TWI575643B - 基板轉移裝置 - Google Patents

基板轉移裝置 Download PDF

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Publication number
TWI575643B
TWI575643B TW104139527A TW104139527A TWI575643B TW I575643 B TWI575643 B TW I575643B TW 104139527 A TW104139527 A TW 104139527A TW 104139527 A TW104139527 A TW 104139527A TW I575643 B TWI575643 B TW I575643B
Authority
TW
Taiwan
Prior art keywords
tray
magnetic
transfer
magnet
substrate
Prior art date
Application number
TW104139527A
Other languages
English (en)
Chinese (zh)
Other versions
TW201631690A (zh
Inventor
金正健
金善吉
金南訓
金鍾大
高元一
蘇秉鎬
孫承京
李起泰
李尚浩
千敏鎬
韓應龍
Original Assignee
Ｕｌｖａｃ韓國股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｕｌｖａｃ韓國股份有限公司 filed Critical Ｕｌｖａｃ韓國股份有限公司
Publication of TW201631690A publication Critical patent/TW201631690A/zh
Application granted granted Critical
Publication of TWI575643B publication Critical patent/TWI575643B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Non-Mechanical Conveyors (AREA)
TW104139527A 2014-11-27 2015-11-27 基板轉移裝置 TWI575643B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140167325 2014-11-27
KR1020150131585A KR20160063969A (ko) 2014-11-27 2015-09-17 기판 이송 장치

Publications (2)

Publication Number Publication Date
TW201631690A TW201631690A (zh) 2016-09-01
TWI575643B true TWI575643B (zh) 2017-03-21

Family

ID=56193018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104139527A TWI575643B (zh) 2014-11-27 2015-11-27 基板轉移裝置

Country Status (3)

Country Link
KR (1) KR20160063969A (ko)
CN (1) CN105993068B (ko)
TW (1) TWI575643B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102359244B1 (ko) 2016-11-21 2022-02-08 한국알박(주) 막 증착 방법
CN109484794A (zh) 2017-09-13 2019-03-19 京东方科技集团股份有限公司 一种基板传送装置
CN107783331B (zh) * 2017-10-20 2020-12-04 深圳市华星光电技术有限公司 器件转移装置及其转移器件的方法、器件转移板
CN107808835B (zh) * 2017-10-20 2020-07-10 深圳市华星光电技术有限公司 导磁板及器件转移装置
CN109983153A (zh) * 2017-10-27 2019-07-05 应用材料公司 用于载体在沉积系统中的非接触运输的设备、用于载体的非接触运输的系统、用于在沉积系统中的非接触运输的载体和用于载体在沉积系统中的非接触运输的方法
KR102213655B1 (ko) * 2017-12-28 2021-02-08 (주)가온솔루션 자기 부상이송 장치
KR101958411B1 (ko) 2018-08-28 2019-03-14 한국알박(주) 막 증착 장치 및 방법
CN109019028A (zh) * 2018-09-10 2018-12-18 京东方科技集团股份有限公司 基板传输装置
WO2020228939A1 (en) * 2019-05-13 2020-11-19 Applied Materials, Inc. Magnetic levitation system, base structure of a magnetic levitation system, and method of transporting a carrier
KR102232179B1 (ko) * 2020-12-23 2021-03-26 (주)가온솔루션 자기 부상이송 장치
CN113098330B (zh) * 2021-05-21 2022-06-07 上海隐冠半导体技术有限公司 位移装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707390B1 (ko) * 2005-12-19 2007-04-13 주식회사 아바코 기판 이송장치
KR20080046761A (ko) * 2006-11-23 2008-05-28 엘지디스플레이 주식회사 기판이송장치 및 이를 구비하는 박막 형성 장치
KR20080104479A (ko) * 2007-05-28 2008-12-03 엘지디스플레이 주식회사 기판 이송 장치
KR100880877B1 (ko) * 2007-11-02 2009-01-30 한국기계연구원 자기부상형 기판 이송장치
KR20120088980A (ko) * 2011-02-01 2012-08-09 (주)이루자 진공 처리 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3919464B2 (ja) * 2001-04-27 2007-05-23 東京エレクトロン株式会社 搬送装置、洗浄装置及び現像装置
JP2003168716A (ja) * 2001-12-03 2003-06-13 Dia Shinku Kk 部品搬送装置及びこれを用いた部品保管装置
JP4471708B2 (ja) * 2004-03-31 2010-06-02 キヤノンアネルバ株式会社 基板搬送装置
JP2011047515A (ja) * 2009-07-28 2011-03-10 Canon Anelva Corp 駆動装置及び真空処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707390B1 (ko) * 2005-12-19 2007-04-13 주식회사 아바코 기판 이송장치
KR20080046761A (ko) * 2006-11-23 2008-05-28 엘지디스플레이 주식회사 기판이송장치 및 이를 구비하는 박막 형성 장치
KR20080104479A (ko) * 2007-05-28 2008-12-03 엘지디스플레이 주식회사 기판 이송 장치
KR100880877B1 (ko) * 2007-11-02 2009-01-30 한국기계연구원 자기부상형 기판 이송장치
KR20120088980A (ko) * 2011-02-01 2012-08-09 (주)이루자 진공 처리 장치

Also Published As

Publication number Publication date
KR20160063969A (ko) 2016-06-07
TW201631690A (zh) 2016-09-01
CN105993068B (zh) 2019-05-31
CN105993068A (zh) 2016-10-05

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