TWI580752B - A circuit-connecting material, and a method of manufacturing the same - Google Patents

A circuit-connecting material, and a method of manufacturing the same Download PDF

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Publication number
TWI580752B
TWI580752B TW102107224A TW102107224A TWI580752B TW I580752 B TWI580752 B TW I580752B TW 102107224 A TW102107224 A TW 102107224A TW 102107224 A TW102107224 A TW 102107224A TW I580752 B TWI580752 B TW I580752B
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Taiwan
Prior art keywords
particles
adhesive composition
anisotropic conductive
resin
conductive film
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TW102107224A
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English (en)
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TW201400573A (zh
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Hiroshi Hamachi
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Description

電路連接材料、及使用其之構裝體之製造方法
本發明係關於一種分散有導電性粒子之電路連接材料、及使用其之構裝體之製造方法。本申請案係基於2012年3月2日於日本提出申請之日本專利申請編號特願2012-046982而主張優先權者，該申請係藉由參照而引用於本申請案中。
分散有導電性粒子之異向性導電膜(ACF，Anisotropic Cnductive Film)例如用作捲繞於具有凸緣之卷盤上之卷盤體。於該卷盤體中，異向性導電膜會根據例如溫度條件等而伸縮，由此產生卷裝體之捲緊。其結果，有異向性導電膜之樹脂層(接著劑成分)向沿樹脂層之長度方向之較寬度方向之一端更外側流動而自剝離基材之側面露出的情況。若樹脂層自剝離基材之側面伸出，則產生異向性導電膜中之樹脂層附著於卷盤之凸緣之側面而無法正常地抽出異向性導電膜之異常(以下稱為「黏連(blocking)」)。
於專利文獻1、2中記載有為了提高異向性導電膜之耐黏連性而填充微粒子，適度地抑制接著劑組成物之流動。然而，於接著劑組成物中填充有微粒子之情形時，有壓接時未對導電性粒子施加合適之壓力而使連接可靠性降低之擔憂。
[先前技術文獻] [專利文獻]
[專利文獻1]日本專利特開2010-183049號公報
[專利文獻2]日本專利特開2003-249287號公報
本發明係鑒於此種先前之實際情況而提出者，提供一種具有優異之耐黏連性，並且具有優異之連接可靠性之電路連接材料、及使用其之構裝體之製造方法。
本案發明者進行努力研究，結果發現藉由調配具有較高之壓縮恢復率之彈性體粒子，可改善耐黏連性及連接可靠性。
即，本發明之電路連接材料之特徵在於：於接著劑組成物中分散有壓縮恢復率為50%以上之彈性體粒子與導電性粒子。
又，本發明之構裝體之製造方法之特徵在於具有如下步驟：於第1電子零件之電極上依序配置含有膜形成樹脂、聚合性樹脂、聚合起始劑之接著劑組成物中分散有壓縮恢復率為50%以上之彈性體粒子與導電性粒子的異向性導電膜、及第2電子零件；及利用壓接頭自上述第2電子零件之上表面進行按壓。
