TWI621163B - 第ｉｉｉ族氮化物晶圓及其製造方法 - Google Patents
第ｉｉｉ族氮化物晶圓及其製造方法 Download PDFInfo
- Publication number
- TWI621163B TWI621163B TW102130676A TW102130676A TWI621163B TW I621163 B TWI621163 B TW I621163B TW 102130676 A TW102130676 A TW 102130676A TW 102130676 A TW102130676 A TW 102130676A TW I621163 B TWI621163 B TW I621163B
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- Prior art keywords
- wafer
- group iii
- iii nitride
- layer
- gan
- Prior art date
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000013078 crystal Substances 0.000 claims abstract description 48
- 238000010297 mechanical methods and process Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 52
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 34
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 23
- 229910021529 ammonia Inorganic materials 0.000 claims description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 238000003486 chemical etching Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 230000007547 defect Effects 0.000 claims description 4
- 235000015097 nutrients Nutrition 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 86
- 239000000956 alloy Substances 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 229910002601 GaN Inorganic materials 0.000 description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005136 cathodoluminescence Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/852—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs being Group III-V materials comprising three or more elements, e.g. AlGaN or InAsSbP
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/10—Etching in solutions or melts
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
- C30B7/105—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes using ammonia as solvent, i.e. ammonothermal processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261694119P | 2012-08-28 | 2012-08-28 | |
| US61/694,119 | 2012-08-28 | ||
| US13/835,636 US8921231B2 (en) | 2006-04-07 | 2013-03-15 | Group III nitride wafer and its production method |
| US13/834,871 US9543393B2 (en) | 2006-04-07 | 2013-03-15 | Group III nitride wafer and its production method |
| US13/834,871 | 2013-03-15 | ||
| US13/835,636 | 2013-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201413807A TW201413807A (zh) | 2014-04-01 |
| TWI621163B true TWI621163B (zh) | 2018-04-11 |
Family
ID=48050922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102130676A TWI621163B (zh) | 2012-08-28 | 2013-08-27 | 第ｉｉｉ族氮化物晶圓及其製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9543393B2 (enExample) |
| EP (1) | EP2890537A1 (enExample) |
| JP (1) | JP6144347B2 (enExample) |
| KR (1) | KR101895035B1 (enExample) |
| CN (1) | CN104781057B (enExample) |
| IN (1) | IN2015DN02030A (enExample) |
| TW (1) | TWI621163B (enExample) |
| WO (1) | WO2014035481A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150337457A1 (en) * | 2006-04-07 | 2015-11-26 | Sixpoint Materials, Inc. | Group iii nitride bulk crystals and their fabrication method |
| US9518340B2 (en) | 2006-04-07 | 2016-12-13 | Sixpoint Materials, Inc. | Method of growing group III nitride crystals |
| IN2015DN02030A (enExample) | 2012-08-28 | 2015-08-14 | Sixpoint Materials Inc | |
| KR102096421B1 (ko) | 2012-09-25 | 2020-04-02 | 식스포인트 머터리얼즈 인코퍼레이티드 | Iii 족 질화물 결정의 성장 방법 |
| JP6140291B2 (ja) | 2012-09-26 | 2017-05-31 | シックスポイント マテリアルズ， インコーポレイテッド | Ｉｉｉ族窒化物ウエハおよび製作方法および試験方法 |
| JP6477501B2 (ja) | 2014-01-17 | 2019-03-06 | 三菱ケミカル株式会社 | ＧａＮ基板、ＧａＮ基板の製造方法、ＧａＮ結晶の製造方法および半導体デバイスの製造方法 |
| JP6292080B2 (ja) * | 2014-08-21 | 2018-03-14 | 三菱ケミカル株式会社 | 非極性または半極性ＧａＮ基板 |
| US10355115B2 (en) | 2016-12-23 | 2019-07-16 | Sixpoint Materials, Inc. | Electronic device using group III nitride semiconductor and its fabrication method |
