TWI601310B - 奈米線發光二極體結構及其製造方法 - Google Patents

奈米線發光二極體結構及其製造方法 Download PDF

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TWI601310B
TWI601310B TW102138763A TW102138763A TWI601310B TW I601310 B TWI601310 B TW I601310B TW 102138763 A TW102138763 A TW 102138763A TW 102138763 A TW102138763 A TW 102138763A TW I601310 B TWI601310 B TW I601310B
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layer
electrode
region
nanowires
nanowire
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TW201424041A (zh
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史考特 布萊德 海納
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Glo公司
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    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
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    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
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  • Led Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Electrodes Of Semiconductors (AREA)
TW102138763A 2012-10-26 2013-10-25 奈米線發光二極體結構及其製造方法 TWI601310B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261719108P 2012-10-26 2012-10-26
US14/059,629 US9076945B2 (en) 2012-10-26 2013-10-22 Nanowire LED structure and method for manufacturing the same

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Publication Number Publication Date
TW201424041A TW201424041A (zh) 2014-06-16
TWI601310B true TWI601310B (zh) 2017-10-01

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US (3) US9076945B2 (enExample)
EP (1) EP2912700A4 (enExample)
JP (1) JP6353845B2 (enExample)
KR (1) KR20150103661A (enExample)
TW (1) TWI601310B (enExample)
WO (1) WO2014066357A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9343490B2 (en) 2013-08-09 2016-05-17 Zena Technologies, Inc. Nanowire structured color filter arrays and fabrication method of the same
US8748799B2 (en) 2010-12-14 2014-06-10 Zena Technologies, Inc. Full color single pixel including doublet or quadruplet si nanowires for image sensors
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
US8299472B2 (en) 2009-12-08 2012-10-30 Young-June Yu Active pixel sensor with nanowire structured photodetectors
US9478685B2 (en) 2014-06-23 2016-10-25 Zena Technologies, Inc. Vertical pillar structured infrared detector and fabrication method for the same
US20160005892A1 (en) * 2014-07-02 2016-01-07 Zena Technologies, Inc. Vertical pillar structure photovoltaic devices and method for making the same
US9515218B2 (en) 2008-09-04 2016-12-06 Zena Technologies, Inc. Vertical pillar structured photovoltaic devices with mirrors and optical claddings
US9406709B2 (en) 2010-06-22 2016-08-02 President And Fellows Of Harvard College Methods for fabricating and using nanowires
US9000353B2 (en) 2010-06-22 2015-04-07 President And Fellows Of Harvard College Light absorption and filtering properties of vertically oriented semiconductor nano wires
US8229255B2 (en) 2008-09-04 2012-07-24 Zena Technologies, Inc. Optical waveguides in image sensors
US8274039B2 (en) 2008-11-13 2012-09-25 Zena Technologies, Inc. Vertical waveguides with various functionality on integrated circuits
US9299866B2 (en) 2010-12-30 2016-03-29 Zena Technologies, Inc. Nanowire array based solar energy harvesting device
US8866065B2 (en) 2010-12-13 2014-10-21 Zena Technologies, Inc. Nanowire arrays comprising fluorescent nanowires
WO2014066371A1 (en) 2012-10-26 2014-05-01 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
US9076945B2 (en) 2012-10-26 2015-07-07 Glo Ab Nanowire LED structure and method for manufacturing the same
EP2912699B1 (en) 2012-10-26 2019-12-18 Glo Ab Method for modifying selected portions of nanowire sized opto-electronic structure
FR3000294B1 (fr) * 2012-12-21 2016-03-04 Aledia Support fonctionnel comprenant des nanofils et des nano-empreintes et procede de fabrication dudit support
