TWI615913B - 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及元件製造方法 - Google Patents
移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及元件製造方法 Download PDFInfo
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- TWI615913B TWI615913B TW105113427A TW105113427A TWI615913B TW I615913 B TWI615913 B TW I615913B TW 105113427 A TW105113427 A TW 105113427A TW 105113427 A TW105113427 A TW 105113427A TW I615913 B TWI615913 B TW I615913B
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Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38043310P | 2010-09-07 | 2010-09-07 | |
| US61/380,433 | 2010-09-07 | ||
| US13/223,970 US20120064460A1 (en) | 2010-09-07 | 2011-09-01 | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US13/223,970 | 2011-09-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201631687A TW201631687A (zh) | 2016-09-01 |
| TWI615913B true TWI615913B (zh) | 2018-02-21 |
Family
ID=45807044
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105113427A TWI615913B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及元件製造方法 |
| TW100132051A TWI538078B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
| TW107101077A TWI661501B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、移動方法及曝光方法 |
| TW108114728A TWI720466B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、以及元件製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100132051A TWI538078B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
| TW107101077A TWI661501B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、移動方法及曝光方法 |
| TW108114728A TWI720466B (zh) | 2010-09-07 | 2011-09-06 | 移動體裝置、曝光裝置、以及元件製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120064460A1 (enExample) |
| JP (4) | JP5909934B2 (enExample) |
| KR (3) | KR101911724B1 (enExample) |
| CN (2) | CN103097957B (enExample) |
| HK (1) | HK1222921A1 (enExample) |
| TW (4) | TWI615913B (enExample) |
| WO (1) | WO2012033212A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2954561B2 (ja) | 1997-01-20 | 1999-09-27 | 松下電子工業株式会社 | リードフレーム、リードフレームを用いた樹脂封止半導体装置の成形金型、リードフレームを用いた樹脂封止半導体装置および樹脂封止半導体装置の製造方法 |
| US8699001B2 (en) * | 2009-08-20 | 2014-04-15 | Nikon Corporation | Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method |
| US20110042874A1 (en) * | 2009-08-20 | 2011-02-24 | Nikon Corporation | Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method |
| KR101862234B1 (ko) * | 2009-08-20 | 2018-05-29 | 가부시키가이샤 니콘 | 물체 처리 장치, 노광 장치와 노광 방법, 및 디바이스 제조 방법 |
| US20120064460A1 (en) * | 2010-09-07 | 2012-03-15 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US8598538B2 (en) * | 2010-09-07 | 2013-12-03 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
| US8988655B2 (en) | 2010-09-07 | 2015-03-24 | Nikon Corporation | Exposure apparatus, movable body apparatus, flat-panel display manufacturing method, and device manufacturing method |
| JP5958692B2 (ja) * | 2012-04-04 | 2016-08-02 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法並びに露光方法 |
| JP6035670B2 (ja) * | 2012-08-07 | 2016-11-30 | 株式会社ニコン | 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光装置 |
| WO2014024483A1 (ja) * | 2012-08-08 | 2014-02-13 | 株式会社ニコン | 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| JP6172913B2 (ja) * | 2012-10-23 | 2017-08-02 | キヤノン株式会社 | ステージ装置、露光装置および物品の製造方法 |
| JP6086299B2 (ja) * | 2012-11-13 | 2017-03-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| HK1216357A1 (en) | 2012-11-30 | 2016-11-04 | Nikon Corporation | Transfer system, exposure apparatus, transfer method, exposure method, device manufacturing method, and suction apparatus |
| WO2015147039A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| TWI701514B (zh) * | 2014-03-28 | 2020-08-11 | 日商尼康股份有限公司 | 移動體裝置、曝光裝置、平板顯示器之製造方法、元件製造方法、及移動體驅動方法 |
