TWI538743B - Liquid supply device - Google Patents

Description

Liquid supply device

The present invention relates to a liquid supply device for supplying a treatment liquid to a target object through a nozzle.

As a monolithic apparatus for supplying a treatment liquid such as a chemical solution, for example, a chemical solution containing a photoresist or an insulating film precursor is applied to a wafer on a rotary chuck. The liquid processing apparatus is a liquid supply apparatus that supplies the processing liquid to the wafer, and discharges the processing liquid from the liquid discharge unit provided at the downstream end of the liquid supply path, that is, the opening and closing of the opening and closing valve. Supply and interruption of the treatment liquid. After the supply of the treatment liquid from the nozzle is stopped, if the treatment liquid is dripped onto the wafer, the film thickness distribution of the liquid film on the wafer is uneven, and the wafer becomes a defective product. Therefore, in the case where the dripping liquid is a problem, a suction back valve (Suck back valve) is generally provided on the downstream side of the opening and closing valve, and after the opening and closing valve is closed, the liquid is sucked back by the suck back valve.

However, if the opening and closing valve is suddenly shut down, the hydraulic pressure is greatly changed, and the treatment liquid vibrates in the flow direction in the liquid supply path, that is, causes a so-called Water Hammer phenomenon. Therefore, in the case where the timing of the operation of the suckback valve is not appropriate, the amplitude of the liquid vibration increases, which may cause the liquid to splash out from the nozzle. If the length dimension of the liquid supply path is longer, the water hammer phenomenon becomes more remarkable. The time point at which the suction valve operates should be set after the liquid vibration is calm, but if the time is too late, the processing speed will be slow. Therefore, if you want to balance the two Setting this time point is difficult because the time point is difficult to set; in addition, even if the time point is delayed, it is possible that the liquid splashes out of the nozzle due to liquid vibration before the suckback valve operates.

In Patent Document 1, although the suction valve is described, the water hammer phenomenon is not discussed.

[First technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2000-223402

The present invention has been made in view of the above circumstances, and an object thereof is to provide a liquid supply device capable of suppressing dripping due to a water hammer phenomenon when a valve is closed when a processing liquid is supplied from a nozzle to a target object (Dripping ).

The liquid supply device of the present invention is a liquid supply device for supplying a processing liquid from a nozzle to a target object, and is characterized in that the first liquid supply path includes a curved portion corresponding to a curved portion. On the upstream side, the upstream side is connected to the liquid supply source of the treatment liquid; the valve is inserted in the first liquid supply path for supplying and blocking the treatment liquid; and the second liquid supply path corresponds to the flow path a downstream side of the curved portion, a nozzle at a downstream end thereof, a movable wall portion for absorbing vibration, a wall portion close to the curved portion, and freely advancing and retracting, and a driving portion for processing when the valve is closed When the liquid is pushed out to the nozzle side and then sucked back to the valve side, the movable wall portion for absorbing vibration is retracted; and the suction mechanism is provided on the downstream side of the second liquid supply path for coming from After the discharge of the liquid of the nozzle is completed and the movable wall portion for absorbing the vibration is receded, the liquid level of the treatment liquid in the nozzle is sucked.

The liquid supply device may have the following configuration. A configuration of a control unit that controls the drive unit is provided. The control unit is configured to output a control signal such that "the movable wall portion is retracted after the valve is closed and the set time elapses." The control unit is configured to output a control signal such that "the movable wall portion is advanced when the valve is opened or is being opened". The movable wall portion is composed of a diaphragm. The second liquid supply path is provided with a suction mechanism that sucks the processing liquid in the nozzle to the valve side.

In the present invention, when the processing liquid of the liquid supply source is discharged from the nozzle, the first liquid supply path and the second liquid supply path between the liquid supply source and the nozzle are formed so that the directions intersect each other. Hydraulic adjustment chamber connection. Further, the wall portion facing the upstream end of the second liquid supply path in the hydraulic pressure adjustment chamber constitutes a movable wall portion that is free to advance and retreat. Next, when the valve provided in the first liquid supply path is closed, the movable wall portion is retracted when the process liquid is sucked out to the nozzle side and then sucked back to the valve side. Therefore, it is possible to suppress the dripping from the nozzle after the discharge of the treatment liquid is completed.

