CN105652611B - 位置确定装置和方法、平版印刷设备及物品制造方法 - Google Patents
位置确定装置和方法、平版印刷设备及物品制造方法 Download PDFInfo
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- CN105652611B CN105652611B CN201510846079.4A CN201510846079A CN105652611B CN 105652611 B CN105652611 B CN 105652611B CN 201510846079 A CN201510846079 A CN 201510846079A CN 105652611 B CN105652611 B CN 105652611B
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Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014242526 | 2014-11-28 | ||
| JP2014-242526 | 2014-11-28 | ||
| JP2015171202A JP6590599B2 (ja) | 2014-11-28 | 2015-08-31 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
| JP2015-171202 | 2015-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105652611A CN105652611A (zh) | 2016-06-08 |
| CN105652611B true CN105652611B (zh) | 2018-05-08 |
Family
ID=56122139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510846079.4A Active CN105652611B (zh) | 2014-11-28 | 2015-11-27 | 位置确定装置和方法、平版印刷设备及物品制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6590599B2 (enExample) |
| KR (1) | KR101993950B1 (enExample) |
| CN (1) | CN105652611B (enExample) |
| TW (1) | TWI620039B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2019007A (en) * | 2016-06-13 | 2017-12-20 | Asml Netherlands Bv | Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate |
| JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
| JP6490771B1 (ja) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | 位置検出装置、位置検出方法、および、蒸着装置 |
| CN109585351B (zh) * | 2018-10-29 | 2021-06-22 | 苏州腾晖光伏技术有限公司 | 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法 |
| CN111355541A (zh) * | 2020-04-02 | 2020-06-30 | Oppo广东移动通信有限公司 | 网络设备、搜寻网络信号的方法 |
| JP7609676B2 (ja) * | 2021-03-29 | 2025-01-07 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送位置調整方法 |
| CN118641478B (zh) * | 2024-08-14 | 2024-11-05 | 江苏福拉特自动化设备有限公司 | Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| CN101794721A (zh) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | 半导体晶圆的定位装置 |
| CN102402127A (zh) * | 2010-09-17 | 2012-04-04 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629698B2 (ja) * | 1990-06-26 | 1994-04-20 | 株式会社ニレコ | 端部検出装置 |
| JP3218984B2 (ja) * | 1995-10-02 | 2001-10-15 | ウシオ電機株式会社 | 半導体ウエハ上の不要レジストを除去するためのウエハ周辺露光方法および装置 |
| JPH09139342A (ja) * | 1995-11-15 | 1997-05-27 | Nikon Corp | プリアライメント方法及び装置 |
| JPH11162833A (ja) * | 1997-11-25 | 1999-06-18 | Nikon Corp | 基板周縁露光方法 |
| TWI250556B (en) * | 2001-07-20 | 2006-03-01 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
| US7566893B2 (en) * | 2004-06-22 | 2009-07-28 | Nikon Corporation | Best focus detection method, exposure method, and exposure apparatus |
| KR20070048650A (ko) * | 2004-08-31 | 2007-05-09 | 가부시키가이샤 니콘 | 위치 맞춤 방법, 처리 시스템, 기판의 투입 재현성 계측방법, 위치 계측 방법, 노광 방법, 기판 처리 장치, 계측방법 및 계측 장치 |
| US7626701B2 (en) * | 2004-12-27 | 2009-12-01 | Asml Netherlands B.V. | Lithographic apparatus with multiple alignment arrangements and alignment measuring method |
| SG124407A1 (en) * | 2005-02-03 | 2006-08-30 | Asml Netherlands Bv | Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
| US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
| DE102007042271B3 (de) * | 2007-09-06 | 2009-02-05 | Vistec Semiconductor Systems Gmbh | Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts |
| JP5084558B2 (ja) * | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
| JP5875335B2 (ja) * | 2011-11-15 | 2016-03-02 | キヤノン株式会社 | 位置検出装置および露光装置 |
| TWI581055B (zh) * | 2012-10-02 | 2017-05-01 | 聯華電子股份有限公司 | 形成光罩的方法 |
-
2015
- 2015-08-31 JP JP2015171202A patent/JP6590599B2/ja active Active
- 2015-11-25 TW TW104139186A patent/TWI620039B/zh active
- 2015-11-27 CN CN201510846079.4A patent/CN105652611B/zh active Active
- 2015-11-27 KR KR1020150167023A patent/KR101993950B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
| CN101794721A (zh) * | 2009-01-08 | 2010-08-04 | 日东电工株式会社 | 半导体晶圆的定位装置 |
| CN102402127A (zh) * | 2010-09-17 | 2012-04-04 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016110066A (ja) | 2016-06-20 |
| TWI620039B (zh) | 2018-04-01 |
| KR20160065019A (ko) | 2016-06-08 |
| JP6590599B2 (ja) | 2019-10-16 |
| KR101993950B1 (ko) | 2019-06-27 |
| CN105652611A (zh) | 2016-06-08 |
| TW201621481A (zh) | 2016-06-16 |
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