| KR102283654B1 (ko) * | 2014-11-14 | 2021-07-29 | 가부시키가이샤 니콘 | 조형 장치 및 조형 방법 |
| CN107466381B (zh) * | 2015-03-30 | 2021-03-09 | 株式会社尼康 | 物体搬运装置及方法、曝光装置及方法、平板显示器的制造方法、元件制造方法 |
| HK1246870A1 (zh) * | 2015-03-31 | 2018-09-14 | 株式会社尼康 | 曝光装置、平板显示器的制造方法、器件制造方法及曝光方法 |
| JP6885335B2 (ja) * | 2015-09-30 | 2021-06-16 | 株式会社ニコン | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに物体の移動方法 |
| JP6885334B2 (ja) * | 2015-09-30 | 2021-06-16 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法、並びに露光方法 |
| KR102676391B1 (ko) * | 2015-09-30 | 2024-06-18 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법 |
| CN106814551B (zh) * | 2015-11-30 | 2019-04-12 | 上海微电子装备（集团）股份有限公司 | 一种基板交接装置及交接方法 |
| JP6874314B2 (ja) * | 2016-09-30 | 2021-05-19 | 株式会社ニコン | 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
| CN109952537B (zh) | 2016-10-20 | 2021-12-24 | 分子印记公司 | 在压印光刻过程中定位基板 |
| CN107193142A (zh) * | 2017-07-19 | 2017-09-22 | 武汉华星光电技术有限公司 | 配向膜固化系统 |
| CN107228127B (zh) * | 2017-07-21 | 2023-06-06 | 天津航天机电设备研究所 | 一种气浮轴承 |
| KR102481264B1 (ko) * | 2018-01-04 | 2022-12-26 | 삼성전자주식회사 | 디스플레이 장치 및 디스플레이 모듈의 힌지 조립체 |
| JP7473195B2 (ja) * | 2020-09-14 | 2024-04-23 | 株式会社ブイ・テクノロジー | 集束荷電粒子ビーム装置 |
| JP2024043963A (ja) * | 2022-09-20 | 2024-04-02 | キオクシア株式会社 | パターン形成方法、半導体装置の製造方法、及びインプリント装置 |
| US12090590B1 (en) | 2023-10-10 | 2024-09-17 | Wuxi Xivi Science And Technology Co., Ltd. | Six-degree-of-freedom air-floating moving apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI538078B (zh) * | 2010-09-07 | 2016-06-11 | 尼康股份有限公司 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2812785B2 (ja) * | 1990-06-02 | 1998-10-22 | 株式会社日立製作所 | 試料位置決め装置 |
| US5196745A (en) * | 1991-08-16 | 1993-03-23 | Massachusetts Institute Of Technology | Magnetic positioning device |
| DE69709584T2 (de) * | 1996-03-04 | 2002-06-13 | Asm Lithography B.V., Veldhoven | Lithographisches gerät zur step-und-scan übertragung eines maskenmusters |
| US6089525A (en) * | 1997-10-07 | 2000-07-18 | Ultratech Stepper, Inc. | Six axis active vibration isolation and payload reaction force compensation system |
| TWI233535B (en) * | 1999-04-19 | 2005-06-01 | Asml Netherlands Bv | Motion feed-through into a vacuum chamber and its application in lithographic projection apparatuses |
| US6654095B1 (en) * | 1999-10-18 | 2003-11-25 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| JP2001215718A (ja) | 1999-11-26 | 2001-08-10 | Nikon Corp | 露光装置及び露光方法 |
| JP2002252166A (ja) * | 2001-02-27 | 2002-09-06 | Canon Inc | ステージ装置、露光装置およびデバイス製造方法ならびに移動案内方法 |
| TW529172B (en) | 2001-07-24 | 2003-04-21 | Asml Netherlands Bv | Imaging apparatus |
| US6888620B2 (en) * | 2001-11-29 | 2005-05-03 | Nikon Corporation | System and method for holding a device with minimal deformation |
| JP2004063790A (ja) * | 2002-07-29 | 2004-02-26 | Nikon Corp | 露光装置及びデバイス製造方法 |
| TWI338323B (en) * | 2003-02-17 | 2011-03-01 | Nikon Corp | Stage device, exposure device and manufacguring method of devices |
| EP1519230A1 (en) * | 2003-09-29 | 2005-03-30 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2005317916A (ja) * | 2004-03-30 | 2005-11-10 | Canon Inc | 露光装置及びデバイス製造方法 |
| WO2005099350A2 (en) * | 2004-04-14 | 2005-10-27 | Coreflow Scientific Solutions Ltd. | Non-contact support platforms for distance adjustment |
| WO2005122242A1 (ja) * | 2004-06-07 | 2005-12-22 | Nikon Corporation | ステージ装置、露光装置及び露光方法 |
| JP2006086442A (ja) * | 2004-09-17 | 2006-03-30 | Nikon Corp | ステージ装置及び露光装置 |
| JP4807629B2 (ja) * | 2004-11-25 | 2011-11-02 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| JP4793851B2 (ja) * | 2005-05-31 | 2011-10-12 | レーザーテック株式会社 | カラーフィルタ基板のステージ装置及び検査装置 |
| JP4917780B2 (ja) * | 2005-09-08 | 2012-04-18 | 住友化学株式会社 | 露光装置 |
| WO2007049603A1 (ja) * | 2005-10-24 | 2007-05-03 | Nikon Corporation | ステージ装置とその座標補正方法、露光装置、並びにデバイス製造方法 |
