KR100554511B1 - Apparatus for aligning specimen and Apparatus for dimpling specimen of including thereof - Google Patents

Abstract

Disclosed are a specimen aligning apparatus and a sample damping apparatus including the same, which are applied to fabricate a transmission electron microscope analysis specimen. The specimen alignment device described above has a receiving portion for receiving a mount table that supports the mount to which the specimen is attached. And, it has a configuration including micro adjustment screws for moving the position of the mount table accommodated in the receiving portion in the X, Y axis direction of the upper surface of the mount table to align the polished position of the specimen. The device having such a configuration can improve the quality of the TEM analysis specimen that is polished and formed because the position of the mounting table can be precisely controlled without error during the dimpled process of the specimen.

Description

Specimen Alignment Apparatus and Specimen Dimpler Apparatus Comprising the Same {Apparatus for aligning specimen and Apparatus for dimpling specimen of including conjugate}

1 is a view for explaining the dimple process.

2 is a view for explaining the cross-sectional shape of the specimen formed by the dampling process.

3 is a perspective view showing a specimen alignment device according to the present invention.

4 is a cross-sectional view illustrating a specimen aligning device for aligning a position of a mounting table for aligning a specimen.

FIG. 5 is a top view illustrating a specimen alignment device for aligning a position of a mount table for aligning specimens. FIG.

FIG. 6 is a schematic diagram illustrating a test piece damping apparatus including a test piece alignment device according to an embodiment of the present invention.

7 is a process flowchart showing a method for preparing a specimen for TEM analysis according to an embodiment of the present invention.

8a and 8b are photographs showing the polished state of the specimen for TEM analysis during the dimple process.

Explanation of symbols on the main parts of the drawings

S: Psalm 100: Mount

110: mount table 120: accommodating part

130: through hole 125: screw hole

140: micro adjustment screw 150: specimen alignment device

160: rotating plate 165: rough grinding wheel

170: fine grinding wheel 180: polishing member

190: storage container 192: piping

194: nozzle 196: valve

200: column

The present invention relates to an apparatus applied to fabricate analytical specimens for analyzing a specific portion of a semiconductor substrate, and more particularly, to align specimens in the dimple process of analytical specimens of the transmission electron microscope. A test piece dimple device for grinding a device and the aligned test piece to a certain thickness.

 Recently, semiconductor devices and device materials are rapidly becoming highly integrated and miniaturized for high functionality and high capacity, and thus, the importance of analytical equipment and technology capable of structural and chemical analysis of finer regions is increasing. Among various methods, the analysis technique using Transmission Electron Microscopy (TEM) has received great attention as one of the best technologies in terms of resolution function and application.

Although the analysis technique using the transmission electron microscope as described above provides a lot of information, in order to obtain an analysis result for the desired purpose, the optimum specimen should be prepared, and the success of the production of the specimen and analysis results. Therefore, the manufacturing method of the specimen of a transmission electron microscope is emphasized more.

Until now, ion milling methods and methods using focusing ion beams have been generally used as a method for fabricating planar specimens for transmission electron microscopic analysis of semiconductor substrate specimens such as silicon wafers.

The ion milling method is widely used for fabrication of specimens for single-sided transmission electron microscopy or planar transmission electron microscopy for observing the structure of a multilayer film or a fine pattern formed on a semiconductor substrate or the interfacial structure between the multilayer films. The method using the focusing ion beam is mainly used when the cross section of a specific region is to be observed.

As an example of a method for manufacturing the analytical specimen as described above, US Pat. No. 5,935,870 (issued to Lee) discloses a method for preparing an analytical specimen for transmission electron microscopy using an ion milling method. TEM specimens are manufactured to a diameter of 3 mm and a thickness of 100 μm or less through a cutting process, punching process, grinding process, and dimple process. After being clamped by the specimen holding device, it is finally manufactured by an ion milling device to enable transmission electron microscopic analysis.

The specimen fabrication process as described above is similarly applied to a planar specimen. 1 is a view for explaining the dimpled process, Figure 2 is a view for explaining the cross-sectional shape of the specimen formed by the dimpled process.

Referring to FIGS. 1 and 2, the mount 10 on which the specimen S is mounted on the rotating mount table 20 is mounted, and the center portion of the specimen S is positioned by using the dimpled pad 30. Process it concave. The analysis point of the specimen (S) to be analyzed by this dimple process is processed to a thickness of 5㎛ or less, the analysis region (L1) of the specimen is formed to a width of about 20㎛.

