TWI620039B - 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 - Google Patents
位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 Download PDFInfo
- Publication number
- TWI620039B TWI620039B TW104139186A TW104139186A TWI620039B TW I620039 B TWI620039 B TW I620039B TW 104139186 A TW104139186 A TW 104139186A TW 104139186 A TW104139186 A TW 104139186A TW I620039 B TWI620039 B TW I620039B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- light
- mark
- unit
- light receiving
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-242526 | 2014-11-28 | ||
| JP2014242526 | 2014-11-28 | ||
| JP2015171202A JP6590599B2 (ja) | 2014-11-28 | 2015-08-31 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
| JP2015-171202 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201621481A TW201621481A (zh) | 2016-06-16 |
| TWI620039B true TWI620039B (zh) | 2018-04-01 |
Family
ID=56122139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104139186A TWI620039B (zh) | 2014-11-28 | 2015-11-25 | 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6590599B2 (enExample) |
| KR (1) | KR101993950B1 (enExample) |
| CN (1) | CN105652611B (enExample) |
| TW (1) | TWI620039B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109313405B (zh) * | 2016-06-13 | 2021-09-24 | Asml荷兰有限公司 | 用于确定衬底上目标结构的位置的方法和设备、用于确定衬底的位置的方法和设备 |
| JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
| JP6490771B1 (ja) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | 位置検出装置、位置検出方法、および、蒸着装置 |
| CN109585351B (zh) * | 2018-10-29 | 2021-06-22 | 苏州腾晖光伏技术有限公司 | 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法 |
| CN111355541A (zh) * | 2020-04-02 | 2020-06-30 | Oppo广东移动通信有限公司 | 网络设备、搜寻网络信号的方法 |
| JP7508313B2 (ja) * | 2020-08-27 | 2024-07-01 | キヤノン株式会社 | 搬送装置、露光装置、及び物品の製造方法 |
| JP7609676B2 (ja) * | 2021-03-29 | 2025-01-07 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送位置調整方法 |
| CN118641478B (zh) * | 2024-08-14 | 2024-11-05 | 江苏福拉特自动化设备有限公司 | Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200627085A (en) * | 2004-12-27 | 2006-08-01 | Asml Netherlands Bv | Lithographic apparatus with multiple alignment arrangements and alignment measurement method |
| US20060194123A1 (en) * | 2005-02-03 | 2006-08-31 | Asml Netherlands B.V. | Method of generating a photolithography patterning device, computer program, patterning device, method of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
| US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
| TW201415159A (zh) * | 2012-10-02 | 2014-04-16 | United Microelectronics Corp | 形成光罩的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| JPH0629698B2 (ja) * | 1990-06-26 | 1994-04-20 | 株式会社ニレコ | 端部検出装置 |
| JP3218984B2 (ja) * | 1995-10-02 | 2001-10-15 | ウシオ電機株式会社 | 半導体ウエハ上の不要レジストを除去するためのウエハ周辺露光方法および装置 |
| JPH09139342A (ja) * | 1995-11-15 | 1997-05-27 | Nikon Corp | プリアライメント方法及び装置 |
| JPH11162833A (ja) * | 1997-11-25 | 1999-06-18 | Nikon Corp | 基板周縁露光方法 |
| KR100585470B1 (ko) * | 2001-07-20 | 2006-06-02 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피장치, 디바이스제조방법, 및 그 제조된 디바이스 |
| US7566893B2 (en) * | 2004-06-22 | 2009-07-28 | Nikon Corporation | Best focus detection method, exposure method, and exposure apparatus |
| KR20070048650A (ko) * | 2004-08-31 | 2007-05-09 | 가부시키가이샤 니콘 | 위치 맞춤 방법, 처리 시스템, 기판의 투입 재현성 계측방법, 위치 계측 방법, 노광 방법, 기판 처리 장치, 계측방법 및 계측 장치 |
| US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
| JP5084558B2 (ja) * | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
| JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
| CN102402127B (zh) * | 2010-09-17 | 2014-01-22 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
| JP5875335B2 (ja) * | 2011-11-15 | 2016-03-02 | キヤノン株式会社 | 位置検出装置および露光装置 |
-
2015
- 2015-08-31 JP JP2015171202A patent/JP6590599B2/ja active Active
- 2015-11-25 TW TW104139186A patent/TWI620039B/zh not_active IP Right Cessation
- 2015-11-27 CN CN201510846079.4A patent/CN105652611B/zh active Active
- 2015-11-27 KR KR1020150167023A patent/KR101993950B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200627085A (en) * | 2004-12-27 | 2006-08-01 | Asml Netherlands Bv | Lithographic apparatus with multiple alignment arrangements and alignment measurement method |
| US20060194123A1 (en) * | 2005-02-03 | 2006-08-31 | Asml Netherlands B.V. | Method of generating a photolithography patterning device, computer program, patterning device, method of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
| US20090130784A1 (en) * | 2007-09-06 | 2009-05-21 | Vistec Semiconductor Systems Gmbh | Method for determining the position of the edge bead removal line of a disk-like object |
| TW201415159A (zh) * | 2012-10-02 | 2014-04-16 | United Microelectronics Corp | 形成光罩的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6590599B2 (ja) | 2019-10-16 |
| KR20160065019A (ko) | 2016-06-08 |
| CN105652611B (zh) | 2018-05-08 |
| KR101993950B1 (ko) | 2019-06-27 |
| JP2016110066A (ja) | 2016-06-20 |
| CN105652611A (zh) | 2016-06-08 |
| TW201621481A (zh) | 2016-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI620039B (zh) | 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 | |
| CN100523795C (zh) | 图形轮廓的检查装置和检查方法、曝光装置 | |
| JP5924267B2 (ja) | 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイスの製造方法 | |
| US6901314B2 (en) | Alignment apparatus for substrates | |
| US20100171966A1 (en) | Alignment apparatus for semiconductor wafer | |
| CN110767591B (zh) | 用于晶片处理的方法和装置 | |
| JP2003092246A (ja) | アライメントマーク及びアライメント装置とその方法、及び露光装置、デバイスの製造方法 | |
| JP2008210951A (ja) | 位置検出装置および位置検出方法 | |
| TW201611174A (zh) | 晶圓之位置檢測裝置、晶圓之位置檢測方法及記憶媒體 | |
| US7197176B2 (en) | Mark position detecting apparatus and mark position detecting method | |
| JPH0864518A (ja) | 露光方法 | |
| US9841299B2 (en) | Position determining device, position determining method, lithographic apparatus, and method for manufacturing object | |
| US10429744B2 (en) | Image improvement for alignment through incoherent illumination blending | |
| TWI731147B (zh) | 基板角位置特定方法 | |
| EP3324238B1 (en) | Exposure apparatus and method | |
| JP2016090444A (ja) | 計測装置、リソグラフィ装置、及び物品の製造方法 | |
| KR102634513B1 (ko) | 이물질 검출장치, 노광장치 및 물품의 제조방법 | |
| TW200916762A (en) | Inspecting apparatus | |
| JP2015040698A (ja) | アライメント装置、及び検査装置 | |
| JP2009170663A (ja) | 投影光学ユニット、露光装置、露光方法、およびデバイス製造方法 | |
| JP2007102580A (ja) | 位置決め手法、及び位置決め装置 | |
| KR20050067992A (ko) | 웨이퍼의 파티클 검출 장치 및 방법 | |
| JP2006133202A (ja) | 測定対象物の中心位置検出方法 | |
| JPH07167626A (ja) | 厚み検出装置及び厚み検出方法 | |
| JP2001108637A (ja) | 欠陥検査装置及び欠陥検査方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |