TWI562395B - Method of forming nanostructures on a substrate and use of the same - Google Patents
Method of forming nanostructures on a substrate and use of the sameInfo
- Publication number
- TWI562395B TWI562395B TW101118733A TW101118733A TWI562395B TW I562395 B TWI562395 B TW I562395B TW 101118733 A TW101118733 A TW 101118733A TW 101118733 A TW101118733 A TW 101118733A TW I562395 B TWI562395 B TW I562395B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- same
- forming nanostructures
- nanostructures
- forming
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161489810P | 2011-05-25 | 2011-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201301554A TW201301554A (zh) | 2013-01-01 |
TWI562395B true TWI562395B (en) | 2016-12-11 |
Family
ID=47467047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101118733A TWI562395B (en) | 2011-05-25 | 2012-05-25 | Method of forming nanostructures on a substrate and use of the same |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP2012246216A (zh) |
CN (1) | CN103236395B (zh) |
TW (1) | TWI562395B (zh) |
Families Citing this family (23)
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CN103048707A (zh) * | 2013-01-04 | 2013-04-17 | 苏州大学 | 制作亚波长抗反射结构和亚波长抗反射结构压模的方法 |
TW201445246A (zh) * | 2013-05-31 | 2014-12-01 | Nanocrystal Asia Inc | 無缺陷模仁之製造方法 |
WO2015023760A1 (en) * | 2013-08-14 | 2015-02-19 | Board Of Regents, The University Of Texas System | Methods of fabricating silicon nanowires and devices containing silicon nanowires |
US20160293781A1 (en) * | 2013-11-21 | 2016-10-06 | The Hong Kong University Of Science And Technology | Three dimensional anti-reflection nanocone film |
JP6037083B2 (ja) | 2014-04-18 | 2016-11-30 | 富士電機株式会社 | 半導体装置の製造方法 |
DE112014003658T5 (de) | 2014-04-18 | 2016-05-12 | Fuji Electric Co., Ltd. | Verfahren zum Herstellen einer Halbleitervorrichtung |
CN103924192A (zh) * | 2014-04-21 | 2014-07-16 | 上海理工大学 | 一种具有纳米微腔结构的金属银薄膜的制备方法 |
KR101588577B1 (ko) * | 2014-06-11 | 2016-01-28 | 한국표준과학연구원 | 대면적의 수직 정렬된 갈륨비소 반도체 나노선 어레이 제작 공정 |
CN104659179A (zh) * | 2015-03-10 | 2015-05-27 | 江苏新广联半导体有限公司 | 用于GaN基LED的抗反射透明电极结构及其制备方法 |
CN105914270B (zh) * | 2016-06-28 | 2018-09-18 | 聚灿光电科技股份有限公司 | 硅基氮化镓led外延结构的制造方法 |
CN107425095A (zh) * | 2017-05-05 | 2017-12-01 | 江南大学 | 一种使用Ni纳米模板制备多波段发光的InGaN/GaN量子阱结构的方法 |
CN108018531B (zh) * | 2017-11-27 | 2020-04-17 | 天津大学 | 一种制备纳米多孔金属材料的方法 |
CN108281517B (zh) * | 2018-01-26 | 2020-06-16 | 厦门市三安光电科技有限公司 | 一种发光二极管的制作方法 |
CN109338287B (zh) * | 2018-08-15 | 2021-02-26 | 南京理工大学 | 一种织构化Ta/Ag宽温区自润滑涂层及其制备方法 |
CN108922948B (zh) * | 2018-08-24 | 2023-11-10 | 广东省半导体产业技术研究院 | 一种发光二极管结构及其制作方法 |
CN109786501B (zh) * | 2018-12-11 | 2020-09-18 | 江西展宇新能科技有限公司 | 一种多晶黑硅片的制绒方法 |
CN109534684A (zh) * | 2018-12-27 | 2019-03-29 | 河南豫科玻璃技术股份有限公司 | 一种基于纳米级无闪点防眩光技术的蚀刻玻璃及其刻蚀工艺 |
US11583954B2 (en) | 2019-03-04 | 2023-02-21 | Kabushiki Kaisha Toshiba | Welding method |
CN110118806A (zh) * | 2019-05-29 | 2019-08-13 | 兰州大学 | 陶瓷管型气体传感器及其制备方法 |
CN111362225B (zh) * | 2020-03-17 | 2024-01-30 | 中国科学院半导体研究所 | 纳米针尖结构、复合结构及其制备方法 |
CN112018213B (zh) * | 2020-07-20 | 2022-03-29 | 烟台南山学院 | 一种与基底表面具有高粘附力的直立Au纳米锥的制备方法 |
CN112614945B (zh) * | 2020-12-16 | 2023-02-10 | 同济大学 | 具有沟槽阵列结构的微纳单晶柔性光电探测器及其制备 |
CN112820634B (zh) * | 2021-01-14 | 2024-01-16 | 镓特半导体科技(上海)有限公司 | 半导体结构、自支撑氮化镓层及其制备方法 |
Citations (4)
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US20060097691A1 (en) * | 2002-11-05 | 2006-05-11 | Mino Green | Structured silicon anode |
JP2007294972A (ja) * | 2006-04-25 | 2007-11-08 | Lg Innotek Co Ltd | 発光素子及びその製造方法 |
JP2008124413A (ja) * | 2006-10-20 | 2008-05-29 | Mitsubishi Electric Corp | シリコン基板の粗面化方法および光起電力装置の製造方法 |
CN101295636A (zh) * | 2007-04-25 | 2008-10-29 | 中国科学院半导体研究所 | 高晶体质量氮化物外延生长所用图形衬底的制备方法 |
Family Cites Families (23)
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JP2001267242A (ja) * | 2000-03-14 | 2001-09-28 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体及びその製造方法 |
US6329296B1 (en) * | 2000-08-09 | 2001-12-11 | Sandia Corporation | Metal catalyst technique for texturing silicon solar cells |
JP3830083B2 (ja) * | 2001-03-07 | 2006-10-04 | スタンレー電気株式会社 | 半導体装置およびその製造方法 |
US6818061B2 (en) * | 2003-04-10 | 2004-11-16 | Honeywell International, Inc. | Method for growing single crystal GaN on silicon |
KR100576854B1 (ko) * | 2003-12-20 | 2006-05-10 | 삼성전기주식회사 | 질화물 반도체 제조 방법과 이를 이용한 질화물 반도체 |
JP2005235908A (ja) * | 2004-02-18 | 2005-09-02 | Osaka Gas Co Ltd | 窒化物半導体積層基板及びGaN系化合物半導体装置 |
US20060124956A1 (en) * | 2004-12-13 | 2006-06-15 | Hui Peng | Quasi group III-nitride substrates and methods of mass production of the same |
CN100470864C (zh) * | 2005-03-14 | 2009-03-18 | 株式会社东芝 | 具有荧光物质的led |
JP2006303154A (ja) * | 2005-04-20 | 2006-11-02 | Matsushita Electric Ind Co Ltd | 半導体発光素子及びその製造方法 |
KR20060131327A (ko) * | 2005-06-16 | 2006-12-20 | 엘지전자 주식회사 | 발광 다이오드의 제조 방법 |
KR100753152B1 (ko) * | 2005-08-12 | 2007-08-30 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
JP2007059850A (ja) * | 2005-08-26 | 2007-03-08 | Ngk Insulators Ltd | Iii族窒化物成膜用基板及びその製造方法並びにそれを用いた半導体装置 |
KR20070063731A (ko) * | 2005-12-15 | 2007-06-20 | 엘지전자 주식회사 | 나노 패턴이 형성된 기판의 제조방법 및 그 기판을 이용한발광소자 |
KR100843474B1 (ko) * | 2006-12-21 | 2008-07-03 | 삼성전기주식회사 | Ⅲ족 질화물 단결정 성장방법 및 이를 이용하여 제조된질화물 단결정 |
GB0702560D0 (en) * | 2007-02-09 | 2007-03-21 | Univ Bath | Production of Semiconductor devices |
DE102007020979A1 (de) * | 2007-04-27 | 2008-10-30 | Azzurro Semiconductors Ag | Nitridhalbleiterbauelement mit Gruppe-III-Nitrid-Schichtstruktur auf einer Gruppe-IV-Substratoberfläche mit höchstens zweizähliger Symmetrie |
JP2010192658A (ja) * | 2009-02-18 | 2010-09-02 | Asahi Kasei E-Materials Corp | 太陽電池用基板及び太陽電池用基板の製造方法 |
JP5330040B2 (ja) * | 2009-03-17 | 2013-10-30 | 株式会社東芝 | 半導体素子、半導体装置、半導体ウェーハ及び半導体結晶の成長方法 |
CN101521239A (zh) * | 2009-03-24 | 2009-09-02 | 中国科学院微电子研究所 | 硅基纳米柱阵列异质结薄膜太阳能电池及其制备方法 |
CN101898751B (zh) * | 2009-05-27 | 2012-08-08 | 中国科学院半导体研究所 | Ⅲ族氮化物纳米材料的生长方法 |
JP4681684B1 (ja) * | 2009-08-24 | 2011-05-11 | Dowaエレクトロニクス株式会社 | 窒化物半導体素子およびその製造方法 |
JP5378128B2 (ja) * | 2009-09-18 | 2013-12-25 | Dowaエレクトロニクス株式会社 | 電子デバイス用エピタキシャル基板およびiii族窒化物電子デバイス用エピタキシャル基板 |
SG10201500763XA (en) * | 2009-10-30 | 2015-04-29 | Univ Rice William M | Structured silicon battery anodes |
-
2012
- 2012-05-25 CN CN201210167215.3A patent/CN103236395B/zh not_active Expired - Fee Related
- 2012-05-25 TW TW101118733A patent/TWI562395B/zh not_active IP Right Cessation
- 2012-05-25 JP JP2012119697A patent/JP2012246216A/ja active Pending
-
2016
- 2016-04-27 JP JP2016089002A patent/JP6257692B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060097691A1 (en) * | 2002-11-05 | 2006-05-11 | Mino Green | Structured silicon anode |
JP2007294972A (ja) * | 2006-04-25 | 2007-11-08 | Lg Innotek Co Ltd | 発光素子及びその製造方法 |
JP2008124413A (ja) * | 2006-10-20 | 2008-05-29 | Mitsubishi Electric Corp | シリコン基板の粗面化方法および光起電力装置の製造方法 |
CN101295636A (zh) * | 2007-04-25 | 2008-10-29 | 中国科学院半导体研究所 | 高晶体质量氮化物外延生长所用图形衬底的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2016189469A (ja) | 2016-11-04 |
CN103236395A (zh) | 2013-08-07 |
CN103236395B (zh) | 2016-09-28 |
JP6257692B2 (ja) | 2018-01-10 |
TW201301554A (zh) | 2013-01-01 |
JP2012246216A (ja) | 2012-12-13 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |