TWI624368B - Insulating resin sheet - Google Patents

Insulating resin sheet Download PDF

Info

Publication number
TWI624368B
TWI624368B TW102121948A TW102121948A TWI624368B TW I624368 B TWI624368 B TW I624368B TW 102121948 A TW102121948 A TW 102121948A TW 102121948 A TW102121948 A TW 102121948A TW I624368 B TWI624368 B TW I624368B
Authority
TW
Taiwan
Prior art keywords
layer
resin sheet
insulating
insulating resin
epoxy resin
Prior art date
Application number
TW102121948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201414607A (zh
Inventor
中村茂雄
奈良橋弘久
Original Assignee
味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 味之素股份有限公司 filed Critical 味之素股份有限公司
Publication of TW201414607A publication Critical patent/TW201414607A/zh
Application granted granted Critical
Publication of TWI624368B publication Critical patent/TWI624368B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW102121948A 2012-07-06 2013-06-20 Insulating resin sheet TWI624368B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012152191A JP6044139B2 (ja) 2012-07-06 2012-07-06 絶縁樹脂シート

Publications (2)

Publication Number Publication Date
TW201414607A TW201414607A (zh) 2014-04-16
TWI624368B true TWI624368B (zh) 2018-05-21

Family

ID=50111767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102121948A TWI624368B (zh) 2012-07-06 2013-06-20 Insulating resin sheet

Country Status (3)

Country Link
JP (1) JP6044139B2 (ko)
KR (1) KR102000921B1 (ko)
TW (1) TWI624368B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6969099B2 (ja) 2015-01-21 2021-11-24 味の素株式会社 樹脂シートの製造方法
JP6582807B2 (ja) 2015-09-25 2019-10-02 味の素株式会社 樹脂シートの製造方法
JP6668712B2 (ja) 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP6728760B2 (ja) 2016-02-25 2020-07-22 味の素株式会社 支持体付き樹脂シート
JP6834144B2 (ja) 2016-02-29 2021-02-24 味の素株式会社 支持体付き樹脂シート
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP7024174B2 (ja) * 2016-08-26 2022-02-24 味の素株式会社 樹脂組成物
KR20190132987A (ko) * 2017-03-31 2019-11-29 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186725A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
TW200840839A (en) * 2007-01-23 2008-10-16 Ajinomoto Kk Process for production of multilayer printed wiring boards
TW200934348A (en) * 2007-11-22 2009-08-01 Ajinomoto Kk Process for producing multilayered printed wiring board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630193B2 (ja) * 1993-02-05 1997-07-16 東亞合成株式会社 プリント配線板用銅張絶縁シート
JP3724468B2 (ja) * 1995-04-28 2005-12-07 日本ビクター株式会社 多層印刷配線板
JP4273837B2 (ja) * 2003-05-27 2009-06-03 パナソニック電工株式会社 金属箔付き絶縁シート、多層配線板、及び多層配線板の製造方法
JP2007091799A (ja) * 2005-09-27 2007-04-12 Kaneka Corp 熱硬化性樹脂組成物、及びその利用
JP4888147B2 (ja) * 2007-02-13 2012-02-29 住友ベークライト株式会社 樹脂組成物、フィルム付きまたは金属箔付き絶縁樹脂シート、多層プリント配線板、多層プリント配線板の製造方法および半導体装置
JP5125183B2 (ja) * 2007-03-30 2013-01-23 宇部興産株式会社 ビルドアップ多層配線基板の製造法
KR20080090835A (ko) 2007-04-06 2008-10-09 이준혁 광케이블 고정구
JP2010028036A (ja) 2008-07-24 2010-02-04 Ajinomoto Co Inc 多層プリント配線板の製造方法
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5564405B2 (ja) * 2010-11-04 2014-07-30 株式会社カネカ ボンディングシート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186725A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
TW200840839A (en) * 2007-01-23 2008-10-16 Ajinomoto Kk Process for production of multilayer printed wiring boards
TW200934348A (en) * 2007-11-22 2009-08-01 Ajinomoto Kk Process for producing multilayered printed wiring board

Also Published As

Publication number Publication date
KR20140005783A (ko) 2014-01-15
JP6044139B2 (ja) 2016-12-14
JP2014017301A (ja) 2014-01-30
KR102000921B1 (ko) 2019-07-17
TW201414607A (zh) 2014-04-16

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