PH12015000180B1 - Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated coper foil, and method for fabricating printed wiring board - Google Patents

Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated coper foil, and method for fabricating printed wiring board

Info

Publication number
PH12015000180B1
PH12015000180B1 PH12015000180A PH12015000180A PH12015000180B1 PH 12015000180 B1 PH12015000180 B1 PH 12015000180B1 PH 12015000180 A PH12015000180 A PH 12015000180A PH 12015000180 A PH12015000180 A PH 12015000180A PH 12015000180 B1 PH12015000180 B1 PH 12015000180B1
Authority
PH
Philippines
Prior art keywords
treated
copper foil
wiring board
printed wiring
fabricating
Prior art date
Application number
PH12015000180A
Other languages
English (en)
Other versions
PH12015000180A1 (en
Inventor
Kengo Kaminaga
Fukuchi Ryo
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12015000180A1 publication Critical patent/PH12015000180A1/en
Publication of PH12015000180B1 publication Critical patent/PH12015000180B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Treatment Of Metals (AREA)
PH12015000180A 2014-05-28 2015-05-28 Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated coper foil, and method for fabricating printed wiring board PH12015000180B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014110662 2014-05-28

Publications (2)

Publication Number Publication Date
PH12015000180A1 PH12015000180A1 (en) 2017-01-16
PH12015000180B1 true PH12015000180B1 (en) 2017-01-16

Family

ID=54872922

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015000180A PH12015000180B1 (en) 2014-05-28 2015-05-28 Surface-treated copper foil, copper foil provided with carrier, laminate, printed wiring board, electronic device, method for fabricating surface-treated coper foil, and method for fabricating printed wiring board

Country Status (6)

Country Link
JP (1) JP6293093B2 (ja)
KR (1) KR101833590B1 (ja)
CN (1) CN105323958B (ja)
MY (1) MY182550A (ja)
PH (1) PH12015000180B1 (ja)
TW (1) TWI616122B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016194112A (ja) * 2015-03-31 2016-11-17 Ｊｘ金属株式会社 キャリア付金属箔、積層体、プリント配線板、電子機器、キャリア付金属箔の製造方法及びプリント配線板の製造方法
JP6697759B2 (ja) * 2016-02-05 2020-05-27 パナソニックＩｐマネジメント株式会社 金属張積層板、金属張積層板の製造方法、樹脂付き金属部材、樹脂付き金属部材の製造方法、配線板、及び配線板の製造方法
JP6836580B2 (ja) * 2016-02-18 2021-03-03 三井金属鉱業株式会社 プリント配線板製造用銅箔、キャリア付銅箔及び銅張積層板、並びにそれらを用いたプリント配線板の製造方法
CN105722339A (zh) * 2016-02-29 2016-06-29 江西合力泰科技有限公司 一种生物识别模组金属环贴装方法
CN105704948B (zh) * 2016-03-28 2018-05-29 上海美维电子有限公司 超薄印制电路板的制作方法及超薄印制电路板
US10820414B2 (en) * 2016-12-05 2020-10-27 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6413039B1 (ja) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 表面処理銅箔及び銅張積層板
EP3786317A4 (en) * 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
KR102554287B1 (ko) * 2019-03-26 2023-07-12 미쓰이금속광업주식회사 프린트 배선판의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107004B2 (ja) 2002-07-30 2008-06-25 日立電線株式会社 リチウムイオン二次電池用負極集電体及びリチウムイオン二次電池用負極集電体の製造方法
JP2005063764A (ja) 2003-08-08 2005-03-10 Hitachi Cable Ltd リチウムイオン二次電池用銅箔及びその製造方法
US7495182B2 (en) 2004-01-30 2009-02-24 Dai Nippon Printing Co., Ltd. Electromagnetic wave shielding sheet and process for producing the same
JP4626390B2 (ja) * 2005-05-16 2011-02-09 日立電線株式会社 環境保護を配慮したプリント配線板用銅箔
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP4961023B2 (ja) * 2007-12-21 2012-06-27 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
JP4907580B2 (ja) * 2008-03-25 2012-03-28 新日鐵化学株式会社 フレキシブル銅張積層板
WO2010010893A1 (ja) * 2008-07-22 2010-01-28 古河電気工業株式会社 表面処理銅箔及び銅張積層板
TWI462826B (zh) * 2008-07-22 2014-12-01 Furukawa Electric Co Ltd Flexible copper clad sheet
US20130306486A1 (en) 2010-06-30 2013-11-21 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing copper foil for negative electrode current collector
KR20140054435A (ko) * 2011-09-30 2014-05-08 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 수지와의 밀착성이 우수한 동박 및 그 제조 방법 그리고 그 전해 동박을 사용한 프린트 배선판 또는 전지용 부극재
JP5228130B1 (ja) 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
JP6031332B2 (ja) * 2012-11-13 2016-11-24 Ｊｘ金属株式会社 表面処理銅箔、それを用いた積層体、プリント配線板、電子部品及び表面処理銅箔の製造方法
JP5364838B1 (ja) 2012-11-30 2013-12-11 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔

Also Published As

Publication number Publication date
TW201547335A (zh) 2015-12-16
JP2016006227A (ja) 2016-01-14
KR20150137023A (ko) 2015-12-08
MY182550A (en) 2021-01-25
CN105323958A (zh) 2016-02-10
CN105323958B (zh) 2018-04-20
JP6293093B2 (ja) 2018-03-14
PH12015000180A1 (en) 2017-01-16
TWI616122B (zh) 2018-02-21
KR101833590B1 (ko) 2018-02-28

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