The dimpling process is one of the most important processes that directly affect the quality of specimens for TEM analysis. However, the analysis region (L1) of the specimen is limited to a width of about 20㎛, and the position of the mounting table on which the specimen is placed must be directly controlled by the operator's hand so that the analysis region of the specimen is accurately polished by the dimpled pad. For this reason, a high degree of skill of the operator is required.

In addition, the efficiency of the operation is reduced because the time for realigning the position of the specimen is increased every time the state of the specimen to be polished to grasp the specimen more precisely. In addition, the TEM analysis becomes impossible when the positional change of the specimen due to the operator's mistake occurs and the accurate dampling process is not performed.

Accordingly, a first object of the present invention for solving the above problems is to provide a specimen alignment device for more precisely aligning the specimen during the dimple process of the specimen for TEM analysis.

It is a second object of the present invention to provide a specimen dampling apparatus for more precisely polishing a specimen using the specimen alignment device.

Specimen alignment device of the present invention for achieving the first object as described above,

An accommodating portion accommodating the mounting table on which the specimen is supported, and a mounting table accommodated to the outer surface of the mounting table through the side wall of the accommodating portion, and aligned in the accommodating portion to align the polished position of the specimen. Micro adjustment screws for moving the position in the X, Y axis direction of the upper surface of the mount table.

In addition, the specimen polishing device of the present invention for achieving the second object as described above,

A specimen polishing member for dimpleting a predetermined region of the specimen; An accommodating portion accommodating the mounting table on which the specimen is supported, and a mounting table accommodated to the outer surface of the mounting table through the side wall of the accommodating portion, and aligned in the accommodating portion to align the polishing position of the specimen. A slurry for providing a slurry between the specimen alignment means including micro adjustment screws for moving the position in the X and Y axis directions of the upper surface of the mount table and the specimen in which the specimen and the specimen polishing member are aligned by the specimen alignment means. It includes a providing unit.

Therefore, the specimen alignment apparatus including the above configuration can precisely control the position of the mounting table without error during the polishing process of the specimen for forming the specimen for TEM analysis, thereby further improving the quality of the specimen for TEM analysis. You can.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a perspective view showing a specimen alignment device according to the present invention, Figure 4 is a cross-sectional view showing a specimen alignment device for aligning the position of the mounting table to align the specimen, Figure 5 is to align the specimen Top view showing a specimen alignment device for aligning the position of the mounting table.

3 to 5, the specimen alignment device 150 polishes the specimen S processed in a predetermined shape to observe the structure and defects of the pattern included in the specimen by using a transmission electron microscope. In the case of Dimpling, the mounting table 110 adjusts the position of the mount table 110 on which the specimen 100 to which the specimen is attached is supported. In addition, it includes a receiving portion 120 for accommodating the mounting table 110, micro adjustment screws 140 for adjusting the position of the mounting table 110 accommodated in the receiving portion.

The receiving part 120 has a shape corresponding to the outer surface of the mount table 110 so that the mounting table 110 supporting the mount 100 to which the specimen is attached can be accommodated. In addition, the receiving part 120 directly aligns the alignment state of the mount table 110 inserted into the receiving part 120 when performing a process of grinding the specimen S attached to the mount 100 to have a predetermined thickness. It is made of a light transmissive material so that it can be observed. The light transmissive material is any one selected from acrylic or epoxy resin.

More specifically, the receiving portion 120 has a cylindrical shape in which the mounting table 110 can be accommodated, and on the outer surface of the receiving portion 120 the mounting table 110 accommodated in the receiving portion is X-axis Y Micro adjustment screws 140 to move in the axial direction is provided.

The micro adjustment screw 140 is coupled to at least two screw holes 125 formed on the side wall of the receiving portion 120, in the present invention, four screw holes 125 and four micro adjustment screws 140 Has The micro screw thread is formed on the inner surface of the screw hole 125 so that the micro adjusting screws 140 coupled to the screw holes 125 may control the position of the mounting table 110 more precisely in the X and Y axis directions. Can be.

Here, the mount 100 has a cylindrical shape, and the polishing state of the specimen is mounted on the mount 100 when a process of dripping a predetermined portion of the specimen S attached to the mount upper surface to have a predetermined thickness is performed. Made of a light-transmissive material that can be observed directly. In addition, the mount table 110 has a circular plate shape, serves to fix and support the mount 100 to which the specimen is attached, and is located on the upper surface of the rotating plate of the specimen polishing apparatus.