本發明調配有具有較高壓縮恢復率之彈性體粒子，因此可緩和由捲緊而產生之卷壓，獲得優異之耐黏連性。又，可於壓接時對導電性粒子施加合適之壓力，因此可獲得較高之連接可靠性。
10‧‧‧接著劑組成物
11‧‧‧彈性體粒子
12‧‧‧導電性粒子
20‧‧‧剝離基材
30‧‧‧基板
40‧‧‧晶片
41‧‧‧凸塊
圖1係示意性表示捲繞於卷盤上之電路連接材料之剖面圖。
圖2係示意性表示壓接時彈性體粒子之平均粒徑之影響的剖面圖。
圖3係示意性表示本實施形態之壓接時之端子部分的剖面圖。
以下，對於本發明之實施形態一面參照圖式一面以下述順序詳細地進行說明。
1.電路連接材料及其製造方法
2.構裝體及其製造方法
3.實施例
<1.電路連接材料及其製造方法>
作為本發明之具體例而表示之電路連接材料係於接著劑組成物中分散具有較高壓縮恢復率之彈性體粒子與導電性粒子而構成。該電路連接材料為糊狀或膜形狀，可根據目的而適當選擇。
彈性體粒子之壓縮恢復率為50%以上。此處，壓縮恢復率係將彈性體粒子之直徑設為2a mm，將50%變形負荷時之彈性體粒子之厚度設為a mm，將解除負荷後之厚度設為b mm時，以(b-a)/a×100(%)而算出。
即，彈性體粒子具有可進行50%以上之變形之柔軟性。藉此，可於壓接時對導電性粒子施加合適之壓力，因此可獲得較高之連接可靠性。又，由於彈性體粒子之壓縮恢復率為50%以上，故可緩和由卷盤之捲緊而產生之卷壓，防止接著劑組成物附著於卷盤之凸緣之側面上而無法正常地抽出電路連接材料即黏連。
圖1係示意性表示捲繞於卷盤上之電路連接材料之剖面圖。如圖1所示，捲繞於卷盤上之電路連接材料被剝離基材20挾持。於本實施形態中，於接著劑組成物10中存在彈性體粒11，因此對於由於卷盤之捲緊而產生之卷壓，彈性體粒子11之欲恢復之力發揮作用。藉此，可緩和由卷盤之捲緊而產生之卷壓。
作為彈性體粒子，只要為滿足上述壓縮恢復率之條件者，則 並無特別限定，例如可列舉：聚胺基甲酸酯、聚苯乙烯等樹脂粒子。該等中，可較佳地使用聚胺基甲酸酯粒子。
彈性體粒子之平均粒徑較佳為導電性粒子之平均粒徑之0.2倍以上且5.0倍以下。藉此，可獲得優異之耐黏連性及連接可靠性。若彈性體粒子之平均粒徑小於導電性粒子之平均粒徑之0.2倍，則變得難以緩和由卷盤之捲緊而產生之卷壓，而降低耐黏連性。另一方面，若彈性體粒子之平均粒徑大於導電性粒子之平均粒徑之5.0倍，則變得難以於壓接時對導電性粒子施加合適之壓力，而降低連接可靠性。再者，平均粒徑例如可設為利用示差掃描電子顯微鏡所觀察之特定數量之彈性體粒子或導電性粒子之粒徑的平均值。
圖2及圖3係示意性表示壓接時之彈性體粒子之平均粒徑之影響的剖面圖。該圖2及圖3係表示藉由加熱加壓而使基板30上之配線與晶片40之凸塊41連接之情況。如圖2所示，於彈性體粒子11相對於導電性粒子12之平均粒徑充分較大之情形時，彈性體粒子11被凸塊41擠壓時之欲恢復之力較大，因此無法充分地擠壓導電性粒子12，連接電阻值上升。另一方面，藉由如本實施形態般使彈性體粒子之平均粒徑為導電性粒子之平均粒徑之0.2倍以上且5.0倍以下，可縮小彈性體粒子11被凸塊41擠壓時之欲恢復之力，而可充分地擠壓導電性粒子12。
彈性體粒子之含量相對於接著劑組成物較佳為1wt%以上且30wt%以下。藉此，可獲得優異之耐黏連性及連接可靠性。若彈性體粒子之含量相對於接著劑組成物未達1wt%，則變得難以緩和由卷盤之捲緊而產生之卷壓，而降低耐黏連性。另一方面，若彈性體粒子之含量相對於接著劑組成物超過30wt%，則壓接時接著劑組成物之流動性降低，變得難以自端子間排除導電性粒子，而降低連接可靠性。
又，本實施形態之接著劑組成物含有膜形成樹脂、聚合性樹 脂、聚合起始劑。
膜形成樹脂相當於平均分子量為10000以上之高分子量樹脂，就膜形成性之觀點而言，較佳為10000~80000左右之平均分子量。作為膜形成樹脂，可列舉：苯氧基樹脂、聚酯胺基甲酸樹脂、聚酯樹脂、聚胺基甲酸酯樹脂、丙烯酸系樹脂、聚醯亞胺樹脂、丁醛樹脂等各種樹脂，該等可單獨使用，亦可組合2種以上而使用。該等中，就膜形成狀態、連接可靠性等觀點而言，可較佳地使用苯氧基樹脂。膜形成樹脂之含量相對於接著劑組成物100質量份，通常為30~80質量份，較佳為40~70質量份。
聚合性樹脂為自由基聚合性樹脂、陽離子聚合性樹脂等，可根據用途而適當選擇。
自由基聚合性樹脂為具有藉由自由基而聚合之官能基之物質，可列舉：環氧丙烯酸酯、丙烯酸胺基甲酸酯、丙烯酸聚酯等，該等可單獨使用，亦可組合2種以上而使用。該等中，於本實施形態中可較佳地使用環氧丙烯酸酯。自由基聚合性樹脂之含量相對於接著劑組成物100質量份，通常為10~60質量份，較佳為20~50質量份。
使用自由基聚合性樹脂之情形之自由基聚合起始劑可使用公知者，其中，可較佳使用有機過氧化物。作為有機過氧化物，可列舉：過氧縮酮類、過氧化二醯基類、過氧化二碳酸酯類、過氧酯類、過氧化二烷基類、過氧化氫類、過氧化矽烷基類等，該等可單獨使用，亦可組合2種以上而使用。該等中，於本實施形態中可較佳地使用過氧縮酮類。自由基聚合起始劑之含量相對於自由基系接著劑組成物100質量份，通常為0.1~30質量份，較佳為1~20質量份。
陽離子聚合性樹脂可使用一官能性環氧化合物、含雜環環氧樹脂、脂肪族系環氧樹脂等。尤其是較佳為單獨或混合使用雙酚A型環氧樹脂、雙酚F型環氧樹脂、萘型環氧樹脂、酚醛清漆型環氧樹脂等環氧樹 脂。
使用陽離子聚合性樹脂之情形之陽離子硬化劑之陽離子種使環氧樹脂末端之環氧基開環，而使環氧樹脂彼此自我交聯。作為此種陽離子硬化劑，可列舉：芳香族鋶鹽、芳香族重氮鹽、錪鹽、鏻鹽、硒鹽等鎓鹽。尤其是芳香族鋶鹽於低溫下之反應性優異，而適用期較長，因此較佳作為陽離子硬化劑。
又，為了提高對無機基材之密接性，接著劑組成物較佳為進而含有矽烷偶合劑等。作為矽烷偶合劑，可列舉：甲基丙烯醯氧基系、環氧系、胺基系、乙烯基系、巰基-硫醚系、脲基系等，該等可單獨使用，亦可組合2種以上而使用。該等中，於本實施形態中可較佳地使用甲基丙烯醯氧基系矽烷偶合劑。
又，分散於接著劑組成物中之導電性粒子例如可使用鎳、金、銅等金屬粒子、對樹脂粒子實施鍍金等而成者等。又，就連接可靠性之觀點而言，導電性粒子之平均粒徑較佳為1~20μm，更佳為2~10μm。又，就連接可靠性及絕緣可靠性之觀點而言，接著劑組成物中導電性粒子之平均粒子密度較佳為1000~50000個/mm2，更佳為5000~30000個/mm2。
繼而，對由上述之電路連接材料所構成之異向性導電膜之製造方法進行說明。本實施形態之異向性導電膜之製造方法係使壓縮恢復率為50%以上之彈性體粒子與導電性粒子分散於含有膜形成樹脂、聚合性樹脂、聚合起始劑之接著劑組成物中。作為使該等溶解之有機溶劑，可使用甲苯、乙酸乙酯、或該等之混合溶劑、其他各種有機溶劑。
具體而言，首先，調整上述之電路連接材料後，使用棒式塗佈機、塗佈裝置等而於剝離基材上進行塗佈。剝離基材例如由將聚矽氧等剝離劑塗佈於PET(Polyethylene Terephthalate，聚對苯二甲酸乙二酯)、OPP(Oriented Polypropylene，延伸聚丙烯)、PMP(Poly-4-methylpentene-1，聚-4- 甲基戊烯)、PTFE(Polytetrafluoroethylene，聚四氟乙烯)等上之積層結構所構成，可防止異向性導電材料中之樹脂之乾燥，並且維持樹脂之形狀。
繼而，藉由熱烘箱、加熱乾燥裝置等而乾燥塗佈於剝離基材上之異向性導電材料。藉此，可製造厚度5~50μm左右之異向性導電膜。
又，於製造異向性導電膜之卷盤體之情形時，例如可切割異向性導電膜，一面使剝離基材之側面接觸凸緣之內表面，一面將該異向性導電膜捲取於捲取部上，藉此獲得卷盤體。
<2.構裝體之構裝方法>
繼而，對使用上述之電路連接材料之電子零件之構裝方法進行說明。本實施形態之電子零件之構裝方法具有如下步驟：於第1電子零件之電極上依序配置含有膜形成樹脂、聚合性樹脂、聚合起始劑之接著劑組成物中分散有壓縮恢復率為50%以上之彈性體粒子與導電性粒子的異向性導電膜、及第2電子零件；及利用壓接頭自第2電子零件之上表面進行按壓。藉此可一面使第1電子零件之電極與第2電子零件之電極經由導電性粒子而連接，一面使異向性導電膜硬化。
此處，作為第1電子零件，可列舉於玻璃基板上塗佈有IZO(Indium Zinc Oxide，氧化銦鋅)膜之IZO塗佈玻璃、於玻璃基板上塗佈有SiNx(氮化矽)膜之SiNx塗佈玻璃等。又，作為第2電子零件，可列舉COF(Chip On Film，薄膜覆晶)、IC(Integrated Circuit，積體電路)等。
本實施形態中，於接著劑組成物中含有壓縮恢復率為50%以上之彈性體粒子，因此可於壓接時對導電性粒子施加合適之壓力，可獲得較高之連接可靠性。
[實施例] <3.實施例>
