to
Embodiment described, those skilled in the art can implement in the range of technical idea and claims of the invention
Numerous variations, deformation or displacement, and that embodiment be interpreted as it is within the scope of the present invention.
Claims (11)
1. a kind of probe manufacturing device, the end of abrasive metal silk manufactures probe, and the feature of the probe manufacturing device exists
In, comprising:
Support construction, with X-axis, Y-axis and Z-direction；
A pair of of grindstone, the mode mutually opposed using the outer peripheral surface as abradant surface configures, and is respectively provided with parallel with Y-axis
Rotary shaft；
Grinding stone transfer device is set to the support construction, and the pair of grindstone is made to move linearly in parallel with X-axis
To adjust the spacing between the pair of grindstone；
Wire clamp is set to the support construction in a manner of moving linearly along Z axis, and is configured to fixing line and with Z axis for rotation
Shaft rotates the line；And
Controller, by wire clamp control to decline the line between the pair of grindstone while rotating,
And the spacing between the pair of grindstone is set gradually to become remote to decline with the line control of grinding stone transfer device.
2. probe manufacturing device according to claim 1 characterized by comprising
The control of the pair of grindstone rotates the pair of grindstone in same direction to grind by the controller
Grind the point of the line.
3. probe manufacturing device according to claim 1, which is characterized in that
The wire clamp and a pair of of grindstone are controlled rotation speed and institute to make the pair of grindstone by the controller
The ratio for stating the rotation speed of wire clamp becomes 1:1 to 15:1.
4. probe manufacturing device according to claim 1, which is characterized in that
The wire clamp includes:
Ontology has been axially formed hollow；
Supporting sleeve, is inserted into the hollow end of the ontology, and has the supporting surface parallel with the axial direction of the ontology；
Clamping bar is formed with is configured to press the line towards the supporting surface of the supporting sleeve to fix the convex of the line at one end
It appears, the boss extended towards the hollow center is formed in the other end, and the center portion thereof is connect with the ontology hinge；
Main shaft is inserted in described in a manner of being able to carry out linear movement in a manner of being located at the supporting sleeve top
Sky, and with the hollow inside along far from the supporting sleeve direction move linearly when its lower end be locked to the boss
Mode protrude；And
First elasticity provides mechanism, applies elasticity to the main shaft with the direction towards the main shaft far from the supporting sleeve
The mode of power is set to the ontology.
5. probe manufacturing device according to claim 4, which is characterized in that
The wire clamp further includes cylinder-shaped guide sleeve, which is inserted between the supporting sleeve and the main shaft
It is hollow, and have line can by through hole.
6. probe manufacturing device according to claim 4, which is characterized in that
The wire clamp further includes that the second elasticity provides mechanism, which provides mechanism around the outside of the ontology and described
Outside between the central part and boss of clamping bar, towards the clamping bar boss close to the hollow center direction to described
Clamping bar applies elastic force, so that the projecting surface is far from the supporting surface.
7. probe manufacturing device according to claim 6, which is characterized in that
It is described first elasticity provide mechanism provide elastic force be greater than it is described second elasticity provide mechanism provide elastic force, with
The projecting surface of the clamping bar is set to press the line relative to the supporting surface when not applying external force.
8. probe manufacturing device according to claim 4, which is characterized in that
Further include driver, consists of and be directed away from the direction of the supporting sleeve and press the main shaft of the wire clamp.
9. probe manufacturing device according to claim 4, which is characterized in that
Be formed with disc guide part in the end of the supporting sleeve, the guide part formed it is wired can by perforation
Hole.
10. a kind of probe manufacturing method, the end of abrasive metal silk manufactures probe, and the feature of the probe manufacturing method exists
In, comprising:
The step of being provided as a pair of of grindstone that the mutually opposed mode of outer peripheral surface of abradant surface configures；
The step of rotating the pair of grindstone in same direction；
The step of rotating the wire；
Make the point of the wire of rotation to the step of decline between a pair of of grindstone of rotation；And
As the wire declines, the step of increasing the spacing between the pair of grindstone.