1‧‧‧Collection nozzle

2‧‧‧Liquid supply

3‧‧‧Liquid supply path

3A‧‧‧1st liquid supply path

3B‧‧‧Second liquid supply path

4‧‧‧Liquid Supply Control Department

5~7‧‧‧Separator

8‧‧‧Hydraulic adjustment room

10‧‧‧ base

11‧‧‧Processing Department

12‧‧‧Rotary chuck

13‧‧‧ cup body

14‧‧‧lifting pin

15‧‧‧Auxiliary nozzle

16‧‧‧Nozzle Standby

17‧‧‧ Arms

18‧‧‧ rails

21‧‧‧ Arms

22‧‧‧ rails

23‧‧‧Spray

24‧‧‧Nozzles

25‧‧‧Flow channel for liquid delivery

26‧‧‧ Fixed Department

27‧‧‧Nozzle Standby

31A‧‧‧Opening and closing valve

31B‧‧‧Hydraulic adjustment valve

31C‧‧‧Retraction valve

33‧‧‧Inlet

34‧‧‧Export

36‧‧‧Valves

37‧‧‧Flow Adjustment Department

38‧‧‧ Storage Department

41‧‧‧Control Department

51‧‧‧ partition wall

52‧‧‧Support Department

53‧‧‧ Drive Department

54‧‧‧Advance and retraction axis

55‧‧‧Piezoelectric components

56‧‧‧Piezoelectric substrate

57‧‧‧Electrode film

58‧‧‧Support Department

59‧‧‧High Frequency Power Supply Department

61‧‧‧ Magnet

62‧‧‧Support Department

63‧‧‧Electrical Stone

64‧‧‧DC Power Supply Department

65‧‧‧ switch

71‧‧‧film

72‧‧‧ Drive Department

73‧‧‧Advance and retraction axis

W‧‧‧ wafer

Fig. 1 is a perspective view showing a photoresist coating apparatus including the liquid supply device of the present invention.

Fig. 2 is a longitudinal sectional view showing the liquid supply device.

Fig. 3 is a perspective view schematically showing a part of a flow path in the liquid supply device.

Fig. 4 is a view showing a time point at which each valve in the photoresist coating device is opened and closed.

Fig. 5 is a longitudinal sectional view schematically showing the action in a conventional liquid supply device.

Fig. 6 is a longitudinal sectional view schematically showing the action in a conventional liquid supply device.

Fig. 7 is a characteristic diagram showing hydraulic fluctuations in a conventional liquid supply device and a liquid supply device of the present invention.

Fig. 8 is a longitudinal sectional view schematically showing the action in the liquid supply device of the present invention.

Fig. 9 is a longitudinal sectional view schematically showing the action in the liquid supply device of the present invention.

Fig. 10 is a longitudinal sectional view schematically showing the action in the liquid supply device of the present invention.

Fig. 11 is a longitudinal sectional view schematically showing the action in the liquid supply device of the present invention.

Fig. 12 is a longitudinal sectional view showing another embodiment of the liquid supply device of the present invention.

Fig. 13 is a longitudinal sectional view showing another embodiment of the liquid supply device of the present invention.

Fig. 14 is a longitudinal sectional view showing another embodiment of the liquid supply device of the present invention.

Fig. 15 is a longitudinal sectional view showing another embodiment of the liquid supply device of the present invention.

Fig. 16 is a longitudinal sectional view showing another embodiment of the liquid supply device of the present invention.

Fig. 17 is a view showing the time at which each valve is opened and closed in another embodiment of the liquid supply device of the present invention.

Hereinafter, a liquid supply device according to an embodiment of the present invention and a photoresist coating device to which the liquid supply device is applied will be described with reference to Figs. 1 to 3 . The photoresist coating apparatus is configured to apply a treatment liquid, that is, a photoresist liquid, to a wafer W that is a substrate of a target object, and includes a plurality of, for example, three processing units 11 arranged side by side in the lateral direction; The control unit 4 supplies the photoresist to the wafer W disposed in each of the processing units 11. First, a portion other than the liquid supply control unit 4 will be briefly described.

As shown in FIG. 1, each processing unit 11 is provided with a rotary chuck 12 for sucking and holding the back side of the wafer W; each of the rotary chucks 12 is wound around a vertical axis by a rotating mechanism not shown in the drawing. The method of free rotation. In Fig. 1, 13 is a cup body, and 14 is a lift pin for lifting and lowering the wafer W. In addition, in FIG. 1, 10 is the base part which arrange|positions each process part 11.

