TWI616122B - 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法 - Google Patents

表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法 Download PDF

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Publication number
TWI616122B
TWI616122B TW104113870A TW104113870A TWI616122B TW I616122 B TWI616122 B TW I616122B TW 104113870 A TW104113870 A TW 104113870A TW 104113870 A TW104113870 A TW 104113870A TW I616122 B TWI616122 B TW I616122B
Authority
TW
Taiwan
Prior art keywords
layer
copper foil
carrier
treated
ultra
Prior art date
Application number
TW104113870A
Other languages
English (en)
Chinese (zh)
Other versions
TW201547335A (zh
Inventor
Kengo Kaminaga
Ryo Fukuchi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201547335A publication Critical patent/TW201547335A/zh
Application granted granted Critical
Publication of TWI616122B publication Critical patent/TWI616122B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Treatment Of Metals (AREA)
TW104113870A 2014-05-28 2015-04-30 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法 TWI616122B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014110662 2014-05-28

Publications (2)

Publication Number Publication Date
TW201547335A TW201547335A (zh) 2015-12-16
TWI616122B true TWI616122B (zh) 2018-02-21

Family

ID=54872922

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113870A TWI616122B (zh) 2014-05-28 2015-04-30 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法

Country Status (6)

Country Link
JP (1) JP6293093B2 (ja)
KR (1) KR101833590B1 (ja)
CN (1) CN105323958B (ja)
MY (1) MY182550A (ja)
PH (1) PH12015000180B1 (ja)
TW (1) TWI616122B (ja)

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Publication number Priority date Publication date Assignee Title
JP2016194112A (ja) * 2015-03-31 2016-11-17 Ｊｘ金属株式会社 キャリア付金属箔、積層体、プリント配線板、電子機器、キャリア付金属箔の製造方法及びプリント配線板の製造方法
JP6697759B2 (ja) * 2016-02-05 2020-05-27 パナソニックＩｐマネジメント株式会社 金属張積層板、金属張積層板の製造方法、樹脂付き金属部材、樹脂付き金属部材の製造方法、配線板、及び配線板の製造方法
WO2017141985A1 (ja) * 2016-02-18 2017-08-24 三井金属鉱業株式会社 プリント配線板製造用銅箔、キャリア付銅箔及び銅張積層板、並びにそれらを用いたプリント配線板の製造方法
CN105722339A (zh) * 2016-02-29 2016-06-29 江西合力泰科技有限公司 一种生物识别模组金属环贴装方法
CN105704948B (zh) * 2016-03-28 2018-05-29 上海美维电子有限公司 超薄印制电路板的制作方法及超薄印制电路板
US10820414B2 (en) * 2016-12-05 2020-10-27 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
CN112041485B (zh) * 2018-04-27 2023-07-14 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板及印刷配线板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US12004304B2 (en) * 2019-03-26 2024-06-04 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board
KR102690504B1 (ko) * 2024-04-29 2024-07-31 주식회사 유진테크놀로지 이차전지용 리드 탭 표면처리 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201330719A (zh) * 2011-09-30 2013-07-16 Jx Nippon Mining & Metals Corp 與樹脂之密合性優異之銅箔及其製造方法以及使用有該電解銅箔之印刷配線板或電池用負極材

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JP4107004B2 (ja) 2002-07-30 2008-06-25 日立電線株式会社 リチウムイオン二次電池用負極集電体及びリチウムイオン二次電池用負極集電体の製造方法
JP2005063764A (ja) 2003-08-08 2005-03-10 Hitachi Cable Ltd リチウムイオン二次電池用銅箔及びその製造方法
DE112005000224T5 (de) 2004-01-30 2006-12-28 Dai Nippon Printing Co., Ltd. Blatt zur Abschirmung elektromagnetischer Wellen und Verfahren zu dessen Herstellung
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
KR101203439B1 (ko) * 2007-12-21 2012-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박
JP4907580B2 (ja) * 2008-03-25 2012-03-28 新日鐵化学株式会社 フレキシブル銅張積層板
EP2319960A4 (en) * 2008-07-22 2013-01-02 Furukawa Electric Co Ltd LAMINATED COPPER LAMINATE LAMINATE
WO2010010893A1 (ja) * 2008-07-22 2010-01-28 古河電気工業株式会社 表面処理銅箔及び銅張積層板
JP5898616B2 (ja) 2010-06-30 2016-04-06 三井金属鉱業株式会社 負極集電体用銅箔の製造方法
JP5228130B1 (ja) 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP6031332B2 (ja) * 2012-11-13 2016-11-24 Ｊｘ金属株式会社 表面処理銅箔、それを用いた積層体、プリント配線板、電子部品及び表面処理銅箔の製造方法
JP5364838B1 (ja) 2012-11-30 2013-12-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201330719A (zh) * 2011-09-30 2013-07-16 Jx Nippon Mining & Metals Corp 與樹脂之密合性優異之銅箔及其製造方法以及使用有該電解銅箔之印刷配線板或電池用負極材

Also Published As

Publication number Publication date
CN105323958A (zh) 2016-02-10
CN105323958B (zh) 2018-04-20
PH12015000180A1 (en) 2017-01-16
JP2016006227A (ja) 2016-01-14
JP6293093B2 (ja) 2018-03-14
KR20150137023A (ko) 2015-12-08
TW201547335A (zh) 2015-12-16
MY182550A (en) 2021-01-25
KR101833590B1 (ko) 2018-02-28
PH12015000180B1 (en) 2017-01-16

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