FIG. 6 is a schematic diagram illustrating a test piece damping apparatus including a test piece alignment device according to an embodiment of the present invention.

Referring to FIG. 6, the specimen dimpled device includes a rotating plate 160 supporting the mount table 110 fixed by the specimen alignment device 150, and a column located in a direction perpendicular to the specimen alignment device 150. 200 is provided. One end of the column 200 is provided with an abrasive member 180 on which the coarse polishing wheel 165 and the fine polishing wheel 170 are mounted so as to be positioned above the specimen (S). The abrasive member 180 is connected to the column 200 to allow the coarse polishing wheel 165 and the fine polishing wheel 170 to rotate and move up, down, left, and right.

Although not shown, a pneumatic cylinder and a motor are built in the column 200 to allow the polishing member 180 to rotate and to be driven up, down, left, and right, and one side of the column 200 may have a specimen (S). Slurry provision unit is provided for providing a slurry between the specimen (S) and the rough polishing wheel 165 during the dampling process. The slurry providing part includes a storage container 190 for storing the slurry, a pipe 192 for providing a slurry of the slurry storage container onto a specimen, and a nozzle 194 at an end of the pipe. In addition, the pipe 192 is provided with a valve 196 for adjusting the flow rate of the slurry provided.

Since the description of the specimen alignment device 150 has been described in detail with reference to FIGS. 3 to 5, it will be omitted in order to avoid duplication.

In addition, the specimen dimpled device is a sensor (not shown) for detecting the height of the coarse polishing wheel 165 and the fine polishing wheel 170 and the degree of vertical drive of the polishing member 180 by the sensor It may further include a controller (not shown). This is to adjust the height of the rough polishing wheel 165 and the fine polishing wheel 170, to prevent damage of the specimen (S) that can occur during the dimpled process, and to more accurately polish the thickness of the specimen to be formed .

As described above, when the mounting table 110 on which the specimen S is supported by the specimen aligning device 150 is aligned on the rotating plate 160 of the specimen dampling device, the abrasive table 165 includes a coarse abrasive wheel 165. As the polishing member 180 rotates toward the specimen and the slurry is provided from the nozzle 194 of the lower portion and the slurry provider, the upper surface of the specimen S is polished to the coarse polishing wheel 165 in an auxiliary shape. At this time, the abrasive polishing wheel 165 is attached to the abrasive cloth, the abrasive cloth is attached to the abrasive particles having a predetermined size. When the rough polishing process by the rough polishing wheel 165 is finished, the rotation of the rough polishing wheel 165 is stopped, and the polishing member 180 is raised. Subsequently, the fine polishing wheel 170 is positioned on the specimen S by the left and right movement of the polishing member 180, and the polishing member 180 moves the specimen S together with the rotation of the fine polishing wheel 170. Descend toward. As the polishing member descends, the specimen is finely polished by the fine polishing wheel 170. At this time, the slurry is not provided, and the surface of the specimen S is polished by friction with the rubbing cloth to which the rubbing cloth is attached to the fine polishing wheel 170.

7 is a process flowchart showing a method for preparing a specimen for TEM analysis according to an embodiment of the present invention.

In the method of forming a specimen for TEM analysis as shown in FIG. 7, first, two cutting specimens having a predetermined size and four dummy wafers are formed by performing a cutting process (S100).

Specifically, after preparing a semiconductor substrate on which the patterns to be analyzed are formed, an analysis point of the pattern to be analyzed is confirmed by observing a cross section of the patterns formed on the semiconductor substrate using an electron microscope. Subsequently, the semiconductor substrate is cut to a size of about 4 mm × 5 mm to include an analysis point to be analyzed on the semiconductor substrate to form two specimens. Subsequently, after preparing separate wafers, the wafers are cut to have the same area as the specimen to form four dummy wafers.

Subsequently, a bonding process is performed to form a multilayer specimen in which the specimen and the dummy wafer overlap each other (S200).

Specifically, the two specimens are disposed to face each other, and then bonded first, and then each of the dummy wafers is arranged on both sides thereof, and then bonded to each other using G1-epoxy resin. Subsequently, the bonded specimen and the dummy wafer are compressed using a specimen compression device so that the G1-epoxy resin spreads thinly and widely on the specimen and the dummy wafer, and then heated to about 145 ° C to form a multilayer specimen.