Each processing unit 11 is provided with an auxiliary nozzle 15 that discharges a diluent to remove the photoresist film from an edge portion of the wafer W on which the photoresist film is formed, and a nozzle standby portion 16 for making the auxiliary nozzle 15 standby. Next, the auxiliary nozzle 15 is constructed in such a manner as to be supported by the arm portion 17 and between the position opposing the edge portion of the wafer W and the position above the nozzle standby portion 16, along the guide rail 18 Move in the horizontal direction.

On the base 10, a collecting nozzle 1 for supplying a photoresist to the wafer W is provided as a liquid The collecting portion 1 is provided in common to the photoresist supply portion of each of the processing units 11. Specifically, the collecting nozzle 1 is configured to be supported by the arm portion 21 and freely movable along the guide rail 22 which is laid along the side-by-side direction of the processing portions 11. Further, the collective nozzle 1 may be configured such that a plurality of nozzles 24 are disposed on the bottom surface side of the head 23 of the distal end portion of the arm portion 21. In other words, the collective nozzle 1 is configured such that "a plurality of photoresist liquids and diluents having different concentrations and compositions can be supplied to each wafer W in each processing portion 11", and the nozzles 24 are along The moving paths of the collecting nozzles 1 are arranged in a row. Further, in FIG. 1 and the like, the number of the nozzles 24 is omitted.

The intermediate portion of the elastic (flexible) liquid supply path 3 extending from each of the nozzles 24 of the collective nozzle 1 is fixed to the arm portion 21 of the collecting nozzle 1 and the upstream side of each liquid supply path 3 (with the nozzle 24) The end of the opposite side is connected to the liquid supply source 2 through the liquid supply control unit 4 of the present invention. The liquid supply path 3 is fixed to the base 10 between the arm portion 21 and the liquid supply control unit 4 by the fixing portion 26; as will be described later, the inside of the liquid supply control unit 4 and the vicinity of the liquid supply control unit 4, It is made of a hard member such as metal. In order to form the collecting nozzle 1 so as to be movable along the direction in which the respective processing units 11 are arranged in parallel, the length of the liquid supply path 3 between the fixed portion 26 and the collecting nozzle 1 is, for example, 0.5 m to 3.0 m.

Each of the liquid supply sources 2 is connected to a liquid supply flow path 25 as a driving unit for supplying air or the like to the gas phase side inside the liquid supply source 2, etc. The liquid supply source 2 is pressurized, and the treatment liquid is sent to the liquid supply path 3. In addition, in FIG. 1, about the liquid supply path 3 and the liquid supply source 2, only one of the various photoresist liquids and the diluent liquid are shown, and it is represented. Further, each of the liquid supply sources 2 is housed in a storage portion placed on the lower side of the photoresist coating device, for example, and is schematically depicted on the side of the photoresist coating device. In Fig. 1, 27 is a nozzle standby portion for allowing the collecting nozzle 1 to stand by.

Next, a liquid supply device according to an embodiment of the present invention will be described. This liquid supply device includes a liquid supply control unit 4 that is inserted into the liquid supply path 3. As shown in FIG. 2, the liquid supply control unit 4 is configured such that the following members are arranged in order from the upstream side along the flow path (liquid supply path 3) of the processing liquid: the opening and closing valve 31A is processed. Liquid supply and interruption; hydraulic adjustment The entire valve 31B; and the suckback valve 31C. The valves 31A to 31C are composed of diaphragms 5 to 7, respectively. The liquid supply path 3 on the upstream side (the liquid supply source 2 side) of the opening and closing valve 31A extends horizontally along the surface formed by the diaphragm 5, and the liquid supply path 3 on the downstream side is located near the center of the diaphragm 5, facing downward. The side is bent vertically. The liquid supply path 3 on the downstream side is connected to the hydraulic pressure adjusting valve 31B so as to extend in the vertical direction along the surface formed by the diaphragm 6 of the hydraulic pressure adjusting valve 31B. The liquid supply path 3 on the downstream side of the hydraulic pressure adjusting valve 31B is vertically bent at a portion close to the center of the diaphragm 6 to extend horizontally.

