TWI538743B - 液體供給裝置 - Google Patents

液體供給裝置 Download PDF

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Publication number
TWI538743B
TWI538743B TW103106567A TW103106567A TWI538743B TW I538743 B TWI538743 B TW I538743B TW 103106567 A TW103106567 A TW 103106567A TW 103106567 A TW103106567 A TW 103106567A TW I538743 B TWI538743 B TW I538743B
Authority
TW
Taiwan
Prior art keywords
liquid supply
liquid
supply path
nozzle
valve
Prior art date
Application number
TW103106567A
Other languages
English (en)
Chinese (zh)
Other versions
TW201440897A (zh
Inventor
大久保敬弘
戶塚誠也
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201440897A publication Critical patent/TW201440897A/zh
Application granted granted Critical
Publication of TWI538743B publication Critical patent/TWI538743B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
TW103106567A 2013-03-01 2014-02-26 液體供給裝置 TWI538743B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013040814A JP5853971B2 (ja) 2013-03-01 2013-03-01 液供給装置

Publications (2)

Publication Number Publication Date
TW201440897A TW201440897A (zh) 2014-11-01
TWI538743B true TWI538743B (zh) 2016-06-21

Family

ID=51691579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103106567A TWI538743B (zh) 2013-03-01 2014-02-26 液體供給裝置

Country Status (3)

Country Link
JP (1) JP5853971B2 (ko)
KR (1) KR101998894B1 (ko)
TW (1) TWI538743B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP6512894B2 (ja) * 2015-03-27 2019-05-15 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置および処理液供給装置の制御方法
JP6925872B2 (ja) * 2017-05-31 2021-08-25 東京エレクトロン株式会社 基板液処理装置、処理液供給方法及び記憶媒体
CN110159928B (zh) * 2018-02-13 2021-04-20 辛耘企业股份有限公司 流体控制装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115267U (ko) * 1990-03-09 1991-11-28
JP2766253B2 (ja) * 1996-06-27 1998-06-18 山形日本電気株式会社 液体の流量安定化装置
JPH1133471A (ja) * 1997-07-23 1999-02-09 Tokyo Electron Ltd 塗布装置
JP3490320B2 (ja) 1999-02-02 2004-01-26 東京エレクトロン株式会社 塗布膜形成方法および塗布処理装置
JP3990567B2 (ja) * 2001-12-18 2007-10-17 大日本スクリーン製造株式会社 ダイヤフラムバルブ、基板処理ユニットおよび基板処理装置
JP4668027B2 (ja) * 2005-10-17 2011-04-13 シーケーディ株式会社 薬液供給システム
JP5045741B2 (ja) * 2009-12-25 2012-10-10 東京エレクトロン株式会社 薬液供給ノズル及び薬液供給方法

Also Published As

Publication number Publication date
KR101998894B1 (ko) 2019-07-10
JP5853971B2 (ja) 2016-02-09
TW201440897A (zh) 2014-11-01
JP2014168734A (ja) 2014-09-18
KR20140109258A (ko) 2014-09-15

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