WO2013129438A1 - 回路接続材料、及びそれを用いた実装体の製造方法 - Google Patents
回路接続材料、及びそれを用いた実装体の製造方法 Download PDFInfo
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- WO2013129438A1 WO2013129438A1 PCT/JP2013/055045 JP2013055045W WO2013129438A1 WO 2013129438 A1 WO2013129438 A1 WO 2013129438A1 JP 2013055045 W JP2013055045 W JP 2013055045W WO 2013129438 A1 WO2013129438 A1 WO 2013129438A1
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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Definitions
- the present invention relates to a circuit connecting material in which conductive particles are dispersed, and a method of manufacturing a mounting body using the same.
- An anisotropic conductive film in which conductive particles are dispersed is used, for example, as a reel body wound around a reel having a flange.
- ACF Anisotropic Conductive Film
- the anisotropic conductive film expands and contracts due to temperature conditions or the like, winding restriction of the wound body occurs.
- the resin layer (adhesive component) of the anisotropic conductive film may flow outward from one end in the width direction along the length direction of the resin layer and protrude from the side surface of the release substrate. is there.
- the resin layer in the anisotropic conductive film adheres to the side surface of the flange of the reel, and the anisotropic conductive film cannot be pulled out normally (hereinafter referred to as “blocking”). Is called).
- Patent Documents 1 and 2 describe that in order to improve the blocking resistance of an anisotropic conductive film, fine particles are filled to moderately suppress the flow of the adhesive composition. However, when the adhesive composition is filled with fine particles, there is a concern that the conductive particles are not subjected to an appropriate pressure at the time of pressure bonding and connection reliability is lowered.
- the present invention has been proposed in view of such a conventional situation, and has a circuit connection material having excellent blocking reliability and excellent connection reliability, and a method of manufacturing a mounting body using the circuit connection material I will provide a.
- the circuit connection material according to the present invention is characterized in that elastic particles and conductive particles having a compression recovery rate of 50% or more are dispersed in the adhesive composition.
- an adhesive composition containing a film-forming resin, a polymerizable resin, and a polymerization initiator on the electrode of the first electronic component has a compression recovery rate of 50. % Of the anisotropic conductive film in which the elastic particles and the conductive particles are dispersed, a step of sequentially arranging the second electronic component, and a step of pressing with a pressure-bonding head from the upper surface of the second electronic component It is characterized by having.
- FIG. 1 is a cross-sectional view schematically showing a circuit connecting material wound around a reel.
- FIG. 2 is a cross-sectional view schematically showing the influence of the average particle diameter of the elastic particles during pressure bonding.
- FIG. 3 is a cross-sectional view schematically showing a terminal portion during crimping in the present embodiment.
- circuit connection material and manufacturing method thereof> The circuit connection material shown as a specific example of the present invention is configured by dispersing elastic particles having high compression recovery rate and conductive particles in an adhesive composition.
- This circuit connection material is in the form of a paste or a film, and can be appropriately selected according to the purpose.
- the elastic particles have a compression recovery rate of 50% or more.
- the compression recovery rate is (ba) / a when the diameter of the elastic particles is 2 amm, the thickness of the elastic particles at 50% displacement load is amm, and the thickness after unloading is bmm. Calculated as x100 (%).
- the elastic particles have flexibility that allows displacement of 50% or more. Thereby, since an appropriate pressure can be applied to the conductive particles at the time of pressure bonding, high connection reliability can be obtained. Further, since the elastic particles have a compression recovery rate of 50% or more, the winding pressure due to the reeling and squeezing is eased, and the adhesive composition adheres to the side surface of the reel flange, and the circuit connection material is Blocking that cannot be pulled out normally can be prevented.
- FIG. 1 is a cross-sectional view schematically showing a circuit connecting material wound around a reel. As shown in FIG. 1, the circuit connecting material wound around the reel is sandwiched between peeling substrates 20.
- the elastic body particles 11 are present in the adhesive composition 10, a force for recovering the elastic body particles 11 acts on the winding pressure due to the reeling of the reel. Thereby, the winding pressure due to the reeling of the reel can be relaxed.
- the elastic particle is not particularly limited as long as it satisfies the above-described compression recovery rate, and examples thereof include resin particles such as polyurethane and polystyrene. Among these, polyurethane particles are preferably used.