以下，對本發明之實施例進行說明。此處，製作壓縮恢復率不同之聚 胺基甲酸酯粒子作為彈性體粒子。然後，製作含有聚胺基甲酸酯粒子之異向性導電膜之卷盤樣品。又，使用異向性導電膜而製作構裝體。作為評價項目，進行卷盤樣品之黏連試驗及構裝體之連接電阻之測定。再者，本發明並不限定於該等實施例。
壓縮恢復率之測定、黏連試驗之評價、及連接電阻之測定係以下述之方式進行。
[壓縮恢復率之測定]
使用Fischerscope H100C(Fischer Instruments製造)作為測定機器。於室溫之試樣台上，以壓縮速度0.33mN/秒對聚胺基甲酸酯粒子之中心方向施加荷重直至變形50%，保持5秒鐘後，以0.33mN/秒解除負荷。然後，將變形負荷前之聚胺基甲酸酯粒子之直徑設為2a mm，將50%變形負荷時之聚胺基甲酸酯粒子之厚度設為a mm，將解除負荷後放置30分鐘時之厚度設為b mm，以(b-a)/a×100(%)而算出。
[黏連試驗之評價]
將75g之鉛垂掛於卷盤樣品前端，於35℃之烘箱中放置3小時，其後抽出異向性導電膜，進行是否抽至最後之試驗。進行5卷試驗，將5卷全部良好地抽至最後之情形設為○，將即便1卷發生抽出不良之情形設為×。
[連接電阻之測定]
對構裝體使用數位萬用表(Digital Multimeter 7555，橫河電機公司製造)並利用4端子法測定流通1mA電流時之初期之連接電阻。
<3.1關於壓縮恢復率> [實施例1]
(聚胺基甲酸酯粒子之製作)
首先，製作聚胺基甲酸酯粒子。於離子交換水1000g中溶解作為懸浮穩定劑之磷酸三鈣30g而製成分散介質。於其中添加具有3個羥基之分子 量700之己內醯胺三醇70g、及具有3個異氰酸酯基之無黃變型之聚異氰酸酯100g，以600rpm攪拌30分鐘而製造懸浮液。將該懸浮液放入3L之燒瓶中並升溫至70℃，之後以250rpm反應6小時並進行冷卻，之後進行離心分離而進行固液分離。利用水對其進行充分地清洗並進行乾燥，獲得平均粒徑5μm之聚胺基甲酸酯粒子(PU-1)。測定該聚胺基甲酸酯粒子(PU-1)之壓縮恢復率，結果為90%。再者，平均粒徑係設為利用示差掃描電子顯微鏡所觀察之10個聚胺基甲酸酯粒子之粒徑的平均值。
(異向性導電膜之製作)
繼而，製作含有聚胺基甲酸酯粒子之異向性導電膜之卷盤樣品。於由苯氧基樹脂(品名：YP-50，東都化成公司製造)以固形物成分換算計60質量份、自由基聚合性樹脂(品名：EB-600，Daicel-Cytec公司製造)15質量份、及反應起始劑(品名：Perhexa C，日本油脂公司製造)2質量份所構成之接著劑組成物中，以平均粒子密度成為10000個/mm2之方式分散平均粒徑5μm之導電性粒子(品名：AUL704，積水化學工業公司製造)。又，填充相對於上述接著劑組成物為10wt%之平均粒徑5μm之聚胺基甲酸酯粒子(PU-1)。使用棒式塗佈機將該異向性導電連接材料塗佈於PET膜上，利用烘箱進行乾燥，製作厚度20μm之異向性導電膜。
(卷盤樣品之製作)
將異向性導電膜切割成1.5mm寬之長條，而製作於塑膠卷盤上捲取100M之卷盤樣品。
(構裝體之製作)
使用150μm厚之緩衝材(聚四氟乙烯)，並利用1.5mm寬之工具之預壓接機，於70℃-1MPa-1sec之條件下切割成1.5mm寬之長條的異向性導電膜預壓接於評價用玻璃基板(IZO(Indium Zinc Oxide)250nm塗佈玻璃)上。繼而，於80℃-0.5MPa-0.5sec之條件下，利用上述壓接機而預固定評 價用COF(50μmP，Cu8μmt-鍍Sn，38μmt)，最後於190℃-2MPa-10Sec之條件下，利用使用1.5mm寬之工具之正式壓接機而進行壓接，從而製作構裝體。
(評價結果)
於表1中表示實施例1之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.02Ω。
[實施例2]
添加具有2個異氰酸酯基之無黃變型之異佛爾酮二異氰酸酯100g，除此以外，以與實施例1相同之方式獲得平均粒徑5μm之聚胺基甲酸酯粒子(PU-2)。測定該聚胺基甲酸酯粒子(PU-2)之壓縮恢復率，結果為50%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子(PU-2)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表1中表示實施例2之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.12Ω。
