KR101597018B1 - 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재 - Google Patents

금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재 Download PDF

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Publication number
KR101597018B1
KR101597018B1 KR1020140017743A KR20140017743A KR101597018B1 KR 101597018 B1 KR101597018 B1 KR 101597018B1 KR 1020140017743 A KR1020140017743 A KR 1020140017743A KR 20140017743 A KR20140017743 A KR 20140017743A KR 101597018 B1 KR101597018 B1 KR 101597018B1
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KR
South Korea
Prior art keywords
film
metal thin
thin film
atomic
alloy
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KR1020140017743A
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English (en)
Korean (ko)
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KR20140104358A (ko
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히데오 무라타
Original Assignee
히타치 긴조쿠 가부시키가이샤
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Publication of KR20140104358A publication Critical patent/KR20140104358A/ko
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Publication of KR101597018B1 publication Critical patent/KR101597018B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
KR1020140017743A 2013-02-20 2014-02-17 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재 KR101597018B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-030810 2013-02-20
JP2013030810 2013-02-20

Publications (2)

Publication Number Publication Date
KR20140104358A KR20140104358A (ko) 2014-08-28
KR101597018B1 true KR101597018B1 (ko) 2016-02-23

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KR1020140017743A KR101597018B1 (ko) 2013-02-20 2014-02-17 금속 박막 및 금속 박막 형성용 Mo 합금 스퍼터링 타깃재

Country Status (4)

Country Link
JP (1) JP6292466B2 (ja)
KR (1) KR101597018B1 (ja)
CN (1) CN103993262B (ja)
TW (1) TWI547575B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP6997945B2 (ja) * 2016-12-27 2022-01-18 日立金属株式会社 積層配線膜およびその製造方法ならびにＭｏ合金スパッタリングターゲット材
CN110799349B (zh) * 2017-06-29 2021-12-21 丰田合成株式会社 装饰产品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167666A (ja) 2000-11-27 2002-06-11 Mitsubishi Materials Corp ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲットおよびそのスパッタリングターゲットを用いて形成した遮光膜
JP2002356733A (ja) 2001-05-31 2002-12-13 Toshiba Corp 配線形成用材料、配線形成用スパッタリングターゲット、配線薄膜及び電子部品
JP2010132974A (ja) * 2008-12-04 2010-06-17 Nippon Steel Materials Co Ltd Ｎｉ−Ｍｏ系合金スパッタリングターゲット板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2828071B2 (ja) * 1996-10-22 1998-11-25 三菱マテリアル株式会社 耐食性のすぐれた物理蒸着非晶質膜材
JPH10301499A (ja) * 1997-04-22 1998-11-13 Ulvac Seimaku Kk ブランクス又はブラックマトリクス及びこれらの製造方法
JP3859119B2 (ja) 2000-12-22 2006-12-20 日立金属株式会社 電子部品用薄膜配線
JP4496518B2 (ja) 2002-08-19 2010-07-07 日立金属株式会社 薄膜配線
JP2005289046A (ja) * 2004-03-10 2005-10-20 Asahi Glass Co Ltd 配線付き基体形成用の積層体、配線付き基体およびその形成方法
KR100858309B1 (ko) * 2004-09-01 2008-09-11 스미토모 긴조쿠 고잔 가부시키가이샤 2층 플렉시블 기판 및 그 제조 방법
KR20100135957A (ko) * 2008-04-28 2010-12-27 에이치. 씨. 스타아크 아이앤씨 몰리브덴-니오브 합금, 몰리브덴-니오브 합금을 포함하는 스퍼터링 타겟, 이러한 스퍼터링 타겟의 제조 방법 및 이러한 스퍼터링 타겟으로부터 준비되는 박막 및 그 용도

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167666A (ja) 2000-11-27 2002-06-11 Mitsubishi Materials Corp ブラックマトリックス用遮光膜を形成するためのスパッタリングターゲットおよびそのスパッタリングターゲットを用いて形成した遮光膜
JP2002356733A (ja) 2001-05-31 2002-12-13 Toshiba Corp 配線形成用材料、配線形成用スパッタリングターゲット、配線薄膜及び電子部品
JP2010132974A (ja) * 2008-12-04 2010-06-17 Nippon Steel Materials Co Ltd Ｎｉ−Ｍｏ系合金スパッタリングターゲット板

Also Published As

Publication number Publication date
TW201439347A (zh) 2014-10-16
TWI547575B (zh) 2016-09-01
CN103993262A (zh) 2014-08-20
CN103993262B (zh) 2016-04-06
JP6292466B2 (ja) 2018-03-14
JP2014185393A (ja) 2014-10-02
KR20140104358A (ko) 2014-08-28

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