- the average particle diameter of the elastic particles is preferably 0.2 to 5.0 times the average particle diameter of the conductive particles. Thereby, the outstanding blocking resistance and connection reliability are obtained.
- the average particle diameter of the elastic particles is smaller than 0.2 times the average particle diameter of the conductive particles, it is difficult to relieve the winding pressure due to the reeling and the blocking resistance is reduced.
- the average particle diameter of the elastic particles is larger than 5.0 times the average particle diameter of the conductive particles, it is difficult to apply an appropriate pressure to the conductive particles during the pressure bonding, and the connection reliability is lowered.
- an average particle diameter can be made into the average value of the particle diameter of the predetermined number of elastic body particles or electroconductive particle observed, for example with the differential scanning electron microscope.
- 2 and 3 are cross-sectional views schematically showing the influence of the average particle diameter of the elastic particles at the time of pressure bonding. 2 and 3 show a state in which the wiring on the substrate 30 and the bump 41 of the chip 40 are connected by heating and pressing.
- FIG. 2 when the average particle diameter of the elastic particles 11 is sufficiently large with respect to the conductive particles 12, since the force to recover when the elastic particles 11 are crushed by the bumps 41 is large, The conductive particles 12 cannot be sufficiently crushed, and the connection resistance value increases.
- the elastic particles 11 are crushed by the bumps 41 by setting the average particle diameter of the elastic particles to 0.2 to 5.0 times the average particle diameter of the conductive particles as in the present embodiment. As a result, the force to be recovered at the time is reduced, and the conductive particles 12 can be sufficiently crushed.
- the content of the elastic particles is preferably 1 wt% or more and 30 wt% or less with respect to the adhesive composition. Thereby, the outstanding blocking resistance and connection reliability are obtained.
- the content of the elastic particles is less than 1 wt% with respect to the adhesive composition, it becomes difficult to relieve the winding pressure due to the reeling of the reel, and the blocking resistance decreases.
- the content of the elastic particles exceeds 30 wt% with respect to the adhesive composition, the fluidity of the adhesive composition at the time of crimping is lowered, and it becomes difficult to eliminate the conductive particles from between the terminals. Connection reliability is reduced.
- the adhesive composition in the present embodiment contains a film-forming resin, a polymerizable resin, and a polymerization initiator.
- the film-forming resin corresponds to a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formation.
- the film-forming resin include various resins such as phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyimide resin, and butyral resin. These may be used alone or in combination of two or more. It may be used. Among these, phenoxy resin is preferably used from the viewpoints of film formation state, connection reliability, and the like.
- the content of the film-forming resin is usually 30 to 80 parts by mass, preferably 40 to 70 parts by mass with respect to 100 parts by mass of the adhesive composition.
- the polymerizable resin is a radical polymerizable resin, a cationic polymerizable resin, or the like, and can be appropriately selected depending on the application.
- the radical polymerizable resin is a substance having a functional group that is polymerized by radicals, and examples thereof include epoxy acrylate, urethane acrylate, and polyester acrylate. These may be used alone or in combination of two or more. good. Among these, epoxy acrylate is preferably used in the present embodiment.
- the content of the radical polymerizable resin is usually 10 to 60 parts by mass, preferably 20 to 50 parts by mass with respect to 100 parts by mass of the adhesive composition.
- radical polymerization initiator in the case of using a radical polymerizable resin, a known one can be used, and among them, an organic peroxide can be preferably used.
- organic peroxides include peroxyketals, diacyl peroxides, peroxydicarbonates, peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and the like. It may be used in combination, or two or more types may be used in combination. Among these, peroxyketals are preferably used in the present embodiment.
- the content of the radical polymerization initiator is usually 0.1 to 30 parts by mass, preferably 1 to 20 parts by mass with respect to 100 parts by mass of the radical adhesive composition.
- a monofunctional epoxy compound such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a naphthalene type epoxy resin, a novolac type epoxy resin alone or in combination.
- an epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a naphthalene type epoxy resin, a novolac type epoxy resin alone or in combination.
- the cationic curing agent causes the epoxy species to open the epoxy group at the end of the epoxy resin and to self-crosslink the epoxy resins.
- cationic curing agents include onium salts such as aromatic sulfonium salts, aromatic diazonium salts, iodonium salts, phosphonium salts, and selenonium salts.
- an aromatic sulfonium salt is suitable as a cationic curing agent because of its excellent reactivity at low temperatures and a long pot life.
