TWI611049B - 腐蝕抑制劑及相關組合物及方法 - Google Patents
腐蝕抑制劑及相關組合物及方法 Download PDFInfo
- Publication number
- TWI611049B TWI611049B TW104134573A TW104134573A TWI611049B TW I611049 B TWI611049 B TW I611049B TW 104134573 A TW104134573 A TW 104134573A TW 104134573 A TW104134573 A TW 104134573A TW I611049 B TWI611049 B TW I611049B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- polishing composition
- inhibitor
- chemical mechanical
- weight
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462066484P | 2014-10-21 | 2014-10-21 | |
| US62/066,484 | 2014-10-21 | ||
| US201562198013P | 2015-07-28 | 2015-07-28 | |
| US62/198,013 | 2015-07-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201629269A TW201629269A (zh) | 2016-08-16 |
| TWI611049B true TWI611049B (zh) | 2018-01-11 |
Family
ID=55748310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104134573A TWI611049B (zh) | 2014-10-21 | 2015-10-21 | 腐蝕抑制劑及相關組合物及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10124464B2 (enExample) |
| EP (1) | EP3209815B1 (enExample) |
| JP (1) | JP6810029B2 (enExample) |
| KR (1) | KR102477843B1 (enExample) |
| CN (2) | CN107148496A (enExample) |
| TW (1) | TWI611049B (enExample) |
| WO (1) | WO2016065057A1 (enExample) |
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| TWI660017B (zh) | 2016-07-14 | 2019-05-21 | Cabot Microelectronics Corporation | 用於鈷化學機械拋光(cmp)之替代氧化劑 |
| US10294399B2 (en) * | 2017-01-05 | 2019-05-21 | Cabot Microelectronics Corporation | Composition and method for polishing silicon carbide |
| KR20190109450A (ko) * | 2017-02-28 | 2019-09-25 | 후지필름 가부시키가이샤 | 연마액, 연마액의 제조 방법, 연마액 원액, 연마액 원액 수용체, 화학적 기계적 연마 방법 |
| US10233356B2 (en) | 2017-03-06 | 2019-03-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing slurry for cobalt-containing substrate |
| US10077382B1 (en) | 2017-03-06 | 2018-09-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for polishing cobalt-containing substrate |
| CN110431209B (zh) * | 2017-03-14 | 2022-06-28 | 福吉米株式会社 | 研磨用组合物、其制造方法以及使用其的研磨方法及基板的制造方法 |
| JP6901297B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
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| WO2019050909A1 (en) * | 2017-09-07 | 2019-03-14 | Stepan Company | CORROSION INHIBITORS FOR OIL FIELD APPLICATIONS |
| US20190085205A1 (en) * | 2017-09-15 | 2019-03-21 | Cabot Microelectronics Corporation | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS |
| US10647887B2 (en) * | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
| US20190211228A1 (en) * | 2018-01-09 | 2019-07-11 | Cabot Microelectronics Corporation | Tungsten bulk polishing method with improved topography |
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| US10759970B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
| US10763119B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
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| US11001733B2 (en) * | 2019-03-29 | 2021-05-11 | Fujimi Incorporated | Compositions for polishing cobalt and low-K material surfaces |
| US10947413B2 (en) * | 2019-03-29 | 2021-03-16 | Rohm And Haas Electronic Materials Cmp Holdings | Chemical mechanical polishing method for cobalt with high cobalt removal rates and reduced cobalt corrosion |
| TWI875753B (zh) * | 2019-04-17 | 2025-03-11 | 美商Cmc材料有限責任公司 | 用於鎢擦光應用之表面塗覆研磨顆粒 |
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| US11292938B2 (en) * | 2019-09-11 | 2022-04-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of selective chemical mechanical polishing cobalt, zirconium oxide, poly-silicon and silicon dioxide films |
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| CN112501617B (zh) * | 2020-11-12 | 2021-11-23 | 陕西科技大学 | 一种双疏水链改性l-组氨酸缓蚀剂及其制备方法和应用 |
| US12590224B2 (en) * | 2020-12-21 | 2026-03-31 | Fujifilm Electronic Materials U.S.A., Inc. | Chemical mechanical polishing compositions and methods of use thereof |
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| CN114686110A (zh) * | 2020-12-30 | 2022-07-01 | 安集微电子科技(上海)股份有限公司 | 一种化学机械抛光液 |
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| CN113881347B (zh) * | 2021-10-15 | 2023-01-31 | 深圳市科玺化工有限公司 | 一种硅晶圆用化学机械精抛液 |
| WO2023076112A1 (en) * | 2021-10-28 | 2023-05-04 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| CN114106702B (zh) * | 2021-12-13 | 2022-11-18 | 广东凯盟钝化防锈技术有限公司 | 一种不锈钢流体粗抛蜡及其制备方法 |
| CN120731143A (zh) * | 2022-12-30 | 2025-09-30 | 肯珀尔公司 | 化学平坦化 |
| KR102977402B1 (ko) | 2023-10-26 | 2026-06-16 | 솔브레인 주식회사 | 금속막 연마를 위한 화학적 기계적 연마 슬러리 조성물 및 이를 이용한 연마 방법 |
| CN121203552B (zh) * | 2025-09-29 | 2026-05-26 | 芯越微电子材料(嘉兴)有限公司 | 一种耐腐蚀硅通孔铜膜化学机械抛光液及其应用 |
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2015
- 2015-10-21 EP EP15853494.1A patent/EP3209815B1/en active Active
- 2015-10-21 CN CN201580057443.7A patent/CN107148496A/zh active Pending
- 2015-10-21 WO PCT/US2015/056744 patent/WO2016065057A1/en not_active Ceased
- 2015-10-21 KR KR1020177013244A patent/KR102477843B1/ko active Active
- 2015-10-21 JP JP2017519872A patent/JP6810029B2/ja active Active
- 2015-10-21 TW TW104134573A patent/TWI611049B/zh active
- 2015-10-21 US US14/919,404 patent/US10124464B2/en active Active
- 2015-10-21 CN CN202310169002.2A patent/CN116288366A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI367961B (enExample) * | 2007-12-06 | 2012-07-11 | Uwiz Technology Co Ltd | |
| TW201243039A (en) * | 2011-03-22 | 2012-11-01 | Basf Se | A chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107148496A (zh) | 2017-09-08 |
| JP6810029B2 (ja) | 2021-01-06 |
| US20160107289A1 (en) | 2016-04-21 |
| JP2018500456A (ja) | 2018-01-11 |
| EP3209815A4 (en) | 2018-08-01 |
| EP3209815B1 (en) | 2021-12-29 |
| US10124464B2 (en) | 2018-11-13 |
| CN116288366A (zh) | 2023-06-23 |
| TW201629269A (zh) | 2016-08-16 |
| WO2016065057A1 (en) | 2016-04-28 |
| KR20170068584A (ko) | 2017-06-19 |
| EP3209815A1 (en) | 2017-08-30 |
| KR102477843B1 (ko) | 2022-12-16 |
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