TW201428032A - 熱硬化性樹脂薄片及電子零件封裝之製造方法 - Google Patents

熱硬化性樹脂薄片及電子零件封裝之製造方法 Download PDF

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Publication number
TW201428032A
TW201428032A TW102143544A TW102143544A TW201428032A TW 201428032 A TW201428032 A TW 201428032A TW 102143544 A TW102143544 A TW 102143544A TW 102143544 A TW102143544 A TW 102143544A TW 201428032 A TW201428032 A TW 201428032A
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TW
Taiwan
Prior art keywords
thermosetting resin
resin sheet
electronic component
heat
semiconductor wafer
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TW102143544A
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English (en)
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TWI616476B (zh
Inventor
Tsuyoshi Torinari
Eiji Toyoda
yusaku Shimizu
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Nitto Denko Corp
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Priority to JP2012261384 priority Critical
Priority to JP2013240591A priority patent/JP5943898B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201428032A publication Critical patent/TW201428032A/zh
Application granted granted Critical
Publication of TWI616476B publication Critical patent/TWI616476B/zh

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