TWI547575B - 金屬薄膜及金屬薄膜形成用鉬合金濺鍍靶材 - Google Patents

金屬薄膜及金屬薄膜形成用鉬合金濺鍍靶材 Download PDF

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Publication number
TWI547575B
TWI547575B TW103105379A TW103105379A TWI547575B TW I547575 B TWI547575 B TW I547575B TW 103105379 A TW103105379 A TW 103105379A TW 103105379 A TW103105379 A TW 103105379A TW I547575 B TWI547575 B TW I547575B
Authority
TW
Taiwan
Prior art keywords
film
thin film
metal thin
atom
resistance
Prior art date
Application number
TW103105379A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439347A (zh
Inventor
村田英夫
Original Assignee
日立金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立金屬股份有限公司 filed Critical 日立金屬股份有限公司
Publication of TW201439347A publication Critical patent/TW201439347A/zh
Application granted granted Critical
Publication of TWI547575B publication Critical patent/TWI547575B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW103105379A 2013-02-20 2014-02-19 金屬薄膜及金屬薄膜形成用鉬合金濺鍍靶材 TWI547575B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013030810 2013-02-20

Publications (2)

Publication Number Publication Date
TW201439347A TW201439347A (zh) 2014-10-16
TWI547575B true TWI547575B (zh) 2016-09-01

Family

ID=51307586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105379A TWI547575B (zh) 2013-02-20 2014-02-19 金屬薄膜及金屬薄膜形成用鉬合金濺鍍靶材

Country Status (4)

Country Link
JP (1) JP6292466B2 (ja)
KR (1) KR101597018B1 (ja)
CN (1) CN103993262B (ja)
TW (1) TWI547575B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP6997945B2 (ja) * 2016-12-27 2022-01-18 日立金属株式会社 積層配線膜およびその製造方法ならびにＭｏ合金スパッタリングターゲット材
WO2019003941A1 (ja) * 2017-06-29 2019-01-03 豊田合成 株式会社 装飾製品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201006938A (en) * 2008-04-28 2010-02-16 Starck H C Inc Molybdenum-niobium alloys, sputtering targets containing such alloys, methods of making such targets, thin films prepared therefrom and uses thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2828071B2 (ja) * 1996-10-22 1998-11-25 三菱マテリアル株式会社 耐食性のすぐれた物理蒸着非晶質膜材
JPH10301499A (ja) * 1997-04-22 1998-11-13 Ulvac Seimaku Kk ブランクス又はブラックマトリクス及びこれらの製造方法
JP4419036B2 (ja) 2000-11-27 2010-02-24 三菱マテリアル株式会社 ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲット
JP3859119B2 (ja) 2000-12-22 2006-12-20 日立金属株式会社 電子部品用薄膜配線
JP4905618B2 (ja) 2001-05-31 2012-03-28 株式会社東芝 配線形成用材料、配線形成用スパッタリングターゲット、配線薄膜及び電子部品
JP4496518B2 (ja) 2002-08-19 2010-07-07 日立金属株式会社 薄膜配線
JP2005289046A (ja) * 2004-03-10 2005-10-20 Asahi Glass Co Ltd 配線付き基体形成用の積層体、配線付き基体およびその形成方法
CN100566505C (zh) * 2004-09-01 2009-12-02 住友金属矿山株式会社 2层挠性基板及其制造方法
JP5203908B2 (ja) * 2008-12-04 2013-06-05 新日鉄住金マテリアルズ株式会社 Ｎｉ−Ｍｏ系合金スパッタリングターゲット板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201006938A (en) * 2008-04-28 2010-02-16 Starck H C Inc Molybdenum-niobium alloys, sputtering targets containing such alloys, methods of making such targets, thin films prepared therefrom and uses thereof

Also Published As

Publication number Publication date
KR20140104358A (ko) 2014-08-28
JP2014185393A (ja) 2014-10-02
CN103993262B (zh) 2016-04-06
TW201439347A (zh) 2014-10-16
KR101597018B1 (ko) 2016-02-23
CN103993262A (zh) 2014-08-20
JP6292466B2 (ja) 2018-03-14

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