TWI593817B - Coating device - Google Patents

Coating device Download PDF

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Publication number
TWI593817B
TWI593817B TW102143002A TW102143002A TWI593817B TW I593817 B TWI593817 B TW I593817B TW 102143002 A TW102143002 A TW 102143002A TW 102143002 A TW102143002 A TW 102143002A TW I593817 B TWI593817 B TW I593817B
Authority
TW
Taiwan
Prior art keywords
substrate
vacuum chamber
base
moving
coating
Prior art date
Application number
TW102143002A
Other languages
English (en)
Chinese (zh)
Other versions
TW201430156A (zh
Inventor
Hiroyuki Tamura
Masanao Fujitsuka
Teiji Takahashi
Takashi Shibuya
Nobuaki SHIOIRI
Satoshi Takahashi
Keiji Uchida
Original Assignee
Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Publication of TW201430156A publication Critical patent/TW201430156A/zh
Application granted granted Critical
Publication of TWI593817B publication Critical patent/TWI593817B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW102143002A 2012-12-18 2013-11-26 Coating device TWI593817B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012275613A JP6008731B2 (ja) 2012-12-18 2012-12-18 成膜装置

Publications (2)

Publication Number Publication Date
TW201430156A TW201430156A (zh) 2014-08-01
TWI593817B true TWI593817B (zh) 2017-08-01

Family

ID=50978214

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143002A TWI593817B (zh) 2012-12-18 2013-11-26 Coating device

Country Status (4)

Country Link
JP (1) JP6008731B2 (ko)
KR (1) KR101968801B1 (ko)
TW (1) TWI593817B (ko)
WO (1) WO2014097879A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665380B1 (ko) * 2015-05-26 2016-10-13 주식회사 선익시스템 기판 증착 챔버 및 그를 구비한 기판 증착 시스템
KR101840976B1 (ko) * 2017-07-26 2018-03-21 캐논 톡키 가부시키가이샤 이동체 지지장치와, 이를 포함한 진공 증착 장치 및 증착 방법
JP7316782B2 (ja) * 2018-12-14 2023-07-28 キヤノントッキ株式会社 蒸着装置、電子デバイスの製造装置、および、蒸着方法
JP7379072B2 (ja) * 2019-01-11 2023-11-14 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
JP7299725B2 (ja) * 2019-03-15 2023-06-28 キヤノントッキ株式会社 成膜装置、成膜システム
JP2021095609A (ja) * 2019-12-18 2021-06-24 キヤノントッキ株式会社 成膜装置、成膜方法及び電子デバイスの製造方法
JP2022032234A (ja) * 2020-08-11 2022-02-25 キヤノントッキ株式会社 回転成膜装置および電子デバイスの製造方法
JP7379396B2 (ja) * 2021-01-08 2023-11-14 キヤノントッキ株式会社 成膜装置、搬送方法、成膜方法及び電子デバイス製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181821A (ja) * 1999-12-20 2001-07-03 Murata Mfg Co Ltd 真空成膜装置
TW583330B (en) * 2001-03-19 2004-04-11 Shin Meiwa Ind Co Ltd Vacuum deposition system
TW201247912A (en) * 2011-02-10 2012-12-01 Canon Tokki Corp Deposition apparatus and deposition method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4704605B2 (ja) 2001-05-23 2011-06-15 淳二 城戸 連続蒸着装置、蒸着装置及び蒸着方法
JP5277060B2 (ja) 2009-04-16 2013-08-28 株式会社日立ハイテクノロジーズ 真空蒸着装置
JP5854731B2 (ja) * 2010-11-04 2016-02-09 キヤノン株式会社 成膜装置及びこれを用いた成膜方法
JP5717439B2 (ja) * 2010-12-27 2015-05-13 キヤノンアネルバ株式会社 基板搬送装置及び真空処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181821A (ja) * 1999-12-20 2001-07-03 Murata Mfg Co Ltd 真空成膜装置
TW583330B (en) * 2001-03-19 2004-04-11 Shin Meiwa Ind Co Ltd Vacuum deposition system
TW201247912A (en) * 2011-02-10 2012-12-01 Canon Tokki Corp Deposition apparatus and deposition method

Also Published As

Publication number Publication date
JP6008731B2 (ja) 2016-10-19
WO2014097879A1 (ja) 2014-06-26
TW201430156A (zh) 2014-08-01
JP2014118611A (ja) 2014-06-30
KR20150096438A (ko) 2015-08-24
KR101968801B1 (ko) 2019-04-12

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