TWI592312B - 噴嘴板、噴嘴板製造方法、噴墨頭、以及噴墨列印裝置 - Google Patents
噴嘴板、噴嘴板製造方法、噴墨頭、以及噴墨列印裝置 Download PDFInfo
- Publication number
- TWI592312B TWI592312B TW102126682A TW102126682A TWI592312B TW I592312 B TWI592312 B TW I592312B TW 102126682 A TW102126682 A TW 102126682A TW 102126682 A TW102126682 A TW 102126682A TW I592312 B TWI592312 B TW I592312B
- Authority
- TW
- Taiwan
- Prior art keywords
- nozzle
- substrate
- discharge port
- nozzle plate
- flow path
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 238000007641 inkjet printing Methods 0.000 title claims description 24
- 239000000758 substrate Substances 0.000 claims description 171
- 238000000034 method Methods 0.000 claims description 58
- 238000005520 cutting process Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- 239000003989 dielectric material Substances 0.000 claims description 5
- 239000000976 ink Substances 0.000 description 107
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 36
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 36
- 239000011521 glass Substances 0.000 description 36
- 238000007639 printing Methods 0.000 description 27
- 239000000075 oxide glass Substances 0.000 description 21
- 229910000420 cerium oxide Inorganic materials 0.000 description 20
- 238000007599 discharging Methods 0.000 description 20
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 239000010408 film Substances 0.000 description 18
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 230000007246 mechanism Effects 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 238000001000 micrograph Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000003595 mist Substances 0.000 description 8
- 239000003599 detergent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000004506 ultrasonic cleaning Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241000412298 Harma Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000010407 vacuum cleaning Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/16—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass plates with holes of very small diameter, e.g. for spinning or burner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Coating Apparatus (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Nozzles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012170502A JP6048794B2 (ja) | 2012-07-31 | 2012-07-31 | ノズルプレート、ノズルプレートの製造方法、インクジェットヘッド及びインクジェット印刷装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201408498A TW201408498A (zh) | 2014-03-01 |
| TWI592312B true TWI592312B (zh) | 2017-07-21 |
Family
ID=50027878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102126682A TWI592312B (zh) | 2012-07-31 | 2013-07-25 | 噴嘴板、噴嘴板製造方法、噴墨頭、以及噴墨列印裝置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9481173B2 (https=) |
| EP (1) | EP2879879B1 (https=) |
| JP (1) | JP6048794B2 (https=) |
| KR (1) | KR101690893B1 (https=) |
| CN (1) | CN104507686B (https=) |
| IN (1) | IN2014KN02996A (https=) |
| TW (1) | TWI592312B (https=) |
| WO (1) | WO2014021200A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170021770A (ko) * | 2014-06-25 | 2017-02-28 | 인텔 코포레이션 | 집적 수동 소자들을 형성하기 위한 기법들 |
| EP3000602B1 (en) * | 2014-09-26 | 2020-07-22 | Agfa Nv | High viscosity jetting method |
| JP6575102B2 (ja) | 2015-03-27 | 2019-09-18 | 株式会社リコー | 液滴吐出装置 |
| CH711295B1 (fr) * | 2015-07-06 | 2019-11-29 | Cartier Int Ag | Procédé de fixation par assemblage anodique. |
| EP3125296B1 (en) | 2015-07-30 | 2020-06-10 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
| US10600916B2 (en) | 2015-12-08 | 2020-03-24 | Ricoh Company, Ltd. | Field-effect transistor, display element, image display device, and system |
| JP6607013B2 (ja) | 2015-12-08 | 2019-11-20 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| JP6701835B2 (ja) | 2016-03-11 | 2020-05-27 | 株式会社リコー | 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム |
| CN105750848B (zh) * | 2016-05-18 | 2017-10-17 | 昆山精诚得精密五金模具有限公司 | 相贯面带微细孔的金属喷嘴套的加工方法 |
| EP3962746B1 (en) | 2019-05-02 | 2025-01-15 | The Board Of Trustees Of The University Of Illinois | Atomic-to-nanoscale matter emission/flow regulation devices and methods |