- the adhesive composition preferably further contains a silane coupling agent or the like in order to improve adhesion to the inorganic substrate.
- silane coupling agents include methacryloxy-based, epoxy-based, amino-based, vinyl-based, mercapto-sulfide-based, ureido-based, and the like. These may be used alone or in combination of two or more. good. Among these, a methacryloxy silane coupling agent is preferably used in the present embodiment.
- the conductive particles dispersed in the adhesive composition for example, metal particles such as nickel, gold, and copper, and resin particles that are plated with gold or the like can be used.
- the average particle size of the conductive particles is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m, from the viewpoint of connection reliability.
- the average particle density of the conductive particles in the adhesive composition, from the viewpoint of connection reliability and insulation reliability, is preferably 1000 to 50000 / mm 2, more preferably from 5,000 to 30,000 pieces / mm 2 .
- the method for producing an anisotropic conductive film in the present embodiment includes an elastic particle having a compression recovery rate of 50% or more in an adhesive composition containing a film-forming resin, a polymerizable resin, and a polymerization initiator. Conductive particles are dispersed. As an organic solvent for dissolving them, toluene, ethyl acetate, or a mixed solvent thereof, and other various organic solvents can be used.
- the release substrate has a laminated structure in which, for example, a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. While preventing drying of the resin in the anisotropic conductive material, the shape of the resin is maintained.
- a release agent such as silicone is applied to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. While preventing drying of the resin in the anisotropic conductive material, the shape of the resin is maintained.
- the anisotropic conductive material applied on the release substrate is dried by a heat oven, a heat drying apparatus or the like. As a result, an anisotropic conductive film having a thickness of about 5 to 50 ⁇ m can be manufactured.
- a reel body of an anisotropic conductive film for example, by cutting the anisotropic conductive film and winding the anisotropic conductive film so that the side surface of the peeling substrate is in contact with the inner surface of the flange A reel body can be obtained by winding the wire around.
- the compression recovery rate is 50% in an adhesive composition containing a film-forming resin, a polymerizable resin, and a polymerization initiator on the electrode of the first electronic component.
- the anisotropic conductive film in which the elastic particles and the conductive particles are dispersed, the step of sequentially arranging the second electronic component, and the step of pressing with the pressure bonding head from the upper surface of the second electronic component. Have. Thereby, while connecting the electrode of a 1st electronic component and the electrode of a 2nd electronic component via an electroconductive particle, an anisotropic conductive film can be hardened.
- examples of the first electronic component include IZO coated glass in which a glass substrate is coated with an IZO (Indium / Zinc / Oxide) film, and SiNx coated glass in which a glass substrate is coated with a SiNx (silicon nitride) film.
- examples of the second electronic component include a COF (Chip On Film) and an IC (Integrated Circuit).
- the elastic particles having a compression recovery rate of 50% or more are included in the adhesive composition, an appropriate pressure can be applied to the conductive particles at the time of pressure bonding, and high connection reliability is achieved. Obtainable.
- Example> Examples of the present invention will be described below.
- polyurethane particles having different compression recovery rates were produced as elastic particles.
- the reel sample of the anisotropic conductive film containing a polyurethane particle was produced.
- the mounting body was produced using the anisotropic conductive film.
- evaluation items a reel sample blocking test and a connection resistance measurement of the mounted body were performed. The present invention is not limited to these examples.
- connection resistance With respect to the mounted body, the initial connection resistance when a current of 1 mA was passed by a four-terminal method using a digital multimeter (digital multimeter 7555, manufactured by Yokogawa Electric Corporation) was measured.
- Example 1 (Production of polyurethane particles) First, polyurethane particles were produced. 30 g of tricalcium phosphate as a suspension stabilizer was dissolved in 1000 g of ion-exchanged water to obtain a dispersion medium. To this, 70 g of a caprolactam triol having a molecular weight of 700 having three hydroxyl groups and 100 g of a non-yellowing type polyisocyanate having three isocyanate groups were added and stirred at 600 rpm for 30 minutes to prepare a suspension.
- the suspension was placed in a 3 L flask and heated to 70 ° C., reacted at 250 rpm for 6 hours and cooled, and then centrifuged to separate the liquid. This was thoroughly washed with water and dried to obtain polyurethane particles (PU-1) having an average particle diameter of 5 ⁇ m.
- the compression recovery rate of the polyurethane particles (PU-1) was measured and found to be 90%.
