TWI553163B - Method for manufacturing metal foil and manufacturing device thereof - Google Patents
Method for manufacturing metal foil and manufacturing device thereof Download PDFInfo
- Publication number
- TWI553163B TWI553163B TW101122578A TW101122578A TWI553163B TW I553163 B TWI553163 B TW I553163B TW 101122578 A TW101122578 A TW 101122578A TW 101122578 A TW101122578 A TW 101122578A TW I553163 B TWI553163 B TW I553163B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- cathode body
- metal foil
- cathode
- anode
- Prior art date
Links
- IZJNNISZNJIDAP-UHFFFAOYSA-N CCC(CCN=O)C=C Chemical compound CCC(CCN=O)C=C IZJNNISZNJIDAP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011139362 | 2011-06-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201313960A TW201313960A (zh) | 2013-04-01 |
TWI553163B true TWI553163B (zh) | 2016-10-11 |
Family
ID=47367109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101122578A TWI553163B (zh) | 2011-06-23 | 2012-06-22 | Method for manufacturing metal foil and manufacturing device thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6080760B2 (ko) |
KR (2) | KR101343951B1 (ko) |
CN (1) | CN102839398A (ko) |
TW (1) | TWI553163B (ko) |
WO (1) | WO2012176883A1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI539032B (zh) * | 2013-08-01 | 2016-06-21 | Chang Chun Petrochemical Co | Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method |
KR101639564B1 (ko) * | 2014-11-17 | 2016-07-22 | 주식회사 포스코 | 벨트형 전기 주조 장치 |
JP2019126998A (ja) * | 2018-01-26 | 2019-08-01 | 大日本印刷株式会社 | 装飾体および装飾体の製造方法 |
CN113755890B (zh) * | 2021-09-15 | 2024-05-24 | 广东德同环保科技有限公司 | 一种连续模式电解蚀刻液回收铜的装置及方法 |
CN114107911A (zh) * | 2021-11-11 | 2022-03-01 | 杭州四马化工科技有限公司 | 一种金属箔生产系统 |
CN116479513B (zh) * | 2023-05-05 | 2023-12-08 | 江苏荣生电子有限公司 | 一种电极箔加工用的腐蚀装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4931159A (en) * | 1987-02-13 | 1990-06-05 | Centre De Recherches Metallurgiques-Centrum Voor Research In De Metalurgie | Installation for continuous manufacturing of an ultrathin metal foil by electrolytic deposition |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339941A (en) * | 1976-09-25 | 1978-04-12 | Toppan Printing Co Ltd | High speed electrocasting apparatus |
JPS5395135A (en) * | 1977-01-31 | 1978-08-19 | Mitsui Mining & Smelting Co | Preparation of copper foil laminated product by high speed electrolytic method and its device |
JPS54107839A (en) * | 1978-02-14 | 1979-08-24 | Karifuoiru Inc | Method and apparatus for producing copper foil |
JPS6187889A (ja) * | 1984-10-04 | 1986-05-06 | Kawasaki Steel Corp | 合金薄帯の製造方法 |
EP0279803B1 (fr) * | 1987-02-13 | 1991-09-18 | CENTRE DE RECHERCHES METALLURGIQUES CENTRUM VOOR RESEARCH IN DE METALLURGIE Association sans but lucratif | Installation pour la fabrication en continu d'une feuille métallique extra-mince par dépôt électrolytique |
AT394215B (de) * | 1988-11-15 | 1992-02-25 | Andritz Ag Maschf | Verfahren zur elektrolytischen herstellung einer metallfolie |
JPH02307744A (ja) * | 1989-05-23 | 1990-12-20 | Toagosei Chem Ind Co Ltd | 極薄銅張積層板の製造方法 |
JPH02307743A (ja) * | 1989-05-23 | 1990-12-20 | Toagosei Chem Ind Co Ltd | 極薄銅張積層板の製造方法 |
US6270645B1 (en) * | 1997-09-26 | 2001-08-07 | Circuit Foil Usa, Inc. | Simplified process for production of roughened copper foil |
JP4439081B2 (ja) * | 2000-05-31 | 2010-03-24 | 日本電解株式会社 | 電解銅箔の製造方法とそれに用いる装置 |
JP4426127B2 (ja) * | 2001-03-29 | 2010-03-03 | 三井金属鉱業株式会社 | 金属箔電解製造装置 |
EP1444055A4 (en) | 2001-10-19 | 2007-04-18 | Superior Micropowders Llc | BAND-CONSTRUCTED COMPOSITIONS FOR DEPOSITING ELECTRONIC STRUCTURES |
DE10346368B4 (de) * | 2003-09-29 | 2006-05-18 | Siemens Ag | Verfahren und Herstellungsanlage zum Herstellen eines schichtartigen Bauteils |
JP4927503B2 (ja) | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
JP2009099520A (ja) | 2007-03-14 | 2009-05-07 | Toray Ind Inc | 膜電極複合体およびその製造方法ならびに高分子電解質型燃料電池 |
-
2012
- 2012-01-13 KR KR1020120004213A patent/KR101343951B1/ko active IP Right Grant
- 2012-06-20 CN CN2012102049954A patent/CN102839398A/zh active Pending
- 2012-06-22 JP JP2013521636A patent/JP6080760B2/ja active Active
- 2012-06-22 WO PCT/JP2012/066007 patent/WO2012176883A1/ja active Application Filing
- 2012-06-22 TW TW101122578A patent/TWI553163B/zh not_active IP Right Cessation
-
2013
- 2013-09-13 KR KR1020130110143A patent/KR101789299B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4931159A (en) * | 1987-02-13 | 1990-06-05 | Centre De Recherches Metallurgiques-Centrum Voor Research In De Metalurgie | Installation for continuous manufacturing of an ultrathin metal foil by electrolytic deposition |
Also Published As
Publication number | Publication date |
---|---|
KR20130109081A (ko) | 2013-10-07 |
KR20130001109A (ko) | 2013-01-03 |
WO2012176883A1 (ja) | 2012-12-27 |
KR101789299B1 (ko) | 2017-10-23 |
JP6080760B2 (ja) | 2017-02-15 |
KR101343951B1 (ko) | 2013-12-24 |
JPWO2012176883A1 (ja) | 2015-02-23 |
TW201313960A (zh) | 2013-04-01 |
CN102839398A (zh) | 2012-12-26 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |