JP5932859B2 - 検出装置、インプリント装置、および物品の製造方法 - Google Patents

検出装置、インプリント装置、および物品の製造方法 Download PDF

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Publication number
JP5932859B2
JP5932859B2 JP2014028867A JP2014028867A JP5932859B2 JP 5932859 B2 JP5932859 B2 JP 5932859B2 JP 2014028867 A JP2014028867 A JP 2014028867A JP 2014028867 A JP2014028867 A JP 2014028867A JP 5932859 B2 JP5932859 B2 JP 5932859B2
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Japan
Prior art keywords
mark
imaging
pattern
detection device
substrate
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Active
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JP2014028867A
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English (en)
Japanese (ja)
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JP2015154008A5 (enExample
JP2015154008A (ja
Inventor
博志 稲田
博志 稲田
和彦 三島
和彦 三島
隆文 宮春
隆文 宮春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014028867A priority Critical patent/JP5932859B2/ja
Priority to TW104103438A priority patent/TWI579941B/zh
Priority to US14/621,238 priority patent/US9595447B2/en
Priority to CN201510080276.XA priority patent/CN104849956B/zh
Priority to KR1020150023025A priority patent/KR101788371B1/ko
Publication of JP2015154008A publication Critical patent/JP2015154008A/ja
Publication of JP2015154008A5 publication Critical patent/JP2015154008A5/ja
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2014028867A 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法 Active JP5932859B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014028867A JP5932859B2 (ja) 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法
TW104103438A TWI579941B (zh) 2014-02-18 2015-02-02 檢測裝置、壓印裝置、及物品的製造方法
US14/621,238 US9595447B2 (en) 2014-02-18 2015-02-12 Detection apparatus, imprint apparatus, and method of manufacturing products
CN201510080276.XA CN104849956B (zh) 2014-02-18 2015-02-13 检测装置、压印装置及物品的制造方法
KR1020150023025A KR101788371B1 (ko) 2014-02-18 2015-02-16 검출 장치, 임프린트 장치 및 물품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014028867A JP5932859B2 (ja) 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2015154008A JP2015154008A (ja) 2015-08-24
JP2015154008A5 JP2015154008A5 (enExample) 2015-10-01
JP5932859B2 true JP5932859B2 (ja) 2016-06-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014028867A Active JP5932859B2 (ja) 2014-02-18 2014-02-18 検出装置、インプリント装置、および物品の製造方法

Country Status (5)

Country Link
US (1) US9595447B2 (enExample)
JP (1) JP5932859B2 (enExample)
KR (1) KR101788371B1 (enExample)
CN (1) CN104849956B (enExample)
TW (1) TWI579941B (enExample)

Cited By (1)

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US10290498B2 (en) 2017-09-14 2019-05-14 Toshiba Memory Corporation Imprint apparatus and imprint method

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JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
JP7089348B2 (ja) * 2017-07-28 2022-06-22 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
US10705435B2 (en) 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
JP7038562B2 (ja) * 2018-02-13 2022-03-18 キヤノン株式会社 検出装置、リソグラフィ装置、および物品の製造方法
JP2020154063A (ja) * 2019-03-19 2020-09-24 キオクシア株式会社 アライメントマーク、インプリント方法、半導体装置の製造方法、及び位置合わせ装置
US11256177B2 (en) 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
KR102793516B1 (ko) * 2019-12-03 2025-04-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US11686576B2 (en) 2020-06-04 2023-06-27 Kla Corporation Metrology target for one-dimensional measurement of periodic misregistration
US11796925B2 (en) 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
US12032300B2 (en) 2022-02-14 2024-07-09 Kla Corporation Imaging overlay with mutually coherent oblique illumination
JP2023135179A (ja) 2022-03-15 2023-09-28 キヤノン株式会社 物体の位置合わせ方法、インプリント方法、物品製造方法、検出装置、インプリント装置、型及び基板
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
JP2024030557A (ja) * 2022-08-24 2024-03-07 キヤノン株式会社 検出装置、リソグラフィー装置および物品製造方法
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio

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US10290498B2 (en) 2017-09-14 2019-05-14 Toshiba Memory Corporation Imprint apparatus and imprint method

Also Published As

Publication number Publication date
CN104849956A (zh) 2015-08-19
JP2015154008A (ja) 2015-08-24
CN104849956B (zh) 2020-04-28
TW201539600A (zh) 2015-10-16
KR101788371B1 (ko) 2017-10-19
US20150235880A1 (en) 2015-08-20
KR20150097415A (ko) 2015-08-26
TWI579941B (zh) 2017-04-21
US9595447B2 (en) 2017-03-14

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