KR101788371B1 - 검출 장치, 임프린트 장치 및 물품의 제조 방법 - Google Patents

검출 장치, 임프린트 장치 및 물품의 제조 방법 Download PDF

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KR101788371B1
KR101788371B1 KR1020150023025A KR20150023025A KR101788371B1 KR 101788371 B1 KR101788371 B1 KR 101788371B1 KR 1020150023025 A KR1020150023025 A KR 1020150023025A KR 20150023025 A KR20150023025 A KR 20150023025A KR 101788371 B1 KR101788371 B1 KR 101788371B1
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mark
image
pattern
patterns
substrate
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KR20150097415A (ko
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히로시 이나다
가즈히코 미시마
다카후미 미야하루
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020150023025A 2014-02-18 2015-02-16 검출 장치, 임프린트 장치 및 물품의 제조 방법 Active KR101788371B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-028867 2014-02-18
JP2014028867A JP5932859B2 (ja) 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20150097415A KR20150097415A (ko) 2015-08-26
KR101788371B1 true KR101788371B1 (ko) 2017-10-19

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KR1020150023025A Active KR101788371B1 (ko) 2014-02-18 2015-02-16 검출 장치, 임프린트 장치 및 물품의 제조 방법

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Country Link
US (1) US9595447B2 (enExample)
JP (1) JP5932859B2 (enExample)
KR (1) KR101788371B1 (enExample)
CN (1) CN104849956B (enExample)
TW (1) TWI579941B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005975A (en) * 2010-03-03 2011-09-06 Asml Netherlands Bv Imprint lithography.
JP6884515B2 (ja) 2016-05-10 2021-06-09 キヤノン株式会社 位置検出方法、インプリント装置及び物品の製造方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
JP7089348B2 (ja) * 2017-07-28 2022-06-22 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP6937203B2 (ja) 2017-09-14 2021-09-22 キオクシア株式会社 インプリント装置、インプリント方法および半導体装置の製造方法
US10705435B2 (en) 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
JP7038562B2 (ja) * 2018-02-13 2022-03-18 キヤノン株式会社 検出装置、リソグラフィ装置、および物品の製造方法
JP2020154063A (ja) * 2019-03-19 2020-09-24 キオクシア株式会社 アライメントマーク、インプリント方法、半導体装置の製造方法、及び位置合わせ装置
US11256177B2 (en) 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
KR102793516B1 (ko) * 2019-12-03 2025-04-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
US11796925B2 (en) 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
US12032300B2 (en) 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
JP2023135179A (ja) * 2022-03-15 2023-09-28 キヤノン株式会社 物体の位置合わせ方法、インプリント方法、物品製造方法、検出装置、インプリント装置、型及び基板
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
JP2024030557A (ja) * 2022-08-24 2024-03-07 キヤノン株式会社 検出装置、リソグラフィー装置および物品製造方法
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006259153A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd アラインメント精度評価方法及び装置
US20080094629A1 (en) * 2006-10-20 2008-04-24 Wei Wu Optical gratings, lithography tools including such optical gratings and methods for using same for alignment
US20110243300A1 (en) 2010-03-30 2011-10-06 Fujifilm Corporation Diffraction grating and alignment method thereof, and radiation imaging system

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614237A (en) * 1969-01-21 1971-10-19 Lockheed Aircraft Corp Method and apparatus for contour measurement
JPS63228421A (ja) * 1987-03-17 1988-09-22 Minolta Camera Co Ltd 自動合焦装置
US5052807A (en) * 1990-06-28 1991-10-01 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Three dimensional moire pattern alignment
JPH06307811A (ja) 1993-04-28 1994-11-04 Soltec:Kk 位置ずれ及びギャップ検出方法
GB9723591D0 (en) * 1997-11-08 1998-01-07 Street Graham S B Method and apparatus for lenticular imaging
JP4074867B2 (ja) * 2003-11-04 2008-04-16 エーエスエムエル ネザーランズ ビー．ブイ． 第１及び第２位置合せマークの相対位置を計測する方法及び装置
US7212345B2 (en) * 2004-09-13 2007-05-01 Eastman Kodak Company Randomized patterns of individual optical elements
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
JPWO2007142351A1 (ja) * 2006-06-09 2009-10-29 株式会社ニコン 移動体装置、露光装置及び露光方法、並びにデバイス製造方法
DE102008004762A1 (de) * 2008-01-16 2009-07-30 Carl Zeiss Smt Ag Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung
DE102008017645A1 (de) * 2008-04-04 2009-10-08 Carl Zeiss Smt Ag Vorrichtung zur mikrolithographischen Projektionsbelichtung sowie Vorrichtung zur Inspektion einer Oberfläche eines Substrats
WO2010092615A1 (ja) * 2009-02-10 2010-08-19 株式会社島津製作所 放射線撮像装置
JP5324309B2 (ja) 2009-05-12 2013-10-23 ボンドテック株式会社 アライメント装置、アライメント方法および半導体装置
JP5451450B2 (ja) * 2010-02-24 2014-03-26 キヤノン株式会社 インプリント装置及びそのテンプレート並びに物品の製造方法
JP5355775B2 (ja) * 2010-03-04 2013-11-27 シャープ株式会社 液晶表示装置
EP2458441B1 (en) * 2010-11-30 2022-01-19 ASML Netherlands BV Measuring method, apparatus and substrate
JP2012143550A (ja) * 2010-12-20 2012-08-02 Fujifilm Corp 放射線画像撮影装置および放射線画像取得方法
WO2012144317A1 (ja) * 2011-04-20 2012-10-26 富士フイルム株式会社 放射線撮影装置及び画像処理方法
JP6066565B2 (ja) * 2012-01-31 2017-01-25 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP2013175684A (ja) * 2012-02-27 2013-09-05 Canon Inc 検出器、インプリント装置及び物品を製造する方法
JP5972034B2 (ja) * 2012-05-07 2016-08-17 キヤノン株式会社 画像形成装置、画像処理プログラム、画像処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006259153A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd アラインメント精度評価方法及び装置
US20080094629A1 (en) * 2006-10-20 2008-04-24 Wei Wu Optical gratings, lithography tools including such optical gratings and methods for using same for alignment
US20110243300A1 (en) 2010-03-30 2011-10-06 Fujifilm Corporation Diffraction grating and alignment method thereof, and radiation imaging system

Also Published As

Publication number Publication date
CN104849956A (zh) 2015-08-19
TWI579941B (zh) 2017-04-21
JP2015154008A (ja) 2015-08-24
TW201539600A (zh) 2015-10-16
US9595447B2 (en) 2017-03-14
US20150235880A1 (en) 2015-08-20
JP5932859B2 (ja) 2016-06-08
KR20150097415A (ko) 2015-08-26
CN104849956B (zh) 2020-04-28

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