[比較例1]
添加具有2個羥基之分子量2000之己內醯胺二醇70g，除此以外，以與實施例1相同之方式獲得平均粒徑5μm之聚胺基甲酸酯粒子(PU-3)。測定該聚胺基甲酸酯粒子(PU-3)之壓縮恢復率，結果為40%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子(PU-3)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表1中表示比較例1之評價結果。卷盤樣品之黏連試驗之結果為×。 又，連接電阻值為0.99Ω。
[比較例2]
使用Si填料代替聚胺基甲酸酯粒子。該Si填料(Si-1)之壓縮恢復率因填料破裂而無法測定。
又，以與實施例1相同之方式，製作含有Si填料(Si-1)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜並壓接評價用玻璃基板與評價用COF而製作構裝體。
(評價結果)
於表1中表示比較例2之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為4.05Ω。
如表1所示，使用壓縮恢復率未達50%之彈性體粒子之比較例1無法獲得優異之耐黏連性。又，未使用彈性體粒子之比較例2之連接電阻值上升。另一方面，可藉由如實施例1、2般使用壓縮恢復率為50%以上之彈性體粒子而提高耐黏連性。又，因對導電性粒子施加合適之壓力，故可降低構裝體之連接電阻值。
<3.2關於平均粒徑> [實施例3]
於離子交換水1000g中溶解作為懸浮穩定劑之磷酸三鈣70g而製成分散介質，除此以外，以與實施例1相同之方式獲得平均粒徑1μm之聚胺 基甲酸酯粒子(PU-4)。測定該聚胺基甲酸酯粒子(PU-4)之壓縮恢復率，結果為88%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子(PU-4)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表2中表示實施例3之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.04Ω。
[實施例4]
於離子交換水1000g中溶解作為懸浮穩定劑之磷酸三鈣5g而製成分散介質，除此以外，以與實施例1相同之方式獲得平均粒徑20μm之聚胺基甲酸酯粒子(PU-5)。測定該聚胺基甲酸酯粒子(PU-5)之壓縮恢復率，結果為84%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子(PU-5)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表2中表示實施例4之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.06Ω。
[比較例3]
於離子交換水1000g中溶解作為懸浮穩定劑之磷酸三鈣80g而製作分散介質，除此以外，以與實施例1相同之方式獲得平均粒徑0.5μm之聚胺基甲酸酯粒子(PU-6)。測定該聚胺基甲酸酯粒子(PU-6)之壓縮恢復率，結果為86%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子 (PU-6)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表2中表示比較例3之評價結果。卷盤樣品之黏連試驗之結果為×。又，連接電阻值為1.00Ω。
[比較例4]
於離子交換水1000g中溶解作為懸浮穩定劑之磷酸三鈣2g而製成分散介質，除此以外，以與實施例1相同之方式獲得平均粒徑27μm之聚胺基甲酸酯粒子(PU-7)。測定該聚胺基甲酸酯粒子(PU-7)之壓縮恢復率，結果為88%。
又，以與實施例1相同之方式，製作含有聚胺基甲酸酯粒子(PU-7)之異向性導電膜，並製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表2中表示比較例4之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為2.04Ω。
