TWI620039B - 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 - Google Patents
位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 Download PDFInfo
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- TWI620039B TWI620039B TW104139186A TW104139186A TWI620039B TW I620039 B TWI620039 B TW I620039B TW 104139186 A TW104139186 A TW 104139186A TW 104139186 A TW104139186 A TW 104139186A TW I620039 B TWI620039 B TW I620039B
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- Prior art keywords
- substrate
- light
- mark
- unit
- light receiving
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 199
- 238000012545 processing Methods 0.000 claims description 19
- 238000001459 lithography Methods 0.000 claims description 11
- 239000003550 marker Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 21
- 238000005286 illumination Methods 0.000 description 19
- 230000003287 optical effect Effects 0.000 description 19
- 239000002245 particle Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 6
- 238000013519 translation Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014242526 | 2014-11-28 | ||
| JP2014-242526 | 2014-11-28 | ||
| JP2015171202A JP6590599B2 (ja) | 2014-11-28 | 2015-08-31 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
| JP2015-171202 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201621481A TW201621481A (zh) | 2016-06-16 |
| TWI620039B true TWI620039B (zh) | 2018-04-01 |
Family
ID=56122139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104139186A TWI620039B (zh) | 2014-11-28 | 2015-11-25 | 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6590599B2 (enExample) |
| KR (1) | KR101993950B1 (enExample) |
| CN (1) | CN105652611B (enExample) |
| TW (1) | TWI620039B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2019007A (en) * | 2016-06-13 | 2017-12-20 | Asml Netherlands Bv | Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate |
| JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
| JP6490771B1 (ja) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | 位置検出装置、位置検出方法、および、蒸着装置 |
| CN109585351B (zh) * | 2018-10-29 | 2021-06-22 | 苏州腾晖光伏技术有限公司 | 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法 |
| CN111355541A (zh) * | 2020-04-02 | 2020-06-30 | Oppo广东移动通信有限公司 | 网络设备、搜寻网络信号的方法 |
| JP7609676B2 (ja) * | 2021-03-29 | 2025-01-07 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送位置調整方法 |
| CN118641478B (zh) * | 2024-08-14 | 2024-11-05 | 江苏福拉特自动化设备有限公司 | Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200627085A (en) * | 2004-12-27 | 2006-08-01 | Asml Netherlands Bv | Lithographic apparatus with multiple alignment arrangements and alignment measurement method |
| US20060194123A1 (en) * | 2005-02-03 | 2006-08-31 | Asml Netherlands B.V. | Method of generating a photolithography patterning device, computer program, patterning device, method of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
| US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
| TW201415159A (zh) * | 2012-10-02 | 2014-04-16 | United Microelectronics Corp | 形成光罩的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| JPH0629698B2 (ja) * | 1990-06-26 | 1994-04-20 | 株式会社ニレコ | 端部検出装置 |
| JP3218984B2 (ja) * | 1995-10-02 | 2001-10-15 | ウシオ電機株式会社 | 半導体ウエハ上の不要レジストを除去するためのウエハ周辺露光方法および装置 |
| JPH09139342A (ja) * | 1995-11-15 | 1997-05-27 | Nikon Corp | プリアライメント方法及び装置 |
| JPH11162833A (ja) * | 1997-11-25 | 1999-06-18 | Nikon Corp | 基板周縁露光方法 |
| TWI250556B (en) * | 2001-07-20 | 2006-03-01 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US7566893B2 (en) * | 2004-06-22 | 2009-07-28 | Nikon Corporation | Best focus detection method, exposure method, and exposure apparatus |
| KR20070048650A (ko) * | 2004-08-31 | 2007-05-09 | 가부시키가이샤 니콘 | 위치 맞춤 방법, 처리 시스템, 기판의 투입 재현성 계측방법, 위치 계측 방법, 노광 방법, 기판 처리 장치, 계측방법 및 계측 장치 |
| US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
| JP5084558B2 (ja) * | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
| JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
| CN102402127B (zh) * | 2010-09-17 | 2014-01-22 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
| JP5875335B2 (ja) * | 2011-11-15 | 2016-03-02 | キヤノン株式会社 | 位置検出装置および露光装置 |
-
2015
- 2015-08-31 JP JP2015171202A patent/JP6590599B2/ja active Active
- 2015-11-25 TW TW104139186A patent/TWI620039B/zh active
- 2015-11-27 CN CN201510846079.4A patent/CN105652611B/zh active Active
- 2015-11-27 KR KR1020150167023A patent/KR101993950B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200627085A (en) * | 2004-12-27 | 2006-08-01 | Asml Netherlands Bv | Lithographic apparatus with multiple alignment arrangements and alignment measurement method |
| US20060194123A1 (en) * | 2005-02-03 | 2006-08-31 | Asml Netherlands B.V. | Method of generating a photolithography patterning device, computer program, patterning device, method of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
| US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
| TW201415159A (zh) * | 2012-10-02 | 2014-04-16 | United Microelectronics Corp | 形成光罩的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016110066A (ja) | 2016-06-20 |
| CN105652611B (zh) | 2018-05-08 |
| KR20160065019A (ko) | 2016-06-08 |
| JP6590599B2 (ja) | 2019-10-16 |
| KR101993950B1 (ko) | 2019-06-27 |
| CN105652611A (zh) | 2016-06-08 |
| TW201621481A (zh) | 2016-06-16 |
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