Subsequently, a slicing process is performed to form a multilayer specimen in which the specimen and the dummy wafer overlap with the slicing specimen (S300). Here, the slicing specimen is formed by cutting a multilayer specimen having a thickness of about 0.5 to 1 mm by overlapping the specimen and the dummy wafer using a diamond cutter.

Subsequently, the punched process (punching process) is performed to form a sliced specimen into a disk-shaped specimen having a diameter of 3mm (S400).

Subsequently, by grinding and polishing both sides of the disc-shaped specimen using a grinder or polisher, a first preliminary specimen having a final thickness of 70 μm is formed (S500).

Subsequently, a dimple process is performed to form a second preliminary specimen having a thickness of 5 μm at the center of the first preliminary specimen (S600).

Specifically, first, the first preliminary specimen formed by performing the grinding process is attached to the upper surface of the transparent mount. Subsequently, a dimpler, a bronze wheel, is aligned so that it is located at the center of the upper surface of the first preliminary specimen. The specimen is then rough polished until an orange light is visible as shown in FIG. 8A. Subsequently, if an orange light is seen, the fine grinding wheel is replaced with a fine wheel, and the replaced fine grinding wheel is aligned so that the replaced fine grinding wheel is located at the center of the upper surface of the first preliminary specimen. Subsequently, the first preliminary specimen is finely polished until a yellow light is visible from the center as shown in FIG. 8B, thereby forming a second preliminary specimen having a thickness of 5 μm.

Subsequently, an ion milling process is performed to sputter both surfaces of the second preliminary specimen, thereby forming a specimen for TEM analysis in which holes are formed in the center of the specimen corresponding to the interface (S700, S800).

The TEM analysis specimen prepared by the above process is fixed to the specimen holding device, and then placed on the specimen support of the transmission electron microscope and analyzed by observing the periphery of the hole of the TEM analysis specimen, thereby facilitating the profile of the region to be analyzed. Can be analyzed.

The specimen alignment device of the present invention as described above is provided in the receiving portion for receiving a mount table for supporting the mount to which the specimen is attached, and to penetrate the side wall of the receiving portion, in order to align the polished position of the specimen. Micro adjustment screws for moving the position of the mount table accommodated in the accommodation portion in the X, Y axis direction of the upper surface of the mount table. As a result, the position of the mounting table supporting the specimen can be more precisely controlled so that the specimen polishing member can be accurately positioned at the center of the upper surface of the specimen.

In addition, by precisely controlling the position of the mounting table without errors regardless of the skill of the operator during the dimple process, it is possible to form a specimen for excellent quality TEM analysis.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (6)

A mount to which a specimen is attached, the mount being made of a light transmissive material to observe the thickness of the specimen being polished during the polishing process of the specimen; A receptacle disposed on the rotating plate for supporting and rotating the mount table supporting the mount, the receiving portion receiving the mount table such that the mount table is supported on the rotating plate; And Penetrates through the side wall of the receiving portion and adheres to the outer surface of the mounting table, and moves the position of the mounting table accommodated in the receiving portion in the X and Y-axis directions of the upper surface of the mounting table to align the polished position of the specimen. Specimen alignment device comprising micro adjustment screws. delete The specimen alignment device of claim 1, wherein the micro adjustment screws are positioned to face each other in the X and Y axis directions. delete A specimen polishing member for dimpleting a predetermined region of the specimen; A position for receiving the mount table on which the specimen is supported, and a position of the mount table accommodated to the outer surface of the mount table through the side wall of the accommodation portion, and accommodated in the accommodation portion to align the polished position of the specimen; Specimen alignment means including micro adjustment screws to move the X and Y axis directions of the upper surface of the mount table; And And a slurry providing part for providing a slurry between the specimen and the specimen polishing member aligned by the specimen alignment means. The method of claim 5, wherein the specimen polishing member, A coarse polishing wheel to which an abrasive cloth is attached and which can be rotated; A fine polishing wheel to which a rubbing cloth is attached and which can be rotated; And The rough grinding wheel and the fine grinding wheel are installed to face each other, the specimen dimpled, characterized in that it comprises a body in which the rough grinding wheel and the fine grinding wheel to sequentially contact the surface of the specimen by rotation and vertical drive Device.

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