11. probe manufacturing method according to claim 10, which is characterized in that
The ratio of the rotation speed of the pair of grindstone and the rotation speed of the wire is 1:1 to 15:1.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160032379A KR101755281B1 (en) | 2016-03-17 | 2016-03-17 | Apparatus and Method for forming a probe pin |
| KR10-2016-0032379 | 2016-03-17 | ||
| PCT/KR2017/002829 WO2017160090A2 (en) | 2016-03-17 | 2017-03-16 | Device and method for manufacturing probe pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109073678A true CN109073678A (en) | 2018-12-21 |
| CN109073678B CN109073678B (en) | 2020-11-03 |
Family
ID=59427348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780022830.6A Active CN109073678B (en) | 2016-03-17 | 2017-03-16 | Probe manufacturing apparatus and manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101755281B1 (en) |
| CN (1) | CN109073678B (en) |
| TW (1) | TWI625530B (en) |
| WO (1) | WO2017160090A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110320390A (en) * | 2019-08-08 | 2019-10-11 | 郑州威科特电子科技有限公司 | A kind of pin protection type Test Diode clamping tooling |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101976997B1 (en) * | 2018-10-12 | 2019-05-10 | 주식회사 새한마이크로텍 | Apparatus and Method for forming a probe pin |
| TWI732612B (en) * | 2020-06-30 | 2021-07-01 | 財團法人金屬工業研究發展中心 | Method for processing probe |
| TWI752749B (en) * | 2020-12-07 | 2022-01-11 | 中華精測科技股份有限公司 | Method for improving grinding efficiency of micro probes of a vertical probe card |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11347930A (en) * | 1998-03-27 | 1999-12-21 | Shinko Kobelco Tool Kk | Correcting method for twisted groove forming and grinding process and twisted groove forming and grinding device |
| JP2000009750A (en) * | 1998-06-23 | 2000-01-14 | Micronics Japan Co Ltd | Tapering machine for probe needle |
| JP2005001027A (en) * | 2003-06-10 | 2005-01-06 | Kojo Seiko Kk | Probe needle grinding device |
| JP2007033150A (en) * | 2005-07-25 | 2007-02-08 | Olympus Corp | Manufacturing method of probe |
| CN2889608Y (en) * | 2006-04-18 | 2007-04-18 | 林正江 | Stone gyration surface polisher |
| TW200730297A (en) * | 2005-12-19 | 2007-08-16 | Tokyo Electron Ltd | Polishing method of probe and polishing member of the same |
| KR100764631B1 (en) * | 2006-04-13 | 2007-10-08 | (주)티에스이 | Rounding shape processing method for tip of probe |
| KR20090030426A (en) * | 2007-09-20 | 2009-03-25 | 세크론 주식회사 | Method of polishing probes of probe card |
| CN101405108A (en) * | 2006-03-28 | 2009-04-08 | 独立行政法人理化学研究所 | Device and method for ELID honing |
| CN201271825Y (en) * | 2008-10-10 | 2009-07-15 | 华映视讯（吴江）有限公司 | Probe grinding device |
| CN201287289Y (en) * | 2008-10-10 | 2009-08-12 | 华映视讯（吴江）有限公司 | Probe grinding device |
| CN101602183A (en) * | 2009-06-26 | 2009-12-16 | 北京航空航天大学 | A kind of lapping device and method thereof for preparing near-field optical probe |
| CN101659025A (en) * | 2008-08-25 | 2010-03-03 | 东京毅力科创株式会社 | Probe polishing method, program therefor, and probe apparatus |
| US20100285210A1 (en) * | 2009-05-08 | 2010-11-11 | University Of North Texas | Multifunctional micropipette biological sensor |
| CN201728570U (en) * | 2010-05-19 | 2011-02-02 | 上海依然半导体测试有限公司 | Probe grinding device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3144672B2 (en) * | 1997-01-22 | 2001-03-12 | 東京エレクトロン株式会社 | Probe apparatus and probe needle polishing method |
| US7195535B1 (en) * | 2004-07-22 | 2007-03-27 | Applied Materials, Inc. | Metrology for chemical mechanical polishing |
| JP2006234511A (en) * | 2005-02-23 | 2006-09-07 | Seiko Instruments Inc | Microprobe manufacturing method |
| JP6298674B2 (en) | 2014-03-24 | 2018-03-20 | 株式会社ディスコ | Cutting equipment |
-
2016
- 2016-03-17 KR KR1020160032379A patent/KR101755281B1/en active IP Right Grant
-
2017
- 2017-03-16 WO PCT/KR2017/002829 patent/WO2017160090A2/en active Application Filing
- 2017-03-16 CN CN201780022830.6A patent/CN109073678B/en active Active
- 2017-03-16 TW TW106108685A patent/TWI625530B/en active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11347930A (en) * | 1998-03-27 | 1999-12-21 | Shinko Kobelco Tool Kk | Correcting method for twisted groove forming and grinding process and twisted groove forming and grinding device |
