TWI583029B - 處理半導體結構之方法 - Google Patents

處理半導體結構之方法 Download PDF

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Publication number
TWI583029B
TWI583029B TW101130877A TW101130877A TWI583029B TW I583029 B TWI583029 B TW I583029B TW 101130877 A TW101130877 A TW 101130877A TW 101130877 A TW101130877 A TW 101130877A TW I583029 B TWI583029 B TW I583029B
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TW
Taiwan
Prior art keywords
wafer
substrate
bonding
semiconductor structure
type region
Prior art date
Application number
TW101130877A
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English (en)
Chinese (zh)
Other versions
TW201318229A (zh
Inventor
傑若米 荃朵拉 海特
丹尼爾 亞歷山卓 史帝格沃
麥可 大衛 坎拉斯
趙漢何
納坦 法蘭德里克 賈諾
歐樂 波里索維奇 喬利金
Original Assignee
皇家飛利浦電子股份有限公司
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Publication of TW201318229A publication Critical patent/TW201318229A/zh
Application granted granted Critical
Publication of TWI583029B publication Critical patent/TWI583029B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
  • Laser Beam Processing (AREA)
TW101130877A 2011-08-26 2012-08-24 處理半導體結構之方法 TWI583029B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161527634P 2011-08-26 2011-08-26

Publications (2)

Publication Number Publication Date
TW201318229A TW201318229A (zh) 2013-05-01
TWI583029B true TWI583029B (zh) 2017-05-11

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW101130877A TWI583029B (zh) 2011-08-26 2012-08-24 處理半導體結構之方法
TW106103469A TWI635628B (zh) 2011-08-26 2012-08-24 處理半導體結構之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106103469A TWI635628B (zh) 2011-08-26 2012-08-24 處理半導體結構之方法

Country Status (7)

Country Link
US (1) US10056531B2 (https=)
EP (1) EP2748864B1 (https=)
JP (2) JP6305337B2 (https=)
KR (2) KR101965265B1 (https=)
CN (1) CN103748696B (https=)
TW (2) TWI583029B (https=)
WO (1) WO2013030718A1 (https=)

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EP2732478B1 (en) 2011-07-15 2018-09-19 Lumileds Holding B.V. Method of bonding a semiconductor device to a support substrate
WO2013118072A2 (en) 2012-02-10 2013-08-15 Koninklijke Philips N.V. Wavelength converted light emitting device
KR20170069240A (ko) * 2014-10-01 2017-06-20 코닌클리케 필립스 엔.브이. 조절가능한 방출 스펙트럼을 갖는 광원
US10217914B2 (en) 2015-05-27 2019-02-26 Samsung Electronics Co., Ltd. Semiconductor light emitting device
JP2017220479A (ja) * 2016-06-03 2017-12-14 株式会社ディスコ 発光ダイオードチップの製造方法
JP2017224726A (ja) * 2016-06-15 2017-12-21 株式会社ディスコ 発光ダイオードチップの製造方法
JP2017224728A (ja) * 2016-06-15 2017-12-21 株式会社ディスコ 発光ダイオードチップの製造方法
JP2018014425A (ja) * 2016-07-21 2018-01-25 株式会社ディスコ 発光ダイオードチップの製造方法
TWI759289B (zh) * 2017-03-21 2022-04-01 晶元光電股份有限公司 發光元件
US10559727B2 (en) * 2017-07-25 2020-02-11 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Manufacturing method of colorful Micro-LED, display modlue and terminals
CN109461805B (zh) * 2018-03-07 2021-08-10 普瑞光电股份有限公司 具有位于包含荧光体的玻璃转换板上的玻璃透镜的汽车led光源
DE112018007310T5 (de) 2018-03-21 2020-12-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische vorrichtung, die eine leuchtstoffplatte aufweist und verfahren zur herstellung der optoelektronischen vorrichtung
CN110544641A (zh) * 2018-05-28 2019-12-06 山东浪潮华光光电子股份有限公司 一种发光二极管芯片的测试方法
JP2019212875A (ja) * 2018-06-08 2019-12-12 信越半導体株式会社 発光素子及び発光素子の製造方法
JP7108196B2 (ja) 2019-12-26 2022-07-28 日亜化学工業株式会社 発光装置、波長変換部材の製造方法及び発光装置の製造方法
KR20210123064A (ko) * 2020-04-02 2021-10-13 웨이브로드 주식회사 3족 질화물 반도체 소자를 제조하는 방법

Citations (4)

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EP0611131A1 (en) * 1993-02-10 1994-08-17 Sharp Kabushiki Kaisha A method for producing a light-emitting diode having a transparent substrate
WO2005091390A1 (en) * 2004-03-18 2005-09-29 Showa Denko K.K. Group iii nitride semiconductor light-emitting device and producing method thereof
JP2007016171A (ja) * 2005-07-08 2007-01-25 Sharp Corp 波長変換部材、発光装置及び波長変換部材の製造方法
DE102008039790A1 (de) * 2008-08-26 2010-03-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung

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TWI231054B (en) * 2003-03-13 2005-04-11 Showa Denko Kk Light-emitting diode and its manufacturing method
WO2005050748A1 (ja) 2003-11-19 2005-06-02 Nichia Corporation 半導体素子及びその製造方法
JP4594708B2 (ja) * 2003-12-05 2010-12-08 昭和電工株式会社 発光ダイオードおよびその製造方法、発光ダイオードランプ。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611131A1 (en) * 1993-02-10 1994-08-17 Sharp Kabushiki Kaisha A method for producing a light-emitting diode having a transparent substrate
WO2005091390A1 (en) * 2004-03-18 2005-09-29 Showa Denko K.K. Group iii nitride semiconductor light-emitting device and producing method thereof
JP2007016171A (ja) * 2005-07-08 2007-01-25 Sharp Corp 波長変換部材、発光装置及び波長変換部材の製造方法
DE102008039790A1 (de) * 2008-08-26 2010-03-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
JP2016213490A (ja) 2016-12-15
TWI635628B (zh) 2018-09-11
KR102082499B1 (ko) 2020-02-27
JP6305337B2 (ja) 2018-04-04
JP2014525674A (ja) 2014-09-29
TW201318229A (zh) 2013-05-01
JP6294402B2 (ja) 2018-03-14
KR20190038671A (ko) 2019-04-08
CN103748696A (zh) 2014-04-23
EP2748864B1 (en) 2020-02-05
US10056531B2 (en) 2018-08-21
WO2013030718A1 (en) 2013-03-07
KR101965265B1 (ko) 2019-04-04
TW201717436A (zh) 2017-05-16
EP2748864A1 (en) 2014-07-02
CN103748696B (zh) 2018-06-22
KR20140053361A (ko) 2014-05-07
US20140179029A1 (en) 2014-06-26

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