| KR102474000B1 (ko) * | 2022-03-07 | 2022-12-05 | 주식회사피에스디이 | 나노 임프린팅을 위한 디스펜서 및 그 제조 방법 |
| JP2023167238A (ja) * | 2022-05-11 | 2023-11-24 | 日本発條株式会社 | マルチノズルと、マルチノズルを用いた流動体の塗布方法 |
| KR20240017222A (ko) * | 2022-07-28 | 2024-02-07 | 삼성디스플레이 주식회사 | 잉크젯 헤드 및 이를 포함하는 잉크젯 프린팅 장치 |
| KR20250043629A (ko) * | 2023-09-21 | 2025-03-31 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1019084B (zh) * | 1989-09-18 | 1992-11-18 | 佳能公司 | 喷墨记录头、喷墨盒和喷墨装置 |
| DE69219168T2 (de) * | 1991-01-18 | 1997-10-02 | Canon Kk | Tintenstrahleinheit mit Öffnungen und Aufzeichnungsgerät, welches diese verwendet |
| JP3192720B2 (ja) * | 1991-01-18 | 2001-07-30 | キヤノン株式会社 | 複数吐出部を備えた液体噴射器およびこれを用いた記録装置 |
| JPH05177834A (ja) * | 1991-06-04 | 1993-07-20 | Seiko Epson Corp | インクジェット記録ヘッド |
| US6527369B1 (en) * | 1995-10-25 | 2003-03-04 | Hewlett-Packard Company | Asymmetric printhead orifice |
| JP3738790B2 (ja) | 1996-07-26 | 2006-01-25 | セイコーエプソン株式会社 | インクジェット記録ヘッドの構成部材の開口穿孔方法 |
| JP4352589B2 (ja) * | 2000-06-20 | 2009-10-28 | コニカミノルタホールディングス株式会社 | 剪断モード型インクジェットヘッドの作製方法 |
| SE0003799D0 (sv) * | 2000-10-20 | 2000-10-20 | Aamic Ab | Method of makin gholes and structures comprising such holes |
| DE60331453D1 (de) * | 2002-09-24 | 2010-04-08 | Konica Minolta Holdings Inc | Kopfs mit elektrostatischer anziehung, verfahren zur herstellung einer düsenplatte |
| JP4218949B2 (ja) | 2002-09-24 | 2009-02-04 | コニカミノルタホールディングス株式会社 | 静電吸引型液体吐出ヘッドの製造方法、ノズルプレートの製造方法、静電吸引型液体吐出ヘッドの駆動方法及び静電吸引型液体吐出装置 |
| JP3680855B2 (ja) | 2003-03-31 | 2005-08-10 | 財団法人北九州産業学術推進機構 | 静電誘引式液滴ノズルおよびその製造方法 |
| JP3892423B2 (ja) | 2003-08-29 | 2007-03-14 | シャープ株式会社 | ノズルプレートおよびその製造方法 |
| CN100526080C (zh) * | 2004-07-15 | 2009-08-12 | 株式会社理光 | 液体喷头及其制造方法、图像形成装置 |
| JP2007090862A (ja) * | 2005-08-29 | 2007-04-12 | Fujifilm Corp | ノズル板の製造方法、液体吐出ヘッドの製造方法、および、ノズル板製造用の母型構造 |
| JP2007098888A (ja) * | 2005-10-07 | 2007-04-19 | Seiko Epson Corp | ノズル基板の製造方法、液滴吐出ヘッドの製造方法及び液滴吐出装置の製造方法 |
| JP2007335460A (ja) * | 2006-06-12 | 2007-12-27 | Canon Inc | デバイスパターン形成方法、デバイスパターン、およびデバイスパターン形成装置 |
| WO2008090794A1 (ja) * | 2007-01-23 | 2008-07-31 | Konica Minolta Holdings, Inc. | 液体吐出ヘッド用ノズルプレート及び液体吐出ヘッド用ノズルプレートの製造方法 |
| JP4916008B2 (ja) * | 2007-03-09 | 2012-04-11 | 株式会社ミマキエンジニアリング | 三次元プリンタ |
| JP2009125968A (ja) * | 2007-11-20 | 2009-06-11 | Seiko Epson Corp | ノズル基板の製造方法、および液体噴射装置 |
| WO2010051247A2 (en) | 2008-10-31 | 2010-05-06 | Fujifilm Dimatix, Inc. | Shaping a nozzle outlet |
| US20100187667A1 (en) * | 2009-01-28 | 2010-07-29 | Fujifilm Dimatix, Inc. | Bonded Microelectromechanical Assemblies |
| JP2010214923A (ja) * | 2009-03-19 | 2010-09-30 | Seiko Epson Corp | ノズル基板の製造方法、その製造方法で製造されたノズル基板、液滴吐出ヘッドの製造方法、その製造方法で製造された液滴吐出ヘッド及び液滴吐出装置 |
| US8205338B2 (en) * | 2009-08-20 | 2012-06-26 | Eastman Kodak Company | Method of making a multi-lobed nozzle |
-
2012
- 2012-07-31 JP JP2012170502A patent/JP6048794B2/ja active Active
-
2013
- 2013-07-19 US US14/412,827 patent/US9481173B2/en active Active
- 2013-07-19 KR KR1020157002266A patent/KR101690893B1/ko not_active Expired - Fee Related
- 2013-07-19 IN IN2996KON2014 patent/IN2014KN02996A/en unknown
- 2013-07-19 WO PCT/JP2013/070255 patent/WO2014021200A1/en not_active Ceased
- 2013-07-19 EP EP13825001.4A patent/EP2879879B1/en active Active
- 2013-07-19 CN CN201380040170.6A patent/CN104507686B/zh active Active
- 2013-07-25 TW TW102126682A patent/TWI592312B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150033704A (ko) | 2015-04-01 |
| EP2879879A1 (en) | 2015-06-10 |
| EP2879879A4 (en) | 2017-03-15 |
| CN104507686B (zh) | 2017-03-15 |
| CN104507686A (zh) | 2015-04-08 |
| IN2014KN02996A (https=) | 2015-05-08 |
| EP2879879B1 (en) | 2024-01-17 |
| KR101690893B1 (ko) | 2016-12-28 |
| JP6048794B2 (ja) | 2016-12-21 |
| US20150158300A1 (en) | 2015-06-11 |
| US9481173B2 (en) | 2016-11-01 |
| WO2014021200A1 (en) | 2014-02-06 |
| TW201408498A (zh) | 2014-03-01 |
| JP2014028351A (ja) | 2014-02-13 |
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