TWI579941B - 檢測裝置、壓印裝置、及物品的製造方法 - Google Patents

檢測裝置、壓印裝置、及物品的製造方法 Download PDF

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Publication number
TWI579941B
TWI579941B TW104103438A TW104103438A TWI579941B TW I579941 B TWI579941 B TW I579941B TW 104103438 A TW104103438 A TW 104103438A TW 104103438 A TW104103438 A TW 104103438A TW I579941 B TWI579941 B TW I579941B
Authority
TW
Taiwan
Prior art keywords
mark
detecting device
image
pattern
substrate
Prior art date
Application number
TW104103438A
Other languages
English (en)
Chinese (zh)
Other versions
TW201539600A (zh
Inventor
稲田博志
三島和彥
宮春吓文
Original Assignee
佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 佳能股份有限公司 filed Critical 佳能股份有限公司
Publication of TW201539600A publication Critical patent/TW201539600A/zh
Application granted granted Critical
Publication of TWI579941B publication Critical patent/TWI579941B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104103438A 2014-02-18 2015-02-02 檢測裝置、壓印裝置、及物品的製造方法 TWI579941B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014028867A JP5932859B2 (ja) 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
TW201539600A TW201539600A (zh) 2015-10-16
TWI579941B true TWI579941B (zh) 2017-04-21

Family

ID=53798726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104103438A TWI579941B (zh) 2014-02-18 2015-02-02 檢測裝置、壓印裝置、及物品的製造方法

Country Status (5)

Country Link
US (1) US9595447B2 (enExample)
JP (1) JP5932859B2 (enExample)
KR (1) KR101788371B1 (enExample)
CN (1) CN104849956B (enExample)
TW (1) TWI579941B (enExample)

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JP6884515B2 (ja) 2016-05-10 2021-06-09 キヤノン株式会社 位置検出方法、インプリント装置及び物品の製造方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
JP7089348B2 (ja) * 2017-07-28 2022-06-22 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP6937203B2 (ja) 2017-09-14 2021-09-22 キオクシア株式会社 インプリント装置、インプリント方法および半導体装置の製造方法
US10705435B2 (en) 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
JP7038562B2 (ja) * 2018-02-13 2022-03-18 キヤノン株式会社 検出装置、リソグラフィ装置、および物品の製造方法
JP2020154063A (ja) * 2019-03-19 2020-09-24 キオクシア株式会社 アライメントマーク、インプリント方法、半導体装置の製造方法、及び位置合わせ装置
US11256177B2 (en) 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
KR102793516B1 (ko) * 2019-12-03 2025-04-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
US11796925B2 (en) 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
US12032300B2 (en) 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
JP2023135179A (ja) 2022-03-15 2023-09-28 キヤノン株式会社 物体の位置合わせ方法、インプリント方法、物品製造方法、検出装置、インプリント装置、型及び基板
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
JP2024030557A (ja) * 2022-08-24 2024-03-07 キヤノン株式会社 検出装置、リソグラフィー装置および物品製造方法
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio

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Also Published As

Publication number Publication date
JP5932859B2 (ja) 2016-06-08
CN104849956A (zh) 2015-08-19
JP2015154008A (ja) 2015-08-24
CN104849956B (zh) 2020-04-28
TW201539600A (zh) 2015-10-16
KR101788371B1 (ko) 2017-10-19
US20150235880A1 (en) 2015-08-20
KR20150097415A (ko) 2015-08-26
US9595447B2 (en) 2017-03-14

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