TWI590415B - 光電模組，特別為閃光燈模組及其製造方法 - Google Patents

光電模組，特別為閃光燈模組及其製造方法 Download PDF

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Publication number
TWI590415B
TWI590415B TW101148994A TW101148994A TWI590415B TW I590415 B TWI590415 B TW I590415B TW 101148994 A TW101148994 A TW 101148994A TW 101148994 A TW101148994 A TW 101148994A TW I590415 B TWI590415 B TW I590415B
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TW
Taiwan
Prior art keywords
wafer
light
members
emitting
optical
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TW101148994A
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English (en)
Chinese (zh)
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TW201342573A (zh
Inventor
哈馬特 盧德曼
馬克思 羅西
瑞尼 克羅霍夫
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新加坡恒立私人有限公司
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Publication of TW201342573A publication Critical patent/TW201342573A/zh
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Publication of TWI590415B publication Critical patent/TWI590415B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Stroboscope Apparatuses (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Control For Cameras (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
TW101148994A 2011-12-22 2012-12-21 光電模組，特別為閃光燈模組及其製造方法 TWI590415B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161579293P 2011-12-22 2011-12-22

Publications (2)

Publication Number Publication Date
TW201342573A TW201342573A (zh) 2013-10-16
TWI590415B true TWI590415B (zh) 2017-07-01

Family

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Family Applications (1)

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TW101148994A TWI590415B (zh) 2011-12-22 2012-12-21 光電模組，特別為閃光燈模組及其製造方法

Country Status (8)

Country Link
US (1) US10431571B2 (https=)
EP (1) EP2795674B1 (https=)
JP (1) JP6338533B2 (https=)
KR (1) KR102177372B1 (https=)
CN (1) CN104106135B (https=)
SG (2) SG11201403240UA (https=)
TW (1) TWI590415B (https=)
WO (1) WO2013091829A1 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2870240B2 (ja) 1991-08-09 1999-03-17 株式会社デンソー 内燃機関の空燃比制御装置
TWI481496B (zh) * 2007-12-19 2015-04-21 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
DE102011113483B4 (de) * 2011-09-13 2023-10-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement
KR101888447B1 (ko) * 2012-05-22 2018-08-16 엘지디스플레이 주식회사 유기 전계 발광 표시 패널의 제조 방법
WO2014098768A1 (en) * 2012-12-20 2014-06-26 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules with masking feature for reducing the visibility of interior components
CN104123179A (zh) 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
TWI527166B (zh) * 2013-07-25 2016-03-21 菱生精密工業股份有限公司 The package structure of the optical module
US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
KR102138510B1 (ko) * 2013-08-27 2020-07-28 엘지전자 주식회사 근접 터치 기능을 구비한 전자 장치 및 그 제어 방법
US9746349B2 (en) 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US10403671B2 (en) 2013-12-10 2019-09-03 Ams Sensors Singapore Pte. Ltd. Wafer-level optical modules and methods for manufacturing the same
EP2955759B1 (en) 2014-06-11 2018-09-05 ams AG Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
US9711552B2 (en) 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
KR102309671B1 (ko) * 2015-01-30 2021-10-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 조명 장치
US9606308B2 (en) 2015-02-27 2017-03-28 International Business Machines Corporation Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow
CN104916627B (zh) * 2015-05-29 2019-05-03 鸿利智汇集团股份有限公司 一种手机拍照闪光灯
CN106200212A (zh) * 2015-05-29 2016-12-07 高准精密工业股份有限公司 闪光灯装置
US20170047362A1 (en) 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
EP3370269B1 (en) * 2015-10-29 2021-05-05 KYOCERA Corporation Light irradiation device and light irradiation system
WO2017127023A1 (en) * 2016-01-20 2017-07-27 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having fluid permeable channels and methods for manufacturing the same
KR102473668B1 (ko) 2016-03-02 2022-12-01 삼성전자주식회사 발광 소자 실장 기판 및 이를 이용한 발광 패키지
JP2017175004A (ja) 2016-03-24 2017-09-28 ソニー株式会社 チップサイズパッケージ、製造方法、電子機器、および内視鏡
CN109155258B (zh) * 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
US10461066B2 (en) * 2016-06-29 2019-10-29 Maxim Integrated Products, Inc. Structure and method for hybrid optical package with glass top cover
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
US10429321B2 (en) * 2016-08-29 2019-10-01 Kla-Tencor Corporation Apparatus for high-speed imaging sensor data transfer
JP2018060989A (ja) * 2016-10-04 2018-04-12 日本特殊陶業株式会社 枠体部材、発光装置、およびこれらの製造方法
JP2018085368A (ja) * 2016-11-21 2018-05-31 日本特殊陶業株式会社 蓋部材、該蓋部材を用いた発光装置、およびこれらの製造方法
CN106764558A (zh) * 2016-12-07 2017-05-31 东莞中之光电股份有限公司 一种csp照明闪光模组生产工艺
CN118117024A (zh) * 2017-03-21 2024-05-31 Lg 伊诺特有限公司 半导体元件封装和自动聚焦装置
DE102017109079B4 (de) * 2017-04-27 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Bauteil mit solch einem Bauelement
CN107845627B (zh) * 2017-09-29 2020-02-18 深圳奥比中光科技有限公司 多接近度检测光传感器
FR3073120A1 (fr) * 2017-11-02 2019-05-03 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique
FR3075467B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
CN112074760B (zh) * 2017-12-27 2025-04-08 ams传感器新加坡私人有限公司 光电模块及其操作方法
CN108364909B (zh) * 2018-01-19 2021-01-26 西安中为光电科技有限公司 一种具有发射和接收光信号功能的芯片及其制作方法
WO2020038179A1 (zh) * 2018-08-24 2020-02-27 宁波舜宇光电信息有限公司 电路板组件及其半成品、泛光灯、摄像模组及其应用
CN109887421A (zh) * 2018-12-27 2019-06-14 李宗杰 距离传感器放置于电子显示器下的应用
JP6951644B2 (ja) * 2019-04-23 2021-10-20 日亜化学工業株式会社 発光モジュール及びその製造方法
KR102721974B1 (ko) * 2019-08-07 2024-10-28 삼성전자주식회사 광 센서 일체형 플래시 led 패키지
JP7558777B2 (ja) * 2020-12-02 2024-10-01 シャープ福山レーザー株式会社 画像表示素子
JP7381903B2 (ja) * 2021-03-31 2023-11-16 日亜化学工業株式会社 発光装置
US12222240B2 (en) 2021-06-02 2025-02-11 Luminar Technologies, Inc. Protective mask for an optical receiver
US11953722B2 (en) * 2021-06-02 2024-04-09 Luminar Technologies, Inc. Protective mask for an optical receiver
US12601583B2 (en) 2023-05-17 2026-04-14 Apple Inc. Multi-channel self-mixing interferometric sensor