- the average particle diameter was made into the average value of the particle diameter of ten polyurethane particles observed with the differential scanning electron microscope.
- a reel sample was prepared by slitting the anisotropic conductive film to a width of 1.5 mm and winding it up to 100 M on a plastic reel.
- Table 1 shows the evaluation results of Example 1.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.02 ⁇ .
- Example 2 Polyurethane particles (PU-2) having an average particle diameter of 5 ⁇ m were obtained in the same manner as in Example 1 except that 100 g of non-yellowing type isophorone diisocyanate having two isocyanate groups was added. The compression recovery rate of the polyurethane particles (PU-2) was measured and found to be 50%.
- Example 2 an anisotropic conductive film containing polyurethane particles (PU-2) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-2 polyurethane particles
- Table 1 shows the evaluation results of Example 2.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.12 ⁇ .
- Example 1 Polyurethane particles (PU-3) having an average particle diameter of 5 ⁇ m were obtained in the same manner as in Example 1 except that 70 g of a molecular weight 2000 caprolactam diol having two hydroxyl groups was added. The compression recovery rate of the polyurethane particles (PU-3) was measured and found to be 40%.
- Example 2 an anisotropic conductive film containing polyurethane particles (PU-3) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-3 polyurethane particles
- Table 1 shows the evaluation results of Comparative Example 1.
- the result of the reel sample blocking test was x.
- the connection resistance value was 0.99 ⁇ .
- Si filler was used in place of the polyurethane particles.
- the compression recovery rate of this Si filler (Si-1) could not be measured because the filler was cracked.
- Example 1 an anisotropic conductive film containing Si filler (Si-1) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- Table 1 shows the evaluation results of Comparative Example 2.
- the result of the reel sample blocking test was o.
- the connection resistance value was 4.05 ⁇ .
- Comparative Example 1 using elastic particles having a compression recovery rate of less than 50% could not obtain excellent blocking resistance. Further, in Comparative Example 2 in which no elastic particles were used, the connection resistance value increased. On the other hand, the blocking resistance could be improved by using elastic particles having a compression recovery rate of 50% or more as in Examples 1 and 2. In addition, since an appropriate pressure is applied to the conductive particles, the connection resistance value of the mounting body can be reduced.
- Example 3 Polyurethane particles (PU-4) having an average particle diameter of 1 ⁇ m were obtained in the same manner as in Example 1 except that 70 g of tricalcium phosphate as a suspension stabilizer was dissolved in 1000 g of ion-exchanged water to obtain a dispersion medium. The compression recovery rate of the polyurethane particles (PU-4) was measured and found to be 88%.
- Example 2 an anisotropic conductive film containing polyurethane particles (PU-4) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-4 polyurethane particles
- Table 2 shows the evaluation results of Example 3.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.04 ⁇ .
- Example 4 Polyurethane particles (PU-5) having an average particle diameter of 20 ⁇ m were obtained in the same manner as in Example 1 except that 5 g of tricalcium phosphate as a suspension stabilizer was dissolved in 1000 g of ion-exchanged water to obtain a dispersion medium. The compression recovery rate of the polyurethane particles (PU-5) was measured and found to be 84%.
- Example 2 an anisotropic conductive film containing polyurethane particles (PU-5) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-5 polyurethane particles
- Table 2 shows the evaluation results of Example 4.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.06 ⁇ .
- Polyurethane particles (PU-6) having an average particle diameter of 0.5 ⁇ m were obtained in the same manner as in Example 1 except that 80 g of tricalcium phosphate as a suspension stabilizer was dissolved in 1000 g of ion-exchanged water to obtain a dispersion medium. .
- the compression recovery rate of the polyurethane particles (PU-6) was measured and found to be 86%.
- Example 2 an anisotropic conductive film containing polyurethane particles (PU-6) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-6 polyurethane particles
- Table 2 shows the evaluation results of Comparative Example 3.
- the result of the reel sample blocking test was x.
- the connection resistance value was 1.00 ⁇ .
- Polyurethane particles (PU-7) having an average particle diameter of 27 ⁇ m were obtained in the same manner as in Example 1 except that 2 g of tricalcium phosphate as a suspension stabilizer was dissolved in 1000 g of ion-exchanged water to obtain a dispersion medium.
- the compression recovery rate of the polyurethane particles (PU-7) was measured and found to be 88%.
