TWI556292B - Wiring circuit, wiring board, and wiring board - Google Patents

Wiring circuit, wiring board, and wiring board Download PDF

Info

Publication number
TWI556292B
TWI556292B TW102100405A TW102100405A TWI556292B TW I556292 B TWI556292 B TW I556292B TW 102100405 A TW102100405 A TW 102100405A TW 102100405 A TW102100405 A TW 102100405A TW I556292 B TWI556292 B TW I556292B
Authority
TW
Taiwan
Prior art keywords
electrode layer
via hole
insulating layer
wiring
electrode
Prior art date
Application number
TW102100405A
Other languages
English (en)
Chinese (zh)
Other versions
TW201334044A (zh
Inventor
Taku Nagano
Takahiro Yoshida
Nobuyuki Yanagida
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201334044A publication Critical patent/TW201334044A/zh
Application granted granted Critical
Publication of TWI556292B publication Critical patent/TWI556292B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW102100405A 2012-02-10 2013-01-07 Wiring circuit, wiring board, and wiring board TWI556292B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012027382A JP2013165164A (ja) 2012-02-10 2012-02-10 配線回路、配線基板及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
TW201334044A TW201334044A (zh) 2013-08-16
TWI556292B true TWI556292B (zh) 2016-11-01

Family

ID=48947036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102100405A TWI556292B (zh) 2012-02-10 2013-01-07 Wiring circuit, wiring board, and wiring board

Country Status (5)

Country Link
JP (1) JP2013165164A (ko)
KR (2) KR20160052771A (ko)
CN (1) CN103947307B (ko)
TW (1) TWI556292B (ko)
WO (1) WO2013118229A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111418120B (zh) 2017-12-04 2022-10-21 三菱电机株式会社 电场吸收型调制器、光半导体装置及光模块
CN108093561A (zh) * 2017-12-22 2018-05-29 珠海市航达科技有限公司 一种热电分离印制电路板的制作方法
JP6803415B2 (ja) * 2019-01-30 2020-12-23 Hoya株式会社 回路基板固定構造、及びこれを備える光照射装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165343A (ja) * 2002-11-12 2004-06-10 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
TW200846411A (en) * 2007-01-15 2008-12-01 Taiyo Ink Mfg Co Ltd Thermosetting resin composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138454A (ja) * 1998-10-29 2000-05-16 Kyocera Corp 配線基板の製造方法
JP3591818B2 (ja) * 1999-06-17 2004-11-24 京セラ株式会社 配線基板の製造方法
US20060163989A1 (en) * 2002-07-10 2006-07-27 Koji Kawaguchi Blue color filter, and organic electroluminescent device using the same
CN100569825C (zh) * 2004-07-15 2009-12-16 太阳油墨制造株式会社 光固化性·热固化性树脂组合物及其固化物
CN102209438B (zh) * 2010-10-29 2012-12-26 博罗县精汇电子科技有限公司 高密度柔性线路板及其制作方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165343A (ja) * 2002-11-12 2004-06-10 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法
TW200846411A (en) * 2007-01-15 2008-12-01 Taiyo Ink Mfg Co Ltd Thermosetting resin composition

Also Published As

Publication number Publication date
JP2013165164A (ja) 2013-08-22
CN103947307A (zh) 2014-07-23
CN103947307B (zh) 2017-05-17
KR20160052771A (ko) 2016-05-12
KR20140079846A (ko) 2014-06-27
TW201334044A (zh) 2013-08-16
WO2013118229A1 (ja) 2013-08-15

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