| JP2000009750A (en) * | 1998-06-23 | 2000-01-14 | Micronics Japan Co Ltd | Tapering machine for probe needle |
| JP2005001027A (en) * | 2003-06-10 | 2005-01-06 | Kojo Seiko Kk | Probe needle grinding device |
| JP2007033150A (en) * | 2005-07-25 | 2007-02-08 | Olympus Corp | Manufacturing method of probe |
| TW200730297A (en) * | 2005-12-19 | 2007-08-16 | Tokyo Electron Ltd | Polishing method of probe and polishing member of the same |
| CN101405108A (en) * | 2006-03-28 | 2009-04-08 | 独立行政法人理化学研究所 | Device and method for ELID honing |
| KR100764631B1 (en) * | 2006-04-13 | 2007-10-08 | (주)티에스이 | Rounding shape processing method for tip of probe |
| CN2889608Y (en) * | 2006-04-18 | 2007-04-18 | 林正江 | Stone gyration surface polisher |
| KR20090030426A (en) * | 2007-09-20 | 2009-03-25 | 세크론 주식회사 | Method of polishing probes of probe card |
| CN101659025A (en) * | 2008-08-25 | 2010-03-03 | 东京毅力科创株式会社 | Probe polishing method, program therefor, and probe apparatus |
| CN201271825Y (en) * | 2008-10-10 | 2009-07-15 | 华映视讯（吴江）有限公司 | Probe grinding device |
| CN201287289Y (en) * | 2008-10-10 | 2009-08-12 | 华映视讯（吴江）有限公司 | Probe grinding device |
| US20100285210A1 (en) * | 2009-05-08 | 2010-11-11 | University Of North Texas | Multifunctional micropipette biological sensor |
| CN101602183A (en) * | 2009-06-26 | 2009-12-16 | 北京航空航天大学 | A kind of lapping device and method thereof for preparing near-field optical probe |
| CN201728570U (en) * | 2010-05-19 | 2011-02-02 | 上海依然半导体测试有限公司 | Probe grinding device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110320390A (en) * | 2019-08-08 | 2019-10-11 | 郑州威科特电子科技有限公司 | A kind of pin protection type Test Diode clamping tooling |
| CN110320390B (en) * | 2019-08-08 | 2021-12-10 | 深圳市研测科技有限公司 | Clamping tool for pin protection type diode test |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101755281B1 (en) | 2017-07-19 |
| TW201734470A (en) | 2017-10-01 |
| CN109073678B (en) | 2020-11-03 |
| TWI625530B (en) | 2018-06-01 |
| WO2017160090A2 (en) | 2017-09-21 |
| WO2017160090A3 (en) | 2018-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109073678A (en) | probe manufacturing device and manufacturing method | |
| KR101925122B1 (en) | Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof | |
| KR20170089866A (en) | Double-disc straight groove cylindrical-component surface grinding disc | |
| KR950004923B1 (en) | Method and tool of grinding | |
| JP2018506030A (en) | Method for manufacturing a contact probe for a test head | |
| CN1962189B (en) | Method for rolling circle | |
| JP5868693B2 (en) | Optical element manufacturing apparatus and manufacturing method | |
| CN107309767B (en) | Polishing device | |
| JP2013181925A (en) | Torsion test device | |
| CN105690238A (en) | Vertical type adjustable ultrasonic vibration honing device | |
| JP6286029B2 (en) | Lens centering method, lens processing method, and spherical core processing machine for spherical core processing machine | |
| JP4734612B2 (en) | Shaft machining mechanism, machining apparatus and grinding wheel employing this mechanism | |
| JP2017039177A (en) | Grinder and grinding method | |
| JP5852596B2 (en) | Grinding apparatus and grinding method | |
| CN106891242B (en) | Sphere grinding device | |
| CN104525756B (en) | Rolling closing device of bearing and processing method thereof | |
| CN206689909U (en) | A kind of body grinding device | |
| KR20160054120A (en) | Polishing device using magneto-rheological fluid | |
| CN202861923U (en) | Shaft central hole machining device | |
| JP6396767B2 (en) | Optical element processing apparatus, grindstone member, and optical element processing method | |
| JP6384241B2 (en) | Sphere polishing apparatus and sphere polishing method | |
| KR20200004885A (en) | Grinding Wheels And Grinding Machines | |
| JP5658861B2 (en) | Drilling device and drilling method | |
| RU172544U1 (en) | DEVICE FOR APPLICATION OF MULTI-LAYER ANTIFRICTION COATING OF PARTS | |
| CN104723187B (en) | The processing method of nut |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |