TWI562240B - - Google Patents
Info
- Publication number
- TWI562240B TWI562240B TW104129332A TW104129332A TWI562240B TW I562240 B TWI562240 B TW I562240B TW 104129332 A TW104129332 A TW 104129332A TW 104129332 A TW104129332 A TW 104129332A TW I562240 B TWI562240 B TW I562240B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012210264A JP6080451B2 (ja) | 2012-09-25 | 2012-09-25 | 基板処理装置、半導体装置の製造方法、及び熱電対支持体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201546905A TW201546905A (zh) | 2015-12-16 |
| TWI562240B true TWI562240B (US07223432-20070529-C00017.png) | 2016-12-11 |
Family
ID=50547606
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104129332A TW201546905A (zh) | 2012-09-25 | 2013-09-09 | 熱電偶支撐體、基板處理裝置、溫度檢測方法及半導體裝置之製造方法 |
| TW102132387A TWI511203B (zh) | 2012-09-25 | 2013-09-09 | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102132387A TWI511203B (zh) | 2012-09-25 | 2013-09-09 | A substrate processing apparatus, a manufacturing method of a semiconductor device, and a temperature detection method |
Country Status (4)
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140134838A1 (en) * | 2012-11-09 | 2014-05-15 | Primestar Solar, Inc. | Methods of annealing a conductive transparent oxide film layer for use in a thin film photovoltaic device |
| US9700951B2 (en) * | 2014-05-28 | 2017-07-11 | Hakko Corporation | Heater sensor complex with high thermal capacity |
| JP6333126B2 (ja) | 2014-08-29 | 2018-05-30 | 東京エレクトロン株式会社 | 磁気アニール装置及び磁気アニール方法 |
| DE102014119593A1 (de) * | 2014-12-23 | 2016-06-23 | Endress + Hauser Wetzer Gmbh + Co. Kg | Temperaturfühler |
| US10228291B2 (en) | 2015-02-25 | 2019-03-12 | Kokusai Electric Corporation | Substrate processing apparatus, and thermocouple |
| JP6579974B2 (ja) | 2015-02-25 | 2019-09-25 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、温度センサ及び半導体装置の製造方法 |
| US10535538B2 (en) * | 2017-01-26 | 2020-01-14 | Gary Hillman | System and method for heat treatment of substrates |
| JP6857156B2 (ja) | 2017-07-14 | 2021-04-14 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、基板保持具及び半導体装置の製造方法 |
| KR20190008101A (ko) | 2017-07-14 | 2019-01-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법 |
| US10998205B2 (en) * | 2018-09-14 | 2021-05-04 | Kokusai Electric Corporation | Substrate processing apparatus and manufacturing method of semiconductor device |
| WO2020059722A1 (ja) | 2018-09-18 | 2020-03-26 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、温度制御システム及び半導体装置の製造方法 |
| WO2020145183A1 (ja) * | 2019-01-07 | 2020-07-16 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法およびヒータユニット |
| KR20220119670A (ko) * | 2020-03-02 | 2022-08-30 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 기판 처리 방법, 프로그램 및 반도체 장치의 제조 방법 |
| JP6916920B1 (ja) * | 2020-03-04 | 2021-08-11 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、治具、半導体装置の製造方法および基板処理装置の校正方法 |
| TWI736449B (zh) * | 2020-10-19 | 2021-08-11 | 中國鋼鐵股份有限公司 | 熱電偶之修復與固定裝置及其使用方法 |
| CN114527009B (zh) * | 2022-02-09 | 2023-07-04 | 南京钢铁股份有限公司 | 一种在热模拟试验机上熔化凝固过程控制方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63121431U (US07223432-20070529-C00017.png) * | 1987-01-30 | 1988-08-05 | ||
| JP2006173531A (ja) * | 2004-12-20 | 2006-06-29 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| TW201140699A (en) * | 2006-03-07 | 2011-11-16 | Hitachi Int Electric Inc | Substrate processing device and substrate processing method thereof |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3165426A (en) * | 1962-07-30 | 1965-01-12 | Beckman Paul | Thermopile |
| US3400587A (en) * | 1965-09-03 | 1968-09-10 | Bethlehem Steel Corp | Apparatus for measuring the temperature of a moving surface |
| US4377550A (en) * | 1981-01-29 | 1983-03-22 | The United States Of America As Represented By The United States Department Of Energy | High temperature liquid level sensor |
| JPH0648217B2 (ja) * | 1987-12-24 | 1994-06-22 | 川惣電機工業株式会社 | 溶融金属の連続測温装置 |
| US5517594A (en) * | 1994-10-17 | 1996-05-14 | Relman, Inc. | Thermal reactor optimization |
| JP3471100B2 (ja) * | 1994-11-07 | 2003-11-25 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
| JPH08210923A (ja) * | 1995-02-06 | 1996-08-20 | Kokusai Electric Co Ltd | 加熱炉用の炉内温度測定器 |
| JPH0997787A (ja) * | 1995-09-30 | 1997-04-08 | Tokyo Electron Ltd | 処理装置 |
| JPH1025577A (ja) * | 1996-07-12 | 1998-01-27 | Tokyo Electron Ltd | 成膜処理装置 |
| JP2000150404A (ja) * | 1998-11-11 | 2000-05-30 | Sony Corp | 熱処理装置 |
| WO2003040673A2 (en) * | 2001-11-02 | 2003-05-15 | Phipps Jack M | Temperature sensor with enhanced ambient air temperature detection |
| JP4557499B2 (ja) | 2003-04-07 | 2010-10-06 | 株式会社日立国際電気 | 基板処理装置 |
| US20050098107A1 (en) * | 2003-09-24 | 2005-05-12 | Du Bois Dale R. | Thermal processing system with cross-flow liner |
| JP4396547B2 (ja) * | 2004-06-28 | 2010-01-13 | 東京エレクトロン株式会社 | 成膜方法、成膜装置及び記憶媒体 |
| JP2006090742A (ja) | 2004-09-21 | 2006-04-06 | Okazaki Mfg Co Ltd | シース型ｋ熱電対 |
| KR100669861B1 (ko) * | 2005-03-21 | 2007-01-16 | 삼성전자주식회사 | 반도체 기판 가공 장치 |
| KR20060110951A (ko) * | 2005-04-21 | 2006-10-26 | 삼성전자주식회사 | 스파이크형 열전대 |
| KR100950681B1 (ko) * | 2005-08-09 | 2010-03-31 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 기판의 제조 방법 및 반도체 장치의 제조방법 |
| JP2008227363A (ja) * | 2007-03-15 | 2008-09-25 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| US7874726B2 (en) * | 2007-05-24 | 2011-01-25 | Asm America, Inc. | Thermocouple |
| KR101012082B1 (ko) * | 2007-06-25 | 2011-02-07 | 데이또꾸샤 가부시키가이샤 | 가열 장치 및 이것을 채용한 기판 처리 장치 및 반도체장치의 제조 방법 및 절연체 |
| US20090095422A1 (en) * | 2007-09-06 | 2009-04-16 | Hitachi Kokusai Electric Inc. | Semiconductor manufacturing apparatus and substrate processing method |
| KR101097945B1 (ko) * | 2007-10-19 | 2011-12-22 | 가부시키가이샤 히다치 고쿠사이 덴키 | 온도 제어 방법, 온도 보정치 취득 방법, 반도체 디바이스를 제조하기 위한 방법, 기판 처리 장치 |
| US7946762B2 (en) * | 2008-06-17 | 2011-05-24 | Asm America, Inc. | Thermocouple |
| JP5647502B2 (ja) * | 2010-02-23 | 2014-12-24 | 株式会社日立国際電気 | 熱処理装置、半導体装置の製造方法及び基板処理方法。 |
| KR101172376B1 (ko) * | 2010-06-11 | 2012-08-08 | 한국수력원자력 주식회사 | 외장 열전대를 이용한 용융금속 액위 측정 장치 |
| KR101196723B1 (ko) * | 2010-12-31 | 2012-11-07 | 주식회사수성기술 | 다결정 실리콘 잉곳 제조장치용 열전대 |
| JP5980551B2 (ja) * | 2011-07-13 | 2016-08-31 | 株式会社日立国際電気 | 温度検出部、基板処理装置、及び半導体装置の製造方法 |
-
2012
- 2012-09-25 JP JP2012210264A patent/JP6080451B2/ja active Active
-
2013
- 2013-08-30 KR KR1020130103884A patent/KR101543375B1/ko active IP Right Grant
- 2013-09-09 TW TW104129332A patent/TW201546905A/zh unknown
- 2013-09-09 TW TW102132387A patent/TWI511203B/zh active
- 2013-09-23 US US14/033,880 patent/US20140120636A1/en not_active Abandoned
-
2015
- 2015-03-03 KR KR1020150029724A patent/KR101579501B1/ko active IP Right Grant
-
2017
- 2017-10-20 US US15/789,311 patent/US10418293B2/en active Active
-
2019
- 2019-08-05 US US16/531,540 patent/US11049742B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63121431U (US07223432-20070529-C00017.png) * | 1987-01-30 | 1988-08-05 | ||
| JP2006173531A (ja) * | 2004-12-20 | 2006-06-29 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| TW201140699A (en) * | 2006-03-07 | 2011-11-16 | Hitachi Int Electric Inc | Substrate processing device and substrate processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI511203B (zh) | 2015-12-01 |
| US11049742B2 (en) | 2021-06-29 |
| JP6080451B2 (ja) | 2017-02-15 |
| KR20140039987A (ko) | 2014-04-02 |
| KR101543375B1 (ko) | 2015-08-11 |
| KR101579501B1 (ko) | 2015-12-22 |
| US20190355630A1 (en) | 2019-11-21 |
| KR20150035904A (ko) | 2015-04-07 |
| TW201546905A (zh) | 2015-12-16 |
| JP2014067766A (ja) | 2014-04-17 |
| TW201421585A (zh) | 2014-06-01 |
| US20140120636A1 (en) | 2014-05-01 |
| US10418293B2 (en) | 2019-09-17 |
| US20180040520A1 (en) | 2018-02-08 |
