JP6590599B2 - 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 - Google Patents

位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 Download PDF

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JP6590599B2
JP6590599B2 JP2015171202A JP2015171202A JP6590599B2 JP 6590599 B2 JP6590599 B2 JP 6590599B2 JP 2015171202 A JP2015171202 A JP 2015171202A JP 2015171202 A JP2015171202 A JP 2015171202A JP 6590599 B2 JP6590599 B2 JP 6590599B2
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substrate
light
mark
light source
determining
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JP2015171202A
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Japanese (ja)
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JP2016110066A (ja
JP2016110066A5 (enExample
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剛一 田村
剛一 田村
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to US14/948,548 priority Critical patent/US9841299B2/en
Priority to TW104139186A priority patent/TWI620039B/zh
Priority to EP15196752.8A priority patent/EP3026491B1/en
Priority to CN201510846079.4A priority patent/CN105652611B/zh
Priority to KR1020150167023A priority patent/KR101993950B1/ko
Publication of JP2016110066A publication Critical patent/JP2016110066A/ja
Publication of JP2016110066A5 publication Critical patent/JP2016110066A5/ja
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015171202A 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 Active JP6590599B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US14/948,548 US9841299B2 (en) 2014-11-28 2015-11-23 Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
TW104139186A TWI620039B (zh) 2014-11-28 2015-11-25 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法
EP15196752.8A EP3026491B1 (en) 2014-11-28 2015-11-27 Position determining device, position determining method, lithographic apparatus, and method for manufacturing object
CN201510846079.4A CN105652611B (zh) 2014-11-28 2015-11-27 位置确定装置和方法、平版印刷设备及物品制造方法
KR1020150167023A KR101993950B1 (ko) 2014-11-28 2015-11-27 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014242526 2014-11-28
JP2014242526 2014-11-28

Publications (3)

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JP2016110066A JP2016110066A (ja) 2016-06-20
JP2016110066A5 JP2016110066A5 (enExample) 2018-08-30
JP6590599B2 true JP6590599B2 (ja) 2019-10-16

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JP2015171202A Active JP6590599B2 (ja) 2014-11-28 2015-08-31 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法

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JP (1) JP6590599B2 (enExample)
KR (1) KR101993950B1 (enExample)
CN (1) CN105652611B (enExample)
TW (1) TWI620039B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2019007A (en) * 2016-06-13 2017-12-20 Asml Netherlands Bv Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6490771B1 (ja) * 2017-09-27 2019-03-27 株式会社アルバック 位置検出装置、位置検出方法、および、蒸着装置
CN109585351B (zh) * 2018-10-29 2021-06-22 苏州腾晖光伏技术有限公司 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法
CN111355541A (zh) * 2020-04-02 2020-06-30 Oppo广东移动通信有限公司 网络设备、搜寻网络信号的方法
JP7609676B2 (ja) * 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法
CN118641478B (zh) * 2024-08-14 2024-11-05 江苏福拉特自动化设备有限公司 Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JPH0629698B2 (ja) * 1990-06-26 1994-04-20 株式会社ニレコ 端部検出装置
JP3218984B2 (ja) * 1995-10-02 2001-10-15 ウシオ電機株式会社 半導体ウエハ上の不要レジストを除去するためのウエハ周辺露光方法および装置
JPH09139342A (ja) * 1995-11-15 1997-05-27 Nikon Corp プリアライメント方法及び装置
JPH11162833A (ja) * 1997-11-25 1999-06-18 Nikon Corp 基板周縁露光方法
TWI250556B (en) * 2001-07-20 2006-03-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7566893B2 (en) * 2004-06-22 2009-07-28 Nikon Corporation Best focus detection method, exposure method, and exposure apparatus
KR20070048650A (ko) * 2004-08-31 2007-05-09 가부시키가이샤 니콘 위치 맞춤 방법, 처리 시스템, 기판의 투입 재현성 계측방법, 위치 계측 방법, 노광 방법, 기판 처리 장치, 계측방법 및 계측 장치
US7626701B2 (en) * 2004-12-27 2009-12-01 Asml Netherlands B.V. Lithographic apparatus with multiple alignment arrangements and alignment measuring method
SG124407A1 (en) * 2005-02-03 2006-08-30 Asml Netherlands Bv Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
DE102007042271B3 (de) * 2007-09-06 2009-02-05 Vistec Semiconductor Systems Gmbh Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP5324231B2 (ja) * 2009-01-08 2013-10-23 日東電工株式会社 半導体ウエハのアライメント装置
CN102402127B (zh) * 2010-09-17 2014-01-22 上海微电子装备有限公司 一种硅片预对准装置及方法
JP5875335B2 (ja) * 2011-11-15 2016-03-02 キヤノン株式会社 位置検出装置および露光装置
TWI581055B (zh) * 2012-10-02 2017-05-01 聯華電子股份有限公司 形成光罩的方法

Also Published As

Publication number Publication date
JP2016110066A (ja) 2016-06-20
TWI620039B (zh) 2018-04-01
CN105652611B (zh) 2018-05-08
KR20160065019A (ko) 2016-06-08
KR101993950B1 (ko) 2019-06-27
CN105652611A (zh) 2016-06-08
TW201621481A (zh) 2016-06-16

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