TWI615365B - 裂斷裝置 - Google Patents

裂斷裝置 Download PDF

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Publication number
TWI615365B
TWI615365B TW103121420A TW103121420A TWI615365B TW I615365 B TWI615365 B TW I615365B TW 103121420 A TW103121420 A TW 103121420A TW 103121420 A TW103121420 A TW 103121420A TW I615365 B TWI615365 B TW I615365B
Authority
TW
Taiwan
Prior art keywords
substrate
brittle material
breaking
material substrate
less
Prior art date
Application number
TW103121420A
Other languages
English (en)
Chinese (zh)
Other versions
TW201516012A (zh
Inventor
Yuma Iwatsubo
Kenji Murakami
Masakazu Takeda
Tomoko Kinoshita
Hiroyuki Tomimoto
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201516012A publication Critical patent/TW201516012A/zh
Application granted granted Critical
Publication of TWI615365B publication Critical patent/TWI615365B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
    • B23D79/02—Machines or devices for scraping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B39/00—Arrangements for moving, supporting, or positioning work, or controlling its movement, combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
    • B21B39/02—Feeding or supporting work; Braking or tensioning arrangements, e.g. threading arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/005—Cutting sheet laminae in planes between faces
TW103121420A 2013-10-25 2014-06-20 裂斷裝置 TWI615365B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013221739A JP6268917B2 (ja) 2013-10-25 2013-10-25 ブレイク装置

Publications (2)

Publication Number Publication Date
TW201516012A TW201516012A (zh) 2015-05-01
TWI615365B true TWI615365B (zh) 2018-02-21

Family

ID=53047241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103121420A TWI615365B (zh) 2013-10-25 2014-06-20 裂斷裝置

Country Status (4)

Country Link
JP (1) JP6268917B2 (ko)
KR (1) KR20150048025A (ko)
CN (1) CN104552622B (ko)
TW (1) TWI615365B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6365056B2 (ja) * 2014-07-22 2018-08-01 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法およびブレーク刃
JP6528581B2 (ja) * 2015-07-28 2019-06-12 三星ダイヤモンド工業株式会社 ブレーク装置、基板のブレーク方法、および、ブレーク装置の基板載置部用部材
KR20200058486A (ko) * 2017-10-27 2020-05-27 미쓰보시 다이야몬도 고교 가부시키가이샤 메탈막 부착 기판의 분단 방법
JP7020673B2 (ja) * 2018-02-21 2022-02-16 三星ダイヤモンド工業株式会社 ブレーク装置、ブレーク方法、およびブレークプレート
JP7020675B2 (ja) * 2018-02-26 2022-02-16 三星ダイヤモンド工業株式会社 Ｌｏｗ－ｋ膜付きウエハの分断方法
TWI820177B (zh) * 2018-09-26 2023-11-01 日商三星鑽石工業股份有限公司 附有金屬膜之基板的分割方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201300917A (zh) * 2011-05-18 2013-01-01 Asahi Glass Co Ltd 積層基板之剝離方法
TW201304403A (zh) * 2011-03-29 2013-01-16 Seiko Instr Inc 玻璃體之切斷方法、封裝體之製造方法、封裝體、壓電振動子、振盪器、電子機器及電波時鐘
TW201310515A (zh) * 2011-08-26 2013-03-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板分斷裝置
TW201316392A (zh) * 2011-10-13 2013-04-16 Mitsuboshi Diamond Ind Co Ltd 半導體基板之分斷方法
TW201321320A (zh) * 2011-11-25 2013-06-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法及分斷裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6087012A (ja) * 1983-10-20 1985-05-16 富士電機株式会社 半導体板の分割方法
JP4058542B2 (ja) * 1997-05-30 2008-03-12 三星ダイヤモンド工業株式会社 基板ブレイク装置、基板ブレイク方法、基板分断装置および基板分断システム
JP2006327877A (ja) * 2005-05-26 2006-12-07 Sony Corp 基板ブレイク装置および基板ブレイク方法ならびに半導体装置
CN101009978A (zh) * 2006-01-23 2007-08-01 阿尔卑斯电气株式会社 电子设备的制造方法
JP2009166169A (ja) * 2008-01-15 2009-07-30 Mitsuboshi Diamond Industrial Co Ltd カッター装置
JP5438422B2 (ja) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法並びに加工装置
JP2011060985A (ja) * 2009-09-10 2011-03-24 Murata Mfg Co Ltd 電子部品の製造方法
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201304403A (zh) * 2011-03-29 2013-01-16 Seiko Instr Inc 玻璃體之切斷方法、封裝體之製造方法、封裝體、壓電振動子、振盪器、電子機器及電波時鐘
TW201300917A (zh) * 2011-05-18 2013-01-01 Asahi Glass Co Ltd 積層基板之剝離方法
TW201310515A (zh) * 2011-08-26 2013-03-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板分斷裝置
TW201316392A (zh) * 2011-10-13 2013-04-16 Mitsuboshi Diamond Ind Co Ltd 半導體基板之分斷方法
TW201321320A (zh) * 2011-11-25 2013-06-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法及分斷裝置

Also Published As

Publication number Publication date
TW201516012A (zh) 2015-05-01
CN104552622A (zh) 2015-04-29
JP6268917B2 (ja) 2018-01-31
KR20150048025A (ko) 2015-05-06
JP2015083337A (ja) 2015-04-30
CN104552622B (zh) 2018-04-10

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