TWI575213B - Heat pipe radiator - Google Patents

Heat pipe radiator Download PDF

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Publication number
TWI575213B
TWI575213B TW102100879A TW102100879A TWI575213B TW I575213 B TWI575213 B TW I575213B TW 102100879 A TW102100879 A TW 102100879A TW 102100879 A TW102100879 A TW 102100879A TW I575213 B TWI575213 B TW I575213B
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Taiwan
Prior art keywords
heat
heat pipe
base
fins
heat sink
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TW102100879A
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English (en)
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TW201420988A (zh
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chong-xian Huang
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chong-xian Huang
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

熱管散熱器
本發明係有關一種熱管散熱器設計，尤指一種散熱鰭片可局部穿透底座並直接抵持接觸熱管的熱管散熱器改良，使散熱鰭片可直接傳遞熱管所吸收的熱溫而加快散熱。
習知熱管散熱器，係包括一底座、複數散熱鰭片及一個以上的熱管所組成，複數散熱鰭片係堆疊排列而結合於底座的端面，底座的底面並開設可匹配嵌合熱管的嵌槽，熱管則向上彎曲而貫穿結合複數散熱鰭片；如申請人先前申請的第I359254號「附熱管的散熱器改良」發明專利案，或第M416756號新型專利所提供的「具有並列式熱管的散熱器」設計，都是在底座的底面開設嵌槽，以提供熱管可適配嵌入結合，且所述熱管係可平整露出底座的底面，使熱管可直接接觸熱源(如CPU)。
習知亦有如第M421693號新型專利所為「鰭片式散熱器結構改良」設計，該類型的熱管散熱器則是將熱管埋藏結合於底座與散熱鰭片之間，故熱管元件無法直接接觸到熱源(CPU)，只能由底座貼觸熱源，再將底座所吸收的熱溫間接傳遞給熱管及散熱鰭片，用以進行散熱。
上述利用底座嵌槽搭配熱管嵌合組成的習知熱管散熱器，其中，散熱鰭片只能插植結合於底座端面，但無法同時直接接觸熱源(CPU)，因此，熱管無法在第一時間將其吸收的熱溫直接傳遞給散熱鰭片，故對於散熱鰭片而言，只能產生間接散熱的效果。
此外，上述習知底座的嵌槽，其必須具有一相對適配的凹槽深度，始足以提供熱管嵌入而獲平整嵌合，若嵌槽的槽深太淺，例如槽深小於熱管的半徑週圓時，則熱管即無法完成嵌入結合，因此相對於底座而言，該底座亦必須具有一更大於嵌槽深度的板體厚度，亦即，所述嵌槽的最深位置與底座端面之間尚需預留一合適間距(厚度)，但其預留的間距愈多，則底座的板體當然會愈厚，則不但體積更大、重量更重，且耗費的用材(鋁或銅等金屬材料)亦更多，故無形也會增加成本的負擔。
本發明之主要目的，乃在於提供一種熱管散熱器設計，其係包括一底座、複數散熱鰭片及一個以上的熱管，該底座的端面具有可插植結合散熱鰭片的複數插槽，而底座的底面係開設一個以上可匹配嵌合熱管的嵌槽，其特別是在底座的端面插槽與底面嵌槽之間，開設複數個對應相通的破孔，複數個破孔係呈間隔排列，並與複數散熱鰭片插植位置的相對底部為相互的匹配對應，使散熱鰭片局部的相對底部可伸入破孔而接觸熱管，故散熱鰭片除了可插植結合於底座的端面插槽以外，並可利用局部的相對 底部通過破孔而直接接觸熱管，因此該散熱鰭片在第一時間即可傳遞熱管所吸收的熱溫，用以加快其散熱效果。
本發明之次要目的，乃在於提供一種熱管散熱器設計，其中，該底座嵌槽的凹槽最深位置，係可更貼近於底座的端面，因此可縮短嵌槽與底座端面之間的間距(厚度)，使底座的板體厚度可相對變薄，以具有縮減底座體積重量的優點，並減少底座的金屬用材耗費，以降低成本。
本發明之又一目的，乃在於提供一種熱管散熱器設計，其中，所述的複數散熱鰭片，其係可將鰭片的底部施以反折而形成一反折面，再於反折面設有一可供伸入破孔的相對底部，以供與熱管產生較佳的接觸效果。
本發明之另一目的，乃在於提供一種熱管散熱器設計，其中，所述複數散熱鰭片的相對底部，其係可為平底狀、弧面狀，或依熱管的管壁形狀而為其他相對凹凸的形狀，而使散熱鰭片的相對底部與熱管的管壁可呈相對吻合的較佳接觸。
1‧‧‧底座
2‧‧‧散熱鰭片
3‧‧‧熱管
1a‧‧‧端面
11‧‧‧插槽
1b‧‧‧底面
12‧‧‧嵌槽
13‧‧‧破孔
21‧‧‧相對底部
22‧‧‧反折面
D‧‧‧凹槽最深位置
T1‧‧‧間距
T2‧‧‧板體厚度
3’‧‧‧梯形熱管
2’‧‧‧散熱鰭片
1’‧‧‧底座
12’‧‧‧嵌槽
21’‧‧‧相對底部
14‧‧‧內凹面
141‧‧‧鎖孔
第一圖為本發明的分解立體圖。
第二圖為本發明另一角度的分解立體圖。
第三圖為本發明的組合立體圖。
第四圖為第三圖的上視圖。
第五圖為第四圖的A-A剖面圖。
第六圖為第五圖呈分解狀態的示意圖。
第七圖為本發明另一實施例的局部組合剖面圖。
第八圖為第七圖呈分解狀態的示意圖。
第九圖為第四圖的B-B剖面圖。
第十圖為本發明又一實施例的組合立體圖。
茲依附圖實施例將本發明結構特徵及其他作用、目的詳細說明如下：如第一圖至第三圖所示之本發明「熱管散熱器」設計，其係包括一底座1、複數散熱鰭片2及一個以上的熱管3，其中：底座1，係於底座端面1a設有併排狀的複數插槽11，而底座底面1b係開設一個以上嵌槽12，且在底座端面1a的插槽11與底座底面1b的嵌槽12之間，並開設複數個對應相通的破孔13，各破孔13係呈間隔排列，且與複數插槽11呈相互的匹配對應；複數散熱鰭片2，係分別插植結合於底座端面1a的複數插槽11，各散熱鰭片2並具有可伸入破孔13的相對底部21；一個以上的熱管3，係可匹配嵌合於底座底面1b的嵌槽12，且於嵌入後，可使熱管3的嵌入部份係平整露出底座底面1b(如第三、四圖)，熱管3亦可彎曲而貫穿結合於複數散熱鰭片2，但熱管3的具體實施形態，則並無限制必要；依上述構件，其係以複數散熱鰭片2的相對底 部21伸入底座1的破孔13而抵觸於熱管3，使散熱鰭片2除可插植結合於底座1的端面插槽11以外，並可利用局部的相對底部21通過破孔13而直接接觸熱管3，因此使散熱鰭片2可直接傳遞熱管3所吸收的熱溫，用以加快散熱效果。
如第五、六圖所示，依本發明設計精神，所述底座嵌槽12的凹槽最深位置D，其係可更貼近於底座1的端面1a，故可縮短嵌槽12與底座端面1a之間的間距T1(厚度)，使得底座1的板體厚度T2可相對變薄，從而具有縮減底座1體積重量的優點，並減少底座1的用材耗費而降低成本。
如實施例圖所示，所述的複數散熱鰭片2，亦可在所述散熱鰭片2的底部預先反折而形成一反折面22，再於反折面22設有一可供伸入破孔13的相對底部21，以供與熱管3產生較佳的接觸效果
上述散熱鰭片2的相對底部21，其係可實施為平底狀、弧面狀，或依熱管3的不同管壁形狀而實施為其他相對凹凸的形狀，以確保散熱鰭片2的相對底部21可與熱管3的管壁形成相對吻合的較佳接觸。如第五、六圖實施例所示，該熱管3的管壁係呈圓弧狀，故散熱鰭片2的相對底部21亦呈相對適配的凹弧狀；或如第七、八圖的實施例所示，如係採用梯形熱管3’時，則除了底座1’的嵌槽12’形狀必須相對改變外，所述散熱鰭片2’的相對底部21’亦應改為相對吻合的凹口形狀，用以形成較佳的 適配接觸。
如上所述，底座1的嵌槽12形狀，於實施時並無特別限制的必要，嵌槽12主要是匹配熱管3而形成對應嵌入，進而再施予壓擠整平，以使熱管3可平整鑲嵌於嵌槽12，因此，熱管3於嵌入後的管身形狀係可隨著嵌槽12的形狀而改變，並形成穩固的緊配結合。
第九圖為第四圖的B-B剖面圖，其係顯示各散熱鰭片2的相對底部21可伸入底座1的破孔13而直接接觸熱管3，使散熱鰭片2可在第一時間快速傳遞熱管3所吸收的熱溫。
如實施例圖顯示，所述的熱管3，係可從一側相同方向彎曲貫穿結合於複數散熱鰭片2，但有關熱管3的具體實施形態，其於本發明而言，並無特別限制必要，例如第十圖之另一種實施形態組合，則是揭露熱管3亦可分別從兩側不同方向彎曲貫穿結合於複數散熱鰭片2。
如圖所示的底座1，其係可在嵌槽12以外的板體兩側，分別形成一內凹面14，並於該內凹面14開設複數鎖孔141，以使散熱器適於鎖合裝配。
如上實施例，僅在於揭露本發明的主要技術特徵，但並非用以限定本案的技術範圍，舉凡涉及散熱器基本形態的簡易改變，而為等效應用或簡易的變更或置換手段，自仍應視為屬於本案技術範圍。
綜上所述，誠可見本發明所為熱管散熱器設計，其技術特徵確為前所未見，並可增進功效，故已符合新 穎進步要件，敬祈 詳審並依法賜准專利，實感德便。
1‧‧‧底座
2‧‧‧散熱鰭片
3‧‧‧熱管
11‧‧‧插槽
1b‧‧‧底面
12‧‧‧嵌槽
13‧‧‧破孔
21‧‧‧相對底部
22‧‧‧反折面
14‧‧‧內凹面
141‧‧‧鎖孔