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6550949B1 (en) * 1996-06-13 2003-04-22 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
JP4050802B2 (ja) * 1996-08-02 2008-02-20 シチズン電子株式会社 カラー表示装置
US5912872A (en) 1996-09-27 1999-06-15 Digital Optics Corporation Integrated optical apparatus providing separated beams on a detector and associated methods
US20080136955A1 (en) * 1996-09-27 2008-06-12 Tessera North America. Integrated camera and associated methods
JP4288553B2 (ja) * 2000-07-25 2009-07-01 富士フイルム株式会社 カメラのストロボ装置
WO2002061486A1 (en) 2000-12-19 2002-08-08 Coventor, Incorporated Bulk micromachining process for fabricating an optical mems device with integrated optical aperture
US6617795B2 (en) 2001-07-26 2003-09-09 Koninklijke Philips Electronics N.V. Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
JP4750983B2 (ja) * 2001-09-21 2011-08-17 シチズン電子株式会社 双方向光伝送デバイス
US6764158B2 (en) 2001-10-02 2004-07-20 Hewlett-Packard Development Company, L.P. Compact optical sensing system
US7224856B2 (en) * 2001-10-23 2007-05-29 Digital Optics Corporation Wafer based optical chassis and associated methods
US7002546B1 (en) 2002-05-15 2006-02-21 Rockwell Collins, Inc. Luminance and chromaticity control of an LCD backlight
JP4504662B2 (ja) * 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
US7667766B2 (en) * 2003-12-18 2010-02-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Adjustable spectrum flash lighting for image acquisition
JP2005241340A (ja) 2004-02-25 2005-09-08 Sharp Corp マルチ測距装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
JP2006038572A (ja) * 2004-07-26 2006-02-09 Sharp Corp 反射型エンコーダおよびこの反射型エンコーダを用いた電子機器
JP2006049657A (ja) * 2004-08-06 2006-02-16 Citizen Electronics Co Ltd Ｌｅｄランプ
US7474294B2 (en) * 2004-09-07 2009-01-06 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Use of a plurality of light sensors to regulate a direct-firing backlight for a display
US7679672B2 (en) 2004-10-14 2010-03-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material
US7259853B2 (en) * 2004-12-22 2007-08-21 Xerox Corporation Systems and methods for augmenting spectral range of an LED spectrophotometer
JP4955953B2 (ja) 2005-07-28 2012-06-20 シャープ株式会社 光半導体装置および電子機器
US7385178B2 (en) 2005-10-26 2008-06-10 Avago Technologies Ecbu Ip Pte Ltd Reflective encoders with various emitter-detector configurations
US7646974B2 (en) 2006-09-22 2010-01-12 Sony Ericsson Mobile Communications Ab Color adjustment for camera
EP2017890B1 (en) 2007-06-07 2015-10-07 Cfg S.A. White-light LED-based device
RU2543987C2 (ru) 2007-10-09 2015-03-10 Филипс Солид-Стейт Лайтинг Солюшнз Инк. Сборное осветительное устройство на основе сид для общего освещения
EP2220684A1 (en) 2007-11-27 2010-08-25 Heptagon Oy Encapsulated lens stack
TWI478808B (zh) 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TWI505703B (zh) 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
TW201000819A (en) 2008-06-30 2010-01-01 Create Electronic Optical Co Ltd LED illumination device
US8324602B2 (en) * 2009-04-14 2012-12-04 Intersil Americas Inc. Optical sensors that reduce specular reflections
JP2011204659A (ja) * 2009-04-27 2011-10-13 Toshiba Lighting & Technology Corp 照明装置
CN101929651B (zh) 2009-05-25 2016-08-03 Lg伊诺特有限公司 间隙构件、透镜以及具有间隙构件和透镜的照明装置
US8779361B2 (en) 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
US8143608B2 (en) 2009-09-10 2012-03-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Package-on-package (POP) optical proximity sensor
US9293667B2 (en) * 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
JP2011204397A (ja) 2010-03-24 2011-10-13 Sony Corp 照明装置
US8866064B2 (en) * 2011-07-26 2014-10-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-directional proximity sensor
TWI567953B (zh) * 2011-12-20 2017-01-21 新加坡恒立私人有限公司 光電模組及包含該模組之裝置

Also Published As

Publication number Publication date
KR20140121398A (ko) 2014-10-15
CN104106135B (zh) 2018-02-23
WO2013091829A1 (en) 2013-06-27
EP2795674A1 (en) 2014-10-29
EP2795674B1 (en) 2021-12-15
SG10201605065QA (en) 2016-08-30
KR102177372B1 (ko) 2020-11-12
TW201342573A (zh) 2013-10-16
CN104106135A (zh) 2014-10-15
JP2015508509A (ja) 2015-03-19
JP6338533B2 (ja) 2018-06-06
SG11201403240UA (en) 2014-07-30
US10431571B2 (en) 2019-10-01
US20140361200A1 (en) 2014-12-11

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