TWI593830B - With a carrier of ultra-thin copper foil, copper-clad laminate and coreless substrate - Google Patents

With a carrier of ultra-thin copper foil, copper-clad laminate and coreless substrate Download PDF

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Publication number
TWI593830B
TWI593830B TW103106418A TW103106418A TWI593830B TW I593830 B TWI593830 B TW I593830B TW 103106418 A TW103106418 A TW 103106418A TW 103106418 A TW103106418 A TW 103106418A TW I593830 B TWI593830 B TW I593830B
Authority
TW
Taiwan
Prior art keywords
carrier
ultra
copper foil
thin copper
foil
Prior art date
Application number
TW103106418A
Other languages
English (en)
Chinese (zh)
Other versions
TW201437436A (zh
Inventor
Ryota Fujita
Takeo Uno
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201437436A publication Critical patent/TW201437436A/zh
Application granted granted Critical
Publication of TWI593830B publication Critical patent/TWI593830B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing & Machinery (AREA)
TW103106418A 2013-02-26 2014-02-26 With a carrier of ultra-thin copper foil, copper-clad laminate and coreless substrate TWI593830B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013035852 2013-02-26

Publications (2)

Publication Number Publication Date
TW201437436A TW201437436A (zh) 2014-10-01
TWI593830B true TWI593830B (zh) 2017-08-01

Family

ID=51428211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103106418A TWI593830B (zh) 2013-02-26 2014-02-26 With a carrier of ultra-thin copper foil, copper-clad laminate and coreless substrate

Country Status (5)

Country Link
JP (1) JP5755371B2 (ja)
KR (1) KR101664993B1 (ja)
CN (1) CN105074058B (ja)
TW (1) TWI593830B (ja)
WO (1) WO2014132947A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018009237A (ja) * 2016-07-15 2018-01-18 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
KR101944783B1 (ko) 2017-01-16 2019-04-18 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
TWI745574B (zh) * 2017-03-29 2021-11-11 日商昭和電工材料股份有限公司 無芯基板用預浸體、無芯基板、無芯基板的製造方法及半導體封裝體
KR102137068B1 (ko) * 2019-11-27 2020-07-23 와이엠티 주식회사 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1984526A (zh) * 2005-12-15 2007-06-20 古河电路铜箔株式会社 带载体的极薄铜箔及印刷电路基板
CN1993501A (zh) * 2004-08-02 2007-07-04 日本电解株式会社 复合铜箔及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089892A (ja) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
US6893742B2 (en) * 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
LU90804B1 (fr) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) * 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4805300B2 (ja) * 2008-03-31 2011-11-02 古河電気工業株式会社 回路基板積層用キャリア付きＦｅ−Ｎｉ合金箔の製造方法、回路基板積層用キャリア付き複合箔の製造方法、キャリア付き合金箔、キャリア付き複合箔、金属張板、プリント配線板及びプリント配線積層板
JP4805304B2 (ja) * 2008-05-12 2011-11-02 Ｊｘ日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
KR101281146B1 (ko) * 2008-09-05 2013-07-02 후루카와 덴끼고교 가부시키가이샤 캐리어 부착 극박 동박, 및 동장 적층판 또는 프린트 배선 기판
TWI561138B (en) * 2011-03-30 2016-12-01 Mitsui Mining & Smelting Co Method of manufacturing multi-layer printed wiring board and multi-layer printed wiring board obtained by the manufacturing method
JP5666384B2 (ja) * 2011-05-31 2015-02-12 日本電解株式会社 支持体付極薄銅箔とその製造方法
EP2752505B1 (en) * 2011-08-31 2016-03-23 JX Nippon Mining & Metals Corporation Copper foil with carrier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1993501A (zh) * 2004-08-02 2007-07-04 日本电解株式会社 复合铜箔及其制造方法
CN1984526A (zh) * 2005-12-15 2007-06-20 古河电路铜箔株式会社 带载体的极薄铜箔及印刷电路基板

Also Published As

Publication number Publication date
CN105074058A (zh) 2015-11-18
JPWO2014132947A1 (ja) 2017-02-02
KR20150122632A (ko) 2015-11-02
WO2014132947A1 (ja) 2014-09-04
CN105074058B (zh) 2016-11-23
KR101664993B1 (ko) 2016-10-11
TW201437436A (zh) 2014-10-01
JP5755371B2 (ja) 2015-07-29

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