TWI616476B - Thermosetting resin sheet and method of manufacturing electronic component package - Google Patents

Thermosetting resin sheet and method of manufacturing electronic component package Download PDF

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Publication number
TWI616476B
TWI616476B TW102143544A TW102143544A TWI616476B TW I616476 B TWI616476 B TW I616476B TW 102143544 A TW102143544 A TW 102143544A TW 102143544 A TW102143544 A TW 102143544A TW I616476 B TWI616476 B TW I616476B
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
resin sheet
electronic component
heat
semiconductor wafer
Prior art date
Application number
TW102143544A
Other languages
English (en)
Other versions
TW201428032A (zh
Inventor
Tsuyoshi Torinari
Eiji Toyoda
yusaku Shimizu
Original Assignee
Nitto Denko Corp
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Publication date
Priority to JP2012261384 priority Critical
Priority to JP2013240591A priority patent/JP5943898B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201428032A publication Critical patent/TW201428032A/zh
Application granted granted Critical
Publication of TWI616476B publication Critical patent/TWI616476B/zh

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