如表2所示，於彈性體粒子之平均粒徑未達1μm，即小於導電性粒子之平均粒徑之0.2倍之情形時(比較例3)，變得難以緩和由卷盤之捲緊而產生之卷壓，無法獲得良好之耐黏連性。又，於彈性體粒子之 平均粒徑大於25μm，即大於導電性粒子之平均粒徑之5.0倍之情形時(比較例4)，變得難以於壓接時對導電性粒子施加合適之壓力，而使連接電阻值上升。另一方面，可知如實施例3、4，於彈性體粒子之平均粒徑為1μm以上且25μm以下，即彈性體粒子之平均粒徑為導電性粒子之平均粒徑之0.2倍以上且5.0倍以下的情形時，可獲得優異之耐黏連性及連接可靠性。
<3.3關於含量> [實施例5]
填充相對於上述接著劑組成物為1wt%之聚胺基甲酸酯粒子(PU-1)而製作異向性導電膜，除此以外，以與實施例1相同之方式製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表3中表示實施例5之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.02Ω。
[實施例6]
填充相對於上述接著劑組成物為30wt%之聚胺基甲酸酯粒子(PU-1)而製作異向性導電膜，除此以外，以與實施例1相同之方式製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表3中表示實施例6之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為1.03Ω。
[比較例5]
填充相對於上述接著劑組成物為0.5wt%之聚胺基甲酸酯粒子(PU-1)而製作異向性導電膜，除此以外，以與實施例1相同之方式製作卷盤樣品。 進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表3中表示比較例5之評價結果。卷盤樣品之黏連試驗之結果為×。又，連接電阻值為0.98Ω。
[比較例6]
填充相對於上述接著劑組成物為35wt%之聚胺基甲酸酯粒子(PU-1)而製作異向性導電膜，除此以外，以與實施例1相同之方式製作卷盤樣品。進而，以與實施例1相同之方式，使用異向性導電膜壓接評價用玻璃基板與評價用COF，製作構裝體。
(評價結果)
於表3中表示比較例6之評價結果。卷盤樣品之黏連試驗之結果為○。又，連接電阻值為3.05Ω。
如表3所示，於彈性體粒子之含量相對於接著劑組成物未達1wt%之情形時(比較例5)，變得難以緩和由卷盤之捲緊而產生之卷壓，無法獲得良好之耐黏連性。又，於彈性體粒子之含量相對於接著劑組成物超過30wt%之情形時(比較例6)，壓接時接著劑組成物之流動性降低，變得難以自端子間排除導電性粒子，而使連接電阻值上升。另一方面，可知如實施例5、6，於彈性體粒子之含量相對於接著劑組成物為1wt%以上且30 wt%以下之情形，可獲得優異之耐黏連性及連接可靠性。
10‧‧‧接著劑組成物
11‧‧‧彈性體粒子
12‧‧‧導電性粒子
30‧‧‧基板
40‧‧‧晶片
41‧‧‧凸塊

Claims (6)

  1. 一種電路連接材料，其於接著劑組成物中分散有壓縮恢復率為50%以上之彈性體粒子與導電性粒子。
  2. 如申請專利範圍第1項之電路連接材料，其中上述彈性體粒子之平均粒徑為上述導電性粒子之平均粒徑之0.2倍以上且5.0倍以下。
  3. 如申請專利範圍第1項或第2項之電路連接材料，其中上述彈性體粒子之含量相對於上述接著劑組成物為1wt%以上且30wt%以下。
  4. 如申請專利範圍第1項或第2項之電路連接材料，其中上述接著劑組成物含有膜形成樹脂、自由基聚合性樹脂、自由基聚合起始劑，且上述彈性體粒子為聚胺基甲酸酯粒子。
  5. 如申請專利範圍第3項之電路連接材料，其中上述接著劑組成物含有膜形成樹脂、自由基聚合性樹脂、自由基聚合起始劑，且上述彈性體粒子為聚胺基甲酸酯粒子。
  6. 一種構裝體之製造方法，其具有如下步驟：於第1電子零件之電極上依序配置含有膜形成樹脂、聚合性樹脂、聚合起始劑之接著劑組成物中分散有壓縮恢復率為50%以上之彈性體粒子與導電性粒子的異向性導電膜、及第2電子零件；及利用壓接頭自上述第2電子零件之上表面進行按壓。
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