TWI636952B (zh) * 2013-12-13 2018-10-01 瑞典商Glo公司 使用介電膜以減少奈米線發光二極體中之透明導電氧化物之電阻率
WO2016022824A1 (en) * 2014-08-08 2016-02-11 Glo Ab Pixilated display device based upon nanowire leds and method for making the same
KR102223036B1 (ko) 2014-08-18 2021-03-05 삼성전자주식회사 나노구조 반도체 발광소자
KR20160027610A (ko) * 2014-09-01 2016-03-10 삼성전자주식회사 나노구조 반도체 발광소자
WO2016049507A1 (en) 2014-09-26 2016-03-31 Glo Ab Monolithic image chip for near-to-eye display
DE102015121554B4 (de) * 2015-12-10 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
US11802999B2 (en) * 2016-08-31 2023-10-31 Riken Light absorbing body, bolometer, infrared ray absorbing body, solar thermal power generating device, radiant cooling film, and method for manufacturing light absorbing body
FR3061608B1 (fr) * 2016-12-29 2019-05-31 Aledia Dispositif optoelectronique a diodes electroluminescentes
JP7007547B2 (ja) * 2017-04-11 2022-01-24 日亜化学工業株式会社 発光素子の製造方法
US10418499B2 (en) 2017-06-01 2019-09-17 Glo Ab Self-aligned nanowire-based light emitting diode subpixels for a direct view display and method of making thereof
KR102345618B1 (ko) * 2017-09-01 2021-12-31 삼성전자주식회사 발광 다이오드 및 그의 제조 방법
WO2019055271A1 (en) 2017-09-15 2019-03-21 Glo Ab OPTICAL EXTENSION IMPROVEMENT OF LIGHT-EMITTING DIODE SUB-PIXELS
JP7137066B2 (ja) 2018-10-23 2022-09-14 日亜化学工業株式会社 発光素子の製造方法
KR102725008B1 (ko) * 2019-01-15 2024-11-01 삼성디스플레이 주식회사 발광 소자 및 이를 포함하는 표시 장치
EP3754731A1 (en) * 2019-06-21 2020-12-23 Aledia Method for local removal of semiconductor wires
CN115413372A (zh) * 2020-04-21 2022-11-29 上海显耀显示科技有限公司 具有反射元件的发光二极管芯片结构
CN114300604B (zh) * 2021-12-27 2024-02-20 中国电子科技集团公司第五十五研究所 一种高分辨率Micro-LED微显示器件的高容差铟柱及其制备方法
CN118367075B (zh) * 2024-06-19 2024-09-10 季华实验室 显示面板以及显示面板的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200541390A (en) * 2004-04-22 2005-12-16 Hewlett Packard Development Co A method for patterning an organic light emitting diode device
US20110254034A1 (en) * 2008-07-07 2011-10-20 Glo Ab Nanostructured led
US20110309382A1 (en) * 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
AU2003287618A1 (en) * 2002-11-12 2004-06-03 Nanoink, Inc. Methods and apparatus for ink delivery to nanolithographic probe systems
US7132677B2 (en) 2004-02-13 2006-11-07 Dongguk University Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same
US20060231828A1 (en) * 2004-07-29 2006-10-19 Margaretha De Kok-Van Breemen Light-emitting diode
JP4591276B2 (ja) * 2005-08-12 2010-12-01 パナソニック電工株式会社 半導体発光素子の製造方法
US20070158661A1 (en) 2006-01-12 2007-07-12 Rutgers, The State University Of New Jersey ZnO nanostructure-based light emitting device
US8691011B2 (en) 2006-03-08 2014-04-08 Qunano Ab Method for metal-free synthesis of epitaxial semiconductor nanowires on si
NZ570678A (en) 2006-03-10 2010-10-29 Stc Unm Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices
JP5082504B2 (ja) * 2006-03-31 2012-11-28 日亜化学工業株式会社 発光素子及び発光素子の製造方法
EP2064745A1 (en) 2006-09-18 2009-06-03 QuNano AB Method of producing precision vertical and horizontal layers in a vertical semiconductor structure
JP2008098220A (ja) * 2006-10-06 2008-04-24 Asahi Kasei Corp 発光ダイオード
US8426224B2 (en) 2006-12-18 2013-04-23 The Regents Of The University Of California Nanowire array-based light emitting diodes and lasers
EP2126986B1 (en) * 2006-12-22 2019-09-18 QuNano AB Led with upstanding nanowire structure and method of producing such
WO2008079078A1 (en) * 2006-12-22 2008-07-03 Qunano Ab Elevated led and method of producing such
KR101524319B1 (ko) 2007-01-12 2015-06-10 큐나노 에이비 시준 리플렉터를 갖는 나노구조 led 어레이
AU2008203934C1 (en) * 2007-01-12 2014-03-13 Qunano Ab Nitride nanowires and method of producing such
US8624968B1 (en) * 2007-04-25 2014-01-07 Stc.Unm Lens-less digital microscope
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8384630B2 (en) * 2007-05-31 2013-02-26 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
KR100904588B1 (ko) * 2007-07-05 2009-06-25 삼성전자주식회사 코어/쉘 형태의 나노와이어를 제조하는 방법, 그에 의해제조된 나노와이어 및 이를 포함하는 나노와이어 소자
WO2009035746A2 (en) * 2007-09-07 2009-03-19 Amberwave Systems Corporation Multi-junction solar cells
JP2009147140A (ja) 2007-12-14 2009-07-02 Panasonic Corp 発光素子および発光素子の製造方法
US8546067B2 (en) * 2008-03-21 2013-10-01 The Board Of Trustees Of The University Of Illinois Material assisted laser ablation
SE533531C2 (sv) * 2008-12-19 2010-10-19 Glo Ab Nanostrukturerad anordning
KR20100080094A (ko) 2008-12-31 2010-07-08 삼성전자주식회사 방사형 이종접합 구조의 나노 막대를 이용한 발광 다이오드
KR20120003463A (ko) * 2009-03-25 2012-01-10 글로 에이비 쇼트키 장치
KR101706915B1 (ko) * 2009-05-12 2017-02-15 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 변형가능 및 반투과 디스플레이를 위한 초박형, 미세구조 무기발광다이오드의 인쇄 어셈블리
EP2253413A1 (en) * 2009-05-15 2010-11-24 National University of Ireland Galway Method for laser ablation
WO2010151604A2 (en) 2009-06-26 2010-12-29 California Institute Of Technology Methods for fabricating passivated silicon nanowires and devices thus obtained
FR2949278B1 (fr) * 2009-08-18 2012-11-02 Commissariat Energie Atomique Procede de fabrication d'un dispositif d'emission de lumiere a base de diodes electroluminescentes
US20110079766A1 (en) 2009-10-01 2011-04-07 Isaac Harshman Wildeson Process for fabricating iii-nitride based nanopyramid leds directly on a metalized silicon substrate
US20120006390A1 (en) * 2009-12-08 2012-01-12 Yijie Huo Nano-wire solar cell or detector
KR101134493B1 (ko) * 2010-03-19 2012-04-13 삼성엘이디 주식회사 발광 다이오드 및 이의 제조 방법
US9947829B2 (en) 2010-06-24 2018-04-17 Glo Ab Substrate with buffer layer for oriented nanowire growth
KR101710159B1 (ko) 2010-09-14 2017-03-08 삼성전자주식회사 Ⅲ족 질화물 나노로드 발광소자 및 그 제조 방법
US20130200391A1 (en) 2010-09-28 2013-08-08 North Carolina State University Gallium nitride based structures with embedded voids and methods for their fabrication
KR20120040550A (ko) * 2010-10-19 2012-04-27 삼성엘이디 주식회사 반도체 발광소자 및 그 제조방법
KR20120055390A (ko) * 2010-11-23 2012-05-31 삼성엘이디 주식회사 발광소자 및 그 제조방법
KR101538414B1 (ko) * 2011-04-08 2015-07-22 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치, 프로그래밍 가능한 패터닝 디바이스 및 리소그래피 방법
WO2013025874A2 (en) 2011-08-16 2013-02-21 Brightedge Technologies, Inc. Page reporting
US8350249B1 (en) 2011-09-26 2013-01-08 Glo Ab Coalesced nanowire structures with interstitial voids and method for manufacturing the same
US8350251B1 (en) * 2011-09-26 2013-01-08 Glo Ab Nanowire sized opto-electronic structure and method for manufacturing the same
TWI528592B (zh) * 2011-11-03 2016-04-01 晶元光電股份有限公司 光電元件
US8921141B2 (en) * 2012-09-18 2014-12-30 Glo Ab Nanopyramid sized opto-electronic structure and method for manufacturing of same
WO2014066371A1 (en) * 2012-10-26 2014-05-01 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
US9076945B2 (en) 2012-10-26 2015-07-07 Glo Ab Nanowire LED structure and method for manufacturing the same
WO2014143991A1 (en) * 2013-03-15 2014-09-18 Glo Ab Nanowire led structure with decreased leakage and method of making same
US9224914B2 (en) * 2013-06-18 2015-12-29 Glo Ab Insulating layer for planarization and definition of the active region of a nanowire device
TWI636952B (zh) * 2013-12-13 2018-10-01 瑞典商Glo公司 使用介電膜以減少奈米線發光二極體中之透明導電氧化物之電阻率

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200541390A (en) * 2004-04-22 2005-12-16 Hewlett Packard Development Co A method for patterning an organic light emitting diode device
US20110254034A1 (en) * 2008-07-07 2011-10-20 Glo Ab Nanostructured led
US20110309382A1 (en) * 2010-06-18 2011-12-22 Glo Ab Nanowire led structure and method for manufacturing the same

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