- Example 7 an anisotropic conductive film containing polyurethane particles (PU-7) was produced, and a reel sample was produced. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-7 polyurethane particles
- Table 2 shows the evaluation results of Comparative Example 3.
- the result of the reel sample blocking test was o.
- the connection resistance value was 2.04 ⁇ .
- the average particle diameter of the elastic particles is 1 to 25 ⁇ m, that is, the average particle diameter of the elastic particles is 0.2 to 5.0 times the average particle diameter of the conductive particles.
- Example 5 A reel sample was prepared in the same manner as in Example 1 except that an anisotropic conductive film was prepared by filling polyurethane particles (PU-1) with 1 wt% of the adhesive composition. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-1 polyurethane particles
- Table 3 shows the evaluation results of Example 5.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.02 ⁇ .
- Example 6 A reel sample was prepared in the same manner as in Example 1 except that an anisotropic conductive film was prepared by filling polyurethane particles (PU-1) with 30 wt% of the adhesive composition. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-1 polyurethane particles
- Table 3 shows the evaluation results of Example 6.
- the result of the reel sample blocking test was o.
- the connection resistance value was 1.03 ⁇ .
- Example 5 A reel sample was prepared in the same manner as in Example 1 except that an anisotropic conductive film was prepared by filling polyurethane particles (PU-1) with 0.5 wt% of the adhesive composition. Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-1 polyurethane particles
- Table 3 shows the evaluation results of Comparative Example 5.
- the result of the reel sample blocking test was x.
- the connection resistance value was 0.98 ⁇ .
- Example 6 A reel sample was prepared in the same manner as in Example 1 except that an anisotropic conductive film was prepared by filling the adhesive composition with 35 wt% of polyurethane particles (PU-1). Further, in the same manner as in Example 1, the glass substrate for evaluation and the COF for evaluation were pressure-bonded using an anisotropic conductive film to produce a mounting body.
- PU-1 polyurethane particles
- Table 3 shows the evaluation results of Comparative Example 6.
- the result of the reel sample blocking test was o.
- the connection resistance value was 3.05 ⁇ .
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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CN201380012143.8A CN104145000A (zh) | 2012-03-02 | 2013-02-27 | 电路连接材料及使用其的安装体的制造方法 |
KR1020147027363A KR20140138809A (ko) | 2012-03-02 | 2013-02-27 | 회로 접속 재료, 및 그것을 사용한 실장체의 제조 방법 |
HK15104249.4A HK1203540A1 (zh) | 2012-03-02 | 2015-05-05 | 電路連接材料及使用其的安裝體的製造方法 |
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JP6429228B2 (ja) * | 2014-04-24 | 2018-11-28 | タツタ電線株式会社 | 金属被覆樹脂粒子及びそれを用いた導電性接着剤 |
KR102401753B1 (ko) * | 2014-05-12 | 2022-05-26 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전 재료 및 접속 구조체 |
TWI689573B (zh) | 2016-05-23 | 2020-04-01 | 日商拓自達電線股份有限公司 | 導電性接著劑組成物 |
JP7172991B2 (ja) * | 2017-03-29 | 2022-11-16 | 昭和電工マテリアルズ株式会社 | 接着剤組成物及び構造体 |
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JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
WO2007058159A1 (ja) * | 2005-11-18 | 2007-05-24 | Hitachi Chemical Company, Ltd. | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
JP2010183049A (ja) * | 2008-04-28 | 2010-08-19 | Hitachi Chem Co Ltd | 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体 |
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US8043709B2 (en) * | 2003-06-25 | 2011-10-25 | Hitachi Chemical Co., Ltd. | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
KR101140088B1 (ko) * | 2005-12-26 | 2012-04-30 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속 재료 및 회로 부재의 접속 구조 |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2003249287A (ja) * | 2002-02-25 | 2003-09-05 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤、ヒートシールコネクター及び接続構造 |
JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
WO2007058159A1 (ja) * | 2005-11-18 | 2007-05-24 | Hitachi Chemical Company, Ltd. | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
JP2010183049A (ja) * | 2008-04-28 | 2010-08-19 | Hitachi Chem Co Ltd | 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体 |
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TWI580752B (zh) | 2017-05-01 |
KR20140138809A (ko) | 2014-12-04 |
HK1203540A1 (zh) | 2015-10-30 |
JP5936882B2 (ja) | 2016-06-22 |
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