TWI584359B - 基板清潔裝置及具備其之基板處理裝置 - Google Patents

基板清潔裝置及具備其之基板處理裝置 Download PDF

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Publication number
TWI584359B
TWI584359B TW102110388A TW102110388A TWI584359B TW I584359 B TWI584359 B TW I584359B TW 102110388 A TW102110388 A TW 102110388A TW 102110388 A TW102110388 A TW 102110388A TW I584359 B TWI584359 B TW I584359B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
end portion
holding
holding members
Prior art date
Application number
TW102110388A
Other languages
English (en)
Chinese (zh)
Other versions
TW201351490A (zh
Inventor
西山耕二
Original Assignee
斯克林半導體科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林半導體科技有限公司 filed Critical 斯克林半導體科技有限公司
Publication of TW201351490A publication Critical patent/TW201351490A/zh
Application granted granted Critical
Publication of TWI584359B publication Critical patent/TWI584359B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW102110388A 2012-03-27 2013-03-22 基板清潔裝置及具備其之基板處理裝置 TWI584359B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012072456A JP6001896B2 (ja) 2012-03-27 2012-03-27 基板洗浄装置およびそれを備えた基板処理装置

Publications (2)

Publication Number Publication Date
TW201351490A TW201351490A (zh) 2013-12-16
TWI584359B true TWI584359B (zh) 2017-05-21

Family

ID=49234581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102110388A TWI584359B (zh) 2012-03-27 2013-03-22 基板清潔裝置及具備其之基板處理裝置

Country Status (4)

Country Link
US (1) US9623450B2 (enExample)
JP (1) JP6001896B2 (enExample)
KR (1) KR101946652B1 (enExample)
TW (1) TWI584359B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9821348B2 (en) * 2013-10-22 2017-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for water edge exposure and backside cleaning
CN104238158B (zh) * 2014-09-23 2017-02-08 深圳市华星光电技术有限公司 一种升降装置以及升降系统
JP6543534B2 (ja) * 2015-08-26 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6726575B2 (ja) 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6626392B2 (ja) 2016-03-30 2019-12-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
JP6887371B2 (ja) * 2017-12-20 2021-06-16 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
US11600484B2 (en) * 2019-08-22 2023-03-07 Taiwan Semiconductor Manufacturing Company Ltd. Cleaning method, semiconductor manufacturing method and a system thereof
TWI789842B (zh) * 2020-09-11 2023-01-11 日商芝浦機械電子裝置股份有限公司 基板處理裝置
JP7564693B2 (ja) 2020-11-26 2024-10-09 株式会社Ｓｃｒｅｅｎホールディングス 下面ブラシ、ブラシユニットおよび基板洗浄装置
KR102535766B1 (ko) * 2021-08-24 2023-05-26 (주)디바이스이엔지 백 노즐 어셈블리를 포함하는 기판 처리장치
JP7892508B2 (ja) * 2022-09-22 2026-07-21 芝浦メカトロニクス株式会社 洗浄装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040016452A1 (en) * 2000-10-31 2004-01-29 Junji Kunisawa Holding unit, processing apparatus and holding method of substrates
US20090173364A1 (en) * 2008-01-08 2009-07-09 Sokudo Co., Ltd. Substrate processing apparatus and substrate processing method using the same
US20110290283A1 (en) * 2010-05-25 2011-12-01 Lam Research Ag Closed chamber with fluid separation feature

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Publication number Priority date Publication date Assignee Title
JPH08108125A (ja) * 1994-10-13 1996-04-30 Sony Disc Technol:Kk 液供給装置
JP3219375B2 (ja) * 1997-02-03 2001-10-15 大日本スクリーン製造株式会社 スクラブ洗浄部材およびそれを用いた基板処理装置、ならびに洗浄用ブラシ
JP3794808B2 (ja) * 1998-01-12 2006-07-12 大日本スクリーン製造株式会社 基板処理装置
JP2002164314A (ja) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd 回転支持板およびそれを用いた基板処理装置
JP2006156520A (ja) * 2004-11-26 2006-06-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4939376B2 (ja) 2007-11-13 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4547016B2 (ja) 2008-04-04 2010-09-22 東京エレクトロン株式会社 半導体製造装置、半導体製造方法
JP5430873B2 (ja) * 2008-04-16 2014-03-05 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
JP5143657B2 (ja) * 2008-07-24 2013-02-13 東京エレクトロン株式会社 液処理装置
JP5437168B2 (ja) 2009-08-07 2014-03-12 東京エレクトロン株式会社 基板の液処理装置および液処理方法
JP5699297B2 (ja) 2010-04-28 2015-04-08 株式会社ユーテック 基板処理装置及び薄膜の製造方法
US9548223B2 (en) * 2011-12-23 2017-01-17 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040016452A1 (en) * 2000-10-31 2004-01-29 Junji Kunisawa Holding unit, processing apparatus and holding method of substrates
US20090173364A1 (en) * 2008-01-08 2009-07-09 Sokudo Co., Ltd. Substrate processing apparatus and substrate processing method using the same
US20110290283A1 (en) * 2010-05-25 2011-12-01 Lam Research Ag Closed chamber with fluid separation feature

Also Published As

Publication number Publication date
JP6001896B2 (ja) 2016-10-05
JP2013206993A (ja) 2013-10-07
TW201351490A (zh) 2013-12-16
US20130258300A1 (en) 2013-10-03
US9623450B2 (en) 2017-04-18
KR20130110041A (ko) 2013-10-08
KR101946652B1 (ko) 2019-02-11

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