Claims (10)

  1. 一種熱管散熱器，係包括一底座、複數散熱鰭片及一個以上的熱管，該底座係於底座端面設有複數插槽，而底座底面係開設一個以上嵌槽，複數散熱鰭片係分別插植結合於底座端面的複數插槽，熱管係匹配嵌合於底座底面的嵌槽，而其特徵在於：底座，係在底座端面的插槽與底座底面的嵌槽之間開設複數個對應相通的破孔，各破孔係呈間隔排列，並與複數插槽呈相互的匹配對應；複數散熱鰭片，係在各散熱鰭片設有可伸入破孔的相對底部；依上述構件，係將複數散熱鰭片的相對底部伸入底座的破孔而抵觸於熱管，以使散熱鰭片可直接傳遞熱管所吸收的熱溫。
  2. 如申請專利範圍第1項所述的熱管散熱器，該底座的複數插槽係呈併排狀。
  3. 如申請專利範圍第1項所述的熱管散熱器，所述熱管的嵌入部份係平整露出底座底面。
  4. 如申請專利範圍第1項所述的熱管散熱器，所述複數散熱鰭片係在底部預先反折而形成一反折面。
  5. 如申請專利範圍第1項所述的熱管散熱器，所述複數散熱鰭片的相對底部係呈平底狀。
  6. 如申請專利範圍第1項所述的熱管散熱器，所述複數散熱鰭片的相對底部係呈弧面狀。
  7. 如申請專利範圍第1項所述的熱管散熱器，所述複數散熱鰭片的相對底部係依熱管的管壁形狀而程相對凹凸的形狀。
  8. 如申請專利範圍第1項所述的熱管散熱器，所述熱管係從一側相同方向彎曲貫穿結合複數散熱鰭片。
  9. 如申請專利範圍第1項所述的熱管散熱器，所述熱管係從兩側不同方向彎曲貫穿結合複數散熱鰭片。
  10. 如申請專利範圍第1項所述的熱管散熱器，該底座係在嵌槽以外的板體兩側分別形成一內凹面，並於內凹面開設複數鎖孔。
TW102100879A 2012-11-16 2013-01-10 Heat pipe radiator TWI575213B (zh)

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JP3182697U (ja) 2013-04-04
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CN102970851A (zh) 2013-03-13
US20140138074A1 (en) 2014-05-22

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