| CN106783579B (zh) * | 2016-12-29 | 2019-12-13 | 苏州纳维科技有限公司 | Iii族氮化物衬底及其制备方法 |
| WO2019066787A1 (en) | 2017-09-26 | 2019-04-04 | Sixpoint Materials, Inc. | CRYSTALLINE GERM FOR THE GROWTH OF A SOLID GALLIUM NITRIDE CRYSTAL IN SUPERCRITICAL AMMONIA AND METHOD OF MANUFACTURE |
| CN108074834A (zh) * | 2018-01-08 | 2018-05-25 | 中国电子科技集团公司第四十六研究所 | 一种用于具有极性的异形晶片的极性面判定方法 |
| KR102126186B1 (ko) * | 2018-06-27 | 2020-06-24 | 경희대학교 산학협력단 | 질화 갈륨 기판의 제조 방법 |
| TWI836391B (zh) * | 2022-03-29 | 2024-03-21 | 兆遠科技股份有限公司 | 脆軟基板及脆軟基板製作方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI226391B (en) * | 2001-06-08 | 2005-01-11 | Cree Inc | High surface quality GaN wafer and method of fabricating same |
| TW201002879A (en) * | 2008-06-04 | 2010-01-16 | Sixpoint Materials Inc | Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth |
| TW201002880A (en) * | 2008-06-04 | 2010-01-16 | Sixpoint Materials Inc | High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5984998A (en) | 1997-11-14 | 1999-11-16 | American Iron And Steel Institute | Method and apparatus for off-gas composition sensing |
| CN1446142A (zh) * | 2000-08-07 | 2003-10-01 | Memc电子材料有限公司 | 用双面抛光加工半导体晶片的方法 |
| US7072034B2 (en) * | 2001-06-08 | 2006-07-04 | Kla-Tencor Corporation | Systems and methods for inspection of specimen surfaces |
| HUP0401866A3 (en) | 2001-06-06 | 2005-12-28 | Nichia Corp | Process and apparatus for obtaining bulk monocrystalline gallium-containing nitride |
| AU2002347692C1 (en) | 2001-10-26 | 2008-03-06 | Ammono Sp. Zo.O. | Bulk monocrystalline gallium nitride |
| US7638346B2 (en) | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
| US7022992B2 (en) | 2002-01-17 | 2006-04-04 | American Air Liquide, Inc. | Method and apparatus for real-time monitoring of furnace flue gases |
| PL224993B1 (pl) | 2002-12-11 | 2017-02-28 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Sposób otrzymywania objętościowego monokrystalicznego azotku zawierającego gal |
| US7098487B2 (en) | 2002-12-27 | 2006-08-29 | General Electric Company | Gallium nitride crystal and method of making same |
| US7323256B2 (en) * | 2003-11-13 | 2008-01-29 | Cree, Inc. | Large area, uniformly low dislocation density GaN substrate and process for making the same |
| KR100541111B1 (ko) | 2004-06-25 | 2006-01-11 | 삼성전기주식회사 | 다파장 반도체 레이저 제조방법 |
| DE102004039076A1 (de) | 2004-08-12 | 2006-02-23 | Sms Demag Ag | Berührungslose Abgasmessung mittels FTIR-Spektroskopie an metallurgischen Aggregaten |
| US20060124956A1 (en) | 2004-12-13 | 2006-06-15 | Hui Peng | Quasi group III-nitride substrates and methods of mass production of the same |
| JP4849296B2 (ja) | 2005-04-11 | 2012-01-11 | 日立電線株式会社 | ＧａＮ基板 |
| JP4792802B2 (ja) * | 2005-04-26 | 2011-10-12 | 住友電気工業株式会社 | Ｉｉｉ族窒化物結晶の表面処理方法 |
| JP5010597B2 (ja) | 2005-07-08 | 2012-08-29 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 耐圧釜を用いた超臨界アンモニア中でのｉｉｉ族窒化物結晶の成長方法 |
| JP4696886B2 (ja) * | 2005-12-08 | 2011-06-08 | 日立電線株式会社 | 自立した窒化ガリウム単結晶基板の製造方法、および窒化物半導体素子の製造方法 |
| US8435879B2 (en) | 2005-12-12 | 2013-05-07 | Kyma Technologies, Inc. | Method for making group III nitride articles |
| JP4803717B2 (ja) | 2005-12-13 | 2011-10-26 | 株式会社タカトリ | ワイヤソー |
| US7878883B2 (en) * | 2006-01-26 | 2011-02-01 | Memc Electronics Materials, Inc. | Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control |
| JP4930081B2 (ja) * | 2006-04-03 | 2012-05-09 | 住友電気工業株式会社 | ＧａＮ結晶基板 |
| WO2007117689A2 (en) | 2006-04-07 | 2007-10-18 | The Regents Of The University Of California | Growing large surface area gallium nitride crystals |
| US9518340B2 (en) | 2006-04-07 | 2016-12-13 | Sixpoint Materials, Inc. | Method of growing group III nitride crystals |
| WO2007125914A1 (ja) * | 2006-04-28 | 2007-11-08 | Sumitomo Electric Industries, Ltd. | 窒化ガリウム結晶を作製する方法および窒化ガリウムウエハ |
| JP5332168B2 (ja) * | 2006-11-17 | 2013-11-06 | 住友電気工業株式会社 | Ｉｉｉ族窒化物結晶の製造方法 |
| US8323406B2 (en) | 2007-01-17 | 2012-12-04 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| CN100592539C (zh) | 2007-09-12 | 2010-02-24 | 泰谷光电科技股份有限公司 | 发光二极管元件的制造方法 |
| JP4395812B2 (ja) * | 2008-02-27 | 2010-01-13 | 住友電気工業株式会社 | 窒化物半導体ウエハ−加工方法 |
| EP2286007B1 (en) | 2008-06-12 | 2018-04-04 | SixPoint Materials, Inc. | Method for testing gallium nitride wafers and method for producing gallium nitride wafers |
| WO2009154788A2 (en) | 2008-06-20 | 2009-12-23 | Ineos Usa Llc | Methods for sequestering carbon dioxide into alcohols via gasification fermentation |
| US20120000415A1 (en) | 2010-06-18 | 2012-01-05 | Soraa, Inc. | Large Area Nitride Crystal and Method for Making It |
| JP5475772B2 (ja) | 2008-07-11 | 2014-04-16 | サンーゴバン アブレイシブズ，インコーポレイティド | ワイヤスライシングシステム |
| PL394857A1 (pl) | 2008-08-07 | 2011-09-26 | Sorra, Inc. | Sposób amonotermalnego wytwarzania kryształów ciągnionych azotku galu na dużą skalę |
| US8979999B2 (en) | 2008-08-07 | 2015-03-17 | Soraa, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| US8148801B2 (en) * | 2008-08-25 | 2012-04-03 | Soraa, Inc. | Nitride crystal with removable surface layer and methods of manufacture |
| US8680581B2 (en) * | 2008-12-26 | 2014-03-25 | Toyoda Gosei Co., Ltd. | Method for producing group III nitride semiconductor and template substrate |
| WO2010088046A1 (en) | 2009-01-30 | 2010-08-05 | Bp Corporation North America Inc. | Seed layers and process of manufacturing seed layers |
| WO2010113237A1 (ja) | 2009-04-03 | 2010-10-07 | パナソニック株式会社 | 窒化物系半導体素子およびその製造方法 |
| JP2011100860A (ja) * | 2009-11-06 | 2011-05-19 | Sumitomo Electric Ind Ltd | イオン注入ｉｉｉ族窒化物半導体基板ならびにｉｉｉ族窒化物半導体層接合基板およびｉｉｉ族窒化物半導体デバイスの製造方法 |
| JP5471387B2 (ja) * | 2009-12-09 | 2014-04-16 | 三菱化学株式会社 | Ｉｉｉ族窒化物結晶半導体基板の製造方法、及びｉｉｉ族窒化物結晶半導体基板 |
| JP5757068B2 (ja) | 2010-08-02 | 2015-07-29 | 住友電気工業株式会社 | ＧａＮ結晶の成長方法 |
| IN2015DN02030A (enExample) | 2012-08-28 | 2015-08-14 | Sixpoint Materials Inc | |
| KR102096421B1 (ko) | 2012-09-25 | 2020-04-02 | 식스포인트 머터리얼즈 인코퍼레이티드 | Iii 족 질화물 결정의 성장 방법 |
| JP6140291B2 (ja) | 2012-09-26 | 2017-05-31 | シックスポイント マテリアルズ， インコーポレイテッド | Ｉｉｉ族窒化物ウエハおよび製作方法および試験方法 |
-
2013
- 2013-03-15 IN IN2030DEN2015 patent/IN2015DN02030A/en unknown
- 2013-03-15 US US13/834,871 patent/US9543393B2/en active Active
- 2013-03-15 EP EP13715053.8A patent/EP2890537A1/en not_active Withdrawn
- 2013-03-15 JP JP2015529788A patent/JP6144347B2/ja active Active
- 2013-03-15 WO PCT/US2013/032006 patent/WO2014035481A1/en not_active Ceased
- 2013-03-15 CN CN201380048864.4A patent/CN104781057B/zh active Active
- 2013-03-15 US US13/835,636 patent/US8921231B2/en active Active
- 2013-03-15 KR KR1020157007789A patent/KR101895035B1/ko active Active
- 2013-08-27 TW TW102130676A patent/TWI621163B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI226391B (en) * | 2001-06-08 | 2005-01-11 | Cree Inc | High surface quality GaN wafer and method of fabricating same |
| TW201002879A (en) * | 2008-06-04 | 2010-01-16 | Sixpoint Materials Inc | Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth |
| TW201002880A (en) * | 2008-06-04 | 2010-01-16 | Sixpoint Materials Inc | High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104781057A (zh) | 2015-07-15 |
| KR20150088993A (ko) | 2015-08-04 |
| TW201413807A (zh) | 2014-04-01 |
| CN104781057B (zh) | 2018-04-24 |
| KR101895035B1 (ko) | 2018-09-04 |
| JP2015529626A (ja) | 2015-10-08 |
| US20140061662A1 (en) | 2014-03-06 |
| US20140065796A1 (en) | 2014-03-06 |
| WO2014035481A1 (en) | 2014-03-06 |
| US9543393B2 (en) | 2017-01-10 |
| US8921231B2 (en) | 2014-12-30 |
| EP2890537A1 (en) | 2015-07-08 |
| IN2015DN02030A (enExample) | 2015-08-14 |
| JP6144347B2 (ja) | 2017-06-07 |
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