| JP2007150280A (ja) * | 2005-11-04 | 2007-06-14 | Dainippon Printing Co Ltd | 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法 |
| JP4545697B2 (ja) * | 2006-02-17 | 2010-09-15 | 住友重機械工業株式会社 | ステージ装置 |
| KR101626245B1 (ko) * | 2006-09-01 | 2016-05-31 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법 |
| KR101660668B1 (ko) * | 2006-09-01 | 2016-09-27 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
| CN101611470B (zh) * | 2007-03-05 | 2012-04-18 | 株式会社尼康 | 移动体装置、图案形成装置及图案形成方法、设备制造方法、移动体装置的制造方法以及移动体驱动方法 |
| US7607647B2 (en) | 2007-03-20 | 2009-10-27 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
| US8937706B2 (en) * | 2007-03-30 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and method |
| JP5279207B2 (ja) * | 2007-06-11 | 2013-09-04 | Ｎｓｋテクノロジー株式会社 | 露光装置用基板搬送機構 |
| JP5056339B2 (ja) * | 2007-10-18 | 2012-10-24 | 凸版印刷株式会社 | 基板搬送装置用基板把持機構 |
| US8665455B2 (en) * | 2007-11-08 | 2014-03-04 | Nikon Corporation | Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method |
| US8237916B2 (en) * | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
| US8269945B2 (en) * | 2007-12-28 | 2012-09-18 | Nikon Corporation | Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method |
| KR20100124245A (ko) * | 2008-02-08 | 2010-11-26 | 가부시키가이샤 니콘 | 위치 계측 시스템 및 위치 계측 방법, 이동체 장치, 이동체 구동 방법, 노광 장치 및 노광 방법, 패턴 형성 장치, 그리고 디바이스 제조 방법 |
| NL1036511A1 (nl) * | 2008-02-13 | 2009-08-14 | Asml Netherlands Bv | Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object. |
| JP2009210295A (ja) * | 2008-02-29 | 2009-09-17 | Canon Inc | 位置決め装置、露光装置及びデバイス製造方法 |
| JP5117243B2 (ja) * | 2008-03-27 | 2013-01-16 | 株式会社オーク製作所 | 露光装置 |
| CN101598900B (zh) * | 2008-06-05 | 2012-03-07 | 四川虹欧显示器件有限公司 | 等离子显示屏的曝光方法 |
| KR100977466B1 (ko) * | 2008-07-04 | 2010-08-23 | 한국전기연구원 | 원통형 자기부상 스테이지 |
| KR20100018950A (ko) | 2008-08-08 | 2010-02-18 | 하명찬 | 타이어 가황기용 단열판 |
| JP5254073B2 (ja) * | 2008-08-21 | 2013-08-07 | Ｎｓｋテクノロジー株式会社 | スキャン露光装置およびスキャン露光装置の基板搬送方法 |
| JP2010060990A (ja) * | 2008-09-05 | 2010-03-18 | Hitachi High-Technologies Corp | 露光装置、露光方法、及び表示用パネル基板の製造方法 |
| JP4787872B2 (ja) * | 2008-10-16 | 2011-10-05 | 東京エレクトロン株式会社 | 基板搬送処理装置 |
| US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
| US20100195083A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Automatic substrate transport system |
| NL2003877A (en) * | 2009-02-05 | 2010-08-09 | Asml Holding Nv | Reticle support that reduces reticle slippage. |
| CN101551599B (zh) * | 2009-04-03 | 2011-07-20 | 清华大学 | 一种光刻机硅片台双台交换系统 |
| CN101551593A (zh) * | 2009-04-24 | 2009-10-07 | 上海微电子装备有限公司 | 用于光刻装置的对准系统、光刻装置及其对准方法 |
| JP2011192332A (ja) * | 2010-03-12 | 2011-09-29 | Panasonic Corp | メモリオーディオ再生装置 |
-
2011
- 2011-09-01 US US13/223,970 patent/US20120064460A1/en not_active Abandoned
- 2011-09-05 JP JP2011192332A patent/JP5909934B2/ja active Active
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- 2011-09-05 KR KR1020187030215A patent/KR102072074B1/ko active Active
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| TWI538078B (zh) * | 2010-09-07 | 2016-06-11 | 尼康股份有限公司 | 移動體裝置、物體處理裝置、曝光裝置、平板顯示器之製造方法、及微型元件製造方法 |
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| HK1179356A1 (zh) | 2013-09-27 |
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| CN103097957A (zh) | 2013-05-08 |
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| CN103097957B (zh) | 2015-11-25 |
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| JP2012060118A (ja) | 2012-03-22 |
| JP5909934B2 (ja) | 2016-04-27 |
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| CN105404097A (zh) | 2016-03-16 |
| TWI538078B (zh) | 2016-06-11 |
| KR20130114123A (ko) | 2013-10-16 |
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