TWI601217B - 包含積體電路(ic)封裝體之間的可撓連接件的積體裝置 - Google Patents

包含積體電路(ic)封裝體之間的可撓連接件的積體裝置 Download PDF

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Publication number
TWI601217B
TWI601217B TW106103767A TW106103767A TWI601217B TW I601217 B TWI601217 B TW I601217B TW 106103767 A TW106103767 A TW 106103767A TW 106103767 A TW106103767 A TW 106103767A TW I601217 B TWI601217 B TW I601217B
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TW
Taiwan
Prior art keywords
package
dielectric layer
integrated circuit
die
flexible connector
Prior art date
Application number
TW106103767A
Other languages
English (en)
Chinese (zh)
Other versions
TW201735193A (zh
Inventor
魏弘博
李載植
金東旭
Original Assignee
高通公司
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Publication date
Application filed by 高通公司 filed Critical 高通公司
Application granted granted Critical
Publication of TW201735193A publication Critical patent/TW201735193A/zh
Publication of TWI601217B publication Critical patent/TWI601217B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
TW106103767A 2016-02-10 2017-02-06 包含積體電路(ic)封裝體之間的可撓連接件的積體裝置 TWI601217B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/040,881 US9633950B1 (en) 2016-02-10 2016-02-10 Integrated device comprising flexible connector between integrated circuit (IC) packages

Publications (2)

Publication Number Publication Date
TW201735193A TW201735193A (zh) 2017-10-01
TWI601217B true TWI601217B (zh) 2017-10-01

Family

ID=58057302

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106103767A TWI601217B (zh) 2016-02-10 2017-02-06 包含積體電路(ic)封裝體之間的可撓連接件的積體裝置

Country Status (9)

Country Link
US (1) US9633950B1 (cg-RX-API-DMAC10.html)
EP (1) EP3414776B1 (cg-RX-API-DMAC10.html)
JP (1) JP6956095B2 (cg-RX-API-DMAC10.html)
KR (1) KR20180111840A (cg-RX-API-DMAC10.html)
CN (1) CN108604585B (cg-RX-API-DMAC10.html)
AU (1) AU2017217375A1 (cg-RX-API-DMAC10.html)
BR (1) BR112018016132B1 (cg-RX-API-DMAC10.html)
TW (1) TWI601217B (cg-RX-API-DMAC10.html)
WO (1) WO2017139285A1 (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11581261B2 (en) * 2018-06-12 2023-02-14 Novatek Microelectronics Corp. Chip on film package
US11342268B2 (en) * 2020-01-29 2022-05-24 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US12074077B2 (en) * 2020-11-19 2024-08-27 Apple Inc. Flexible package architecture concept in fanout

Citations (2)

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US20090016033A1 (en) * 2007-07-12 2009-01-15 Seng Guan Chow Integrated circuit package system with flexible substrate and mounded package
US20090090541A1 (en) * 2007-10-04 2009-04-09 Phoenix Precision Technology Corporation Stacked semiconductor device and fabricating method thereof

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JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
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FR2793352B1 (fr) 1999-05-07 2006-09-22 Sagem Composant electrique a nappe souple de conducteurs de raccordement
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US20090090541A1 (en) * 2007-10-04 2009-04-09 Phoenix Precision Technology Corporation Stacked semiconductor device and fabricating method thereof

Also Published As

Publication number Publication date
WO2017139285A1 (en) 2017-08-17
EP3414776A1 (en) 2018-12-19
KR20180111840A (ko) 2018-10-11
TW201735193A (zh) 2017-10-01
EP3414776B1 (en) 2021-06-16
BR112018016132A2 (pt) 2019-01-02
JP2019510368A (ja) 2019-04-11
US9633950B1 (en) 2017-04-25
CN108604585A (zh) 2018-09-28
CN108604585B (zh) 2021-09-24
AU2017217375A1 (en) 2018-07-26
BR112018016132B1 (pt) 2022-09-20
JP6956095B2 (ja) 2021-10-27

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