As described above, the liquid supply path 3 has two vertical bending portions, and the upstream side curved portion is provided with the opening and closing valve 31A, and the downstream side curved portion is provided with the hydraulic pressure adjusting valve 31B. In the following description, the liquid supply path 3 on the upstream side of the hydraulic pressure adjustment valve 31B and the liquid supply path 3 on the downstream side are referred to as "first liquid supply path 3A" and "second liquid supply path 3B", respectively. The suckback valve 31C is provided in the second liquid supply path 3B. In this example, the first liquid supply path 3A between the on-off valve 31A and the hydraulic pressure adjustment valve 31B, and the second liquid supply path 3B between the hydraulic pressure adjustment valve 31B and the suction valve 31C are made of a hard material such as metal. Composition.

As described above, the hydraulic pressure adjusting valve 31B can be said to be a curved portion provided in the flow path. However, as will be described later, the bending portion is prevented from being caused by the water hammer phenomenon which occurs when the opening and closing valve 31A is closed. The portion of the pressure change is also referred to as the hydraulic pressure adjustment chamber 8.

Each of the valves 31A to 31C is provided with an inflow port 33 for allowing a fluid such as air to flow into a region on the back side of the diaphragms 5 to 7 and a discharge port 34 for discharging the air. Therefore, the diaphragms 5 to 7 are configured such that when the air flows into the region, the diaphragms 5 to 7 advance in the flow direction of the treatment liquid, and on the other hand, if the air is discharged from the region, the diaphragms 5 to 7 Because of the stiffness caused by the resilience, it retreats relative to the direction of flow of the liquid. In Fig. 2, 36 and 37 are respectively a valve and a flow rate adjusting portion, and 38 is a storage portion for storing a fluid such as air. In FIG. 4, which will be described later, the operation of causing air to flow into the back side region of the diaphragms 5 to 7 from the inflow port 33 is referred to as "ON", and the operation of discharging from the discharge port 34 is referred to as "OFF".

Therefore, the diaphragm 5 of the opening and closing valve 31A is configured such that it is separated from the liquid toward the upper side toward the upper side of the collecting nozzle 1 (open position), and is extended downward. The position (closed position) at which the upper end opening of the first liquid supply path 3A is blocked is advanced and retracted to supply and shut off the processing liquid. In Fig. 2, a pressing mechanism such as a 35-series spring is used to bias (pulse) the diaphragm 5 in the opening and closing valve 31A upward. Further, in Fig. 2, the collecting nozzle 1 is depicted in a simplified manner.

As shown in FIGS. 2 and 3, the diaphragm 6 of the hydraulic pressure adjustment chamber 8 constitutes a movable wall portion that faces the upstream end of the second liquid supply path 3B in the hydraulic pressure adjustment chamber 8. The wall portion is disposed in such a manner as to advance and retreat in a direction in which the second liquid supply path 3B extends. In other words, the diaphragm 6 is configured to be movable forward and backward between the two positions: the liquid flow from the first liquid supply path 3A to the second liquid supply path 3B to the lateral side in the hydraulic pressure adjustment chamber 8 The position to leave and the position to be separated (retracted) from the second liquid supply path 3B compared to the position. As described in detail below, the diaphragm 6 has a function of suppressing the hydraulic fluctuation (pulsation) inside the second liquid supply path 3B or the inside of the hydraulic pressure adjustment chamber 8 instead of supplying and blocking the liquid flow. Here, the reason why the hydraulic pressure adjusting valve 31B is provided in the present invention, in other words, the reason why the hydraulic pressure is generated in the conventional liquid supply path 3 will be described below. Further, Fig. 3 shows a state in which the hydraulic pressure adjusting chamber 8 is cut in the longitudinal direction.

In other words, after the processing liquid is discharged from the nozzle 24 to the wafer W through the liquid supply path 3, while the liquid supply path 3 is closed by the opening and closing valve 31A, the processing liquid directly passes from the nozzle on the nozzle 24 side due to inertia and gravity. 24 spit out. Further, the front end portion of the nozzle 24 causes the treatment liquid to stay in the vicinity of the nozzle 24 due to the surface tension because the surface tension of the treatment liquid is generated. Therefore, when the liquid supply path 3 is closed by the opening and closing valve 31A, in order to prevent the remaining dripping from the nozzle 24, as shown in Fig. 5, it is necessary to generate a negative pressure in the region on the side of the opening and closing valve 31A in the liquid supply path 3 to resist This inertia, gravity or surface tension. Specifically, by using the diaphragm 5 as a mechanism for supplying and shutting off the treatment liquid, the liquid flow can be quickly interrupted.

Therefore, the processing liquid in the vicinity of the nozzle 24 is sucked into the region by the negative pressure generated in the region on the side of the opening and closing valve 31A in the liquid supply path 3, so that dripping from the nozzle 24 can be suppressed. However, when the inside of the liquid supply path 3 is a negative pressure, in the case where the conventional configuration of the hydraulic pressure adjusting valve 31B is not provided, as shown in FIG. 6, a so-called water hammer is generated, and this region is brought into a positive pressure. In other words, when the treatment liquid is sucked into the opening and closing valve 31A by the negative pressure in the liquid supply path 3, the treatment liquid on the nozzle 24 side is directly inertia due to the inertia. It flows to the side of the opening and closing valve 31A. When the inside of the liquid supply path 3 is a positive pressure, the processing liquid in the liquid supply path 3 is pushed out by the pressure in the liquid supply path 3, and flows toward the nozzle 24 side. Therefore, the inside of the liquid supply path 3 in the vicinity of the opening and closing valve 31A becomes a negative pressure. In the case where the hydraulic pressure adjusting valve 31B is not provided at a position near the opening and closing valve 31A, after the discharge of the processing liquid is stopped, as shown by a broken line in FIG. 7, the negative pressure and the positive pressure are alternately generated, and so-called Hydraulic pulsation (vibration).

The inside of the liquid supply path 3 is gradually converged to a certain hydraulic pressure during the period of the reverse pulsation, but the longer the length of the liquid supply path 3 between the opening and closing valve 31A and the nozzle 24, the longer the pulsation lasts. . In other words, the larger the volume of the treatment liquid flowing in the liquid supply path 3, the larger the degree (amplitude) of the hydraulic pressure fluctuation generated in the liquid supply path 3, and the pulsation is hard to be converged. Therefore, as described above, in order to allow the collective nozzle 1 to be used in common between the plurality of processing units 11, the collective nozzle 1 can be configured to move across the processing units 11, and in the case of the conventional configuration, Hydraulic pulsations are difficult to close.

As described above, when the hydraulic pulsation occurs, the liquid level inside the nozzle 24 drops too much, and excess processing liquid is discharged from the nozzle 24, which causes contamination of the nozzle 24 or causes a decrease in the yield of the wafer W. Further, if the liquid level inside the nozzle 24 rises due to the pulsation of the hydraulic pressure, the air bubbles may be caught in the nozzle 24.

Further, if the hydraulic pressure in the liquid supply path 3 does not fall within a certain range, it is difficult to operate the suction valve 31C to be described later. That is, if the suckback valve 31C is operated before the hydraulic pressure is lowered, for example, the magnitude of the water hammer phenomenon is increased. In other words, when a hydraulic pulsation occurs in the liquid supply path 3, it is necessary to set a certain waiting time until the pulsation is calm when the discharge processing is performed on the wafer W. Therefore, part of this standby time results in a decrease in yield.

Then, in the present invention, the hydraulic pressure adjusting valve 31B is provided as a so-called "valve for absorbing vibration" to suppress the pulsation. Regarding the function of the hydraulic pressure regulating valve 31B, together with the photoresist coating The function of the apparatus is explained in the following paragraph. As will be briefly explained, when the hydraulic pressure is to be increased in the liquid supply path 3, as shown by the solid line in Fig. 7, the diaphragm 6 is actuated to offset the increase in the hydraulic pressure.

Next, the description returns to the liquid supply control unit 4. The diaphragm 7 in the suckback valve 31C forms a suction mechanism for suckback. In other words, after the discharge of the treatment liquid from the nozzle 24 is completed, before the next discharge operation, for example, in order to suppress the drying of the treatment liquid at the tip end of the nozzle 24, the treatment liquid in the nozzle 24 is slightly turned toward A member that is attracted to the upper side (the liquid supply source 2 side). Specifically, when the suction operation is performed, the treatment liquid that is in contact with the diaphragm 7 is sucked to the side of the diaphragm 7 by raising the diaphragm 7, so that the liquid level in the nozzle 24 can be slightly raised.

In the photoresist coating apparatus, as shown in FIG. 2 described above, in order to form a photoresist film on the surface of the wafer W, a control unit 41 that outputs a control signal to the entire apparatus is provided. The control unit 41 includes a program that "discharges the processing liquid from each of the nozzles 24 and ends the discharge of the processing liquid after a predetermined period of time has elapsed", and specifically controls the opening and closing of the valves 36 and the flow rate adjustment. The air flow rate in the portion 37 is configured to perform the discharge processing of the photoresist liquid described below. The time point at which the valve 36 is opened and closed is set based on, for example, an experiment performed in advance.

Next, the action of the liquid supply device and the action of the photoresist coating device will be described below with reference to Figs. 8 to 11 . First, the processing liquid (diluent or photoresist) (T1) is discharged from the nozzle 24 to the central portion of the wafer W that is adsorbed and held by the rotary chuck 12 and rotated about the vertical axis. Specifically, as shown in FIG. 8, the diaphragm 5 in the opening and closing valve 31A is raised to the open position (OFF). In addition, while the diaphragm 6 of the hydraulic pressure adjusting valve 31B is advanced (ON) toward the second liquid supply path 3B side, the diaphragm 7 of the suckback valve 31C is moved to the lower position (ON).

The treatment liquid of the liquid supply source 2 passes through the liquid supply control unit 4 through the pressure of the air flowing into the liquid supply source 2 from the liquid supply flow path 25, flows through the liquid supply paths 3A and 3B, and flows from the nozzle 24 to the crystal. The center of the circle W is spit out. In this manner, the liquid film is developed from the central portion of the wafer W toward the outer edge side, and thereafter, a liquid film is formed on the entire surface of the wafer W. In addition, in the above-mentioned FIG. 4, the operation (ON, OFF) of each of the diaphragms 5 to 7 and the hydraulic pressure (high and low) inside the liquid supply path 3 are also shown, and the conventional diaphragm for suckback is also depicted. Movement and hydraulic pressure changes (dashed line).

Next, as shown in FIG. 9, the diaphragm 5 of the opening and closing valve 31A is lowered (ON), and the discharge of the treatment liquid (T2) is ended. Here, when the liquid supply path 3 is closed by the diaphragm 5, a negative pressure is generated inside the liquid supply path 3 as described above. Therefore, as shown in FIG. 10, the inside of the liquid supply path 3 is sucked by the negative pressure to the opening and closing valve 31A side, and as shown in FIG. 4, the hydraulic pressure in the liquid supply path 3 starts to rise. In other words, at a normal pressure, the processing liquid having a volume that is difficult to accommodate in the vicinity of the liquid supply path 3 advances toward the vicinity of the opening and closing valve 31A.

Therefore, in the present invention, when the hydraulic pressure in the liquid supply path 3 is to be increased (when the curve indicating the hydraulic pressure fluctuation in the second liquid supply path 3B forms a peak that protrudes downward, see FIG. 4), as shown in FIG. It is shown that the diaphragm 6 of the hydraulic pressure adjusting valve 31B is moved backward (T3). In other words, after the opening and closing valve 31A is closed, the diaphragm 6 of the hydraulic pressure adjusting valve 31B is operated to cancel the waveform of the hydraulic pressure generated inside the liquid supply path 3 after a predetermined set time has elapsed. Therefore, the volume of the processing liquid is increased at a position near the opening and closing valve 31A, and the direction in which the diaphragm 6 is retracted with respect to the direction of the processing liquid flowing from the second liquid supply path 3B to the hydraulic pressure adjusting valve 31B is as follows. As shown in Fig. 4, in the second liquid supply path 3B, the hydraulic pressure is rapidly stabilized to a normal pressure. Specifically, the inside of the liquid supply path 3 can be suppressed to such an extent that it is difficult to cause hydraulic pulsation regardless of whether the hydraulic pressure is not positive pressure or positive pressure is formed.

Therefore, it is possible to suppress the unnecessary processing liquid from being discharged from the nozzles 24, or to cause the air bubbles to be caught in the nozzles 24 (the subsequent discharge failure of the processing liquid for the wafer W), and it is possible to suppress unnecessary processing liquid consumption. When the treatment liquid is a photoresist liquid, it is possible to suppress contamination of the nozzle 24 by the excess treatment liquid and to suppress a film thickness defect of the photoresist film (low yield).

Thereafter, as shown in FIG. 11, the diaphragm 7 of the suck-back valve 31C is raised, and the processing liquid in the nozzle 24 is sucked to the upper side, and the suckback operation (T4) is ended. When the suckback operation is performed, the present invention (T4) and the conventional technique (T5) are compared with reference to Fig. 4. In the conventional technique (the configuration in which the hydraulic pressure adjusting valve 31B is not provided), as described above, it is necessary to set The standby time until the pulsation of the hydraulic pressure in the second liquid supply path 3B is converged. Therefore, in the prior art, after the discharge of the treatment liquid is finished, it is advanced. A period of time before the line suckback action produces a large time delay (Time Lag).

On the other hand, in the present invention, after the diaphragm 6 in the hydraulic pressure adjusting valve 31B starts the retracting operation, the hydraulic pressure in the second liquid supply path 3B is quickly stabilized to the normal pressure. Therefore, after the diaphragm 6 in the hydraulic pressure adjusting valve 31B ends the retracting operation, the suckback operation is quickly started. Here, the time required for the hydraulic pressure in the second liquid supply path 3B to be stabilized is measured in advance by an experiment or the like, and the time at which the diaphragm 6 of the suckback valve 31C is operated is set based on the measurement result.

Further, the second liquid supply path 3B is provided with a measurement unit that measures the pressure of the treatment liquid, and when the measurement result in the measurement unit falls within a certain range, the suction valve 31C may be operated. When the processing liquid is discharged from the nozzles 24, the dilution liquid and the photoresist liquid are sequentially supplied to the wafer W, and when the discharge of the diluent liquid and the photoresist liquid is stopped, the hydraulic pressure regulating valve 31B and the above-described hydraulic pressure regulating valve 31B are respectively returned. The diaphragms 6 and 7 in the suction valve 31C operate; in the above example, the respective descriptions of the diluent and the photoresist are omitted.

According to the above-described embodiment, the first liquid supply path 3A and the second liquid supply path 3B between the liquid supply source 2 and the nozzle 24 are connected to the hydraulic pressure adjustment chamber 8 provided with the hydraulic pressure adjustment valve 31B so as to form a mutual intersection. Directional connection. Then, the diaphragm 6 of the hydraulic pressure adjusting valve 31B is disposed to face the upstream end of the second liquid supply path 3B, and is configured to be freely advanced and retracted along the extending direction of the second liquid supply path 3B. Therefore, when the discharge of the treatment liquid is stopped, even if the hydraulic pressure in the liquid supply path 3 is pulsated, the hydraulic pressure adjustment valve 31B can be retracted so as to cancel the pulsation, thereby suppressing the pulsation, so that the discharge of the treatment liquid can be suppressed. The drip from the nozzle 24 after the end. Therefore, the film thickness of the photoresist film can be suppressed. In addition, it is possible to suppress the bubble from being caught in the nozzle 24. Further, in the case where the suck-back valve 31C is provided, since the suck-back operation can be performed immediately after the discharge processing for one wafer W is completed, the discharge processing for the subsequent other wafers W can be quickly started.

Other embodiments of the hydraulic pressure regulating valve 31B described above are listed below. 12 shows an example of the partition wall 51 and the support portion 52. The partition wall 51 is made of resin, and the diaphragm 6, the inflow port 33, and the discharge port 34 are defined while the diaphragm 6 in the hydraulic pressure adjusting valve 31B is advanced and retracted. The communication portion 52 is a member such as a cylinder that connects the partition wall 51 and the diaphragm 6. In this example, the configuration is as follows: if air is caused to flow into the region, the partition wall 51 is directed toward the second liquid supply. The path 3B side is expanded, and the diaphragm 6 is advanced toward the second liquid supply path 3B.

13 is a view showing an example in which the driving portion 53 and the advancing and retracting shaft 54 are disposed in the hydraulic pressure adjusting chamber 8. The driving portion 53 is formed by a motor that advances and retracts the diaphragm 6 of the hydraulic pressure adjusting valve 31B, and the advancing and retracting shaft 54 is The drive unit 53 is configured to advance and retreat freely in the extending direction of the second liquid supply path 3B. The diaphragm 6 is attached to the front end portion of the advancing and retracting shaft 54. In this example, the diaphragm 6 also advances and retreats in response to the action of the advancing and retracting shaft 54.

Fig. 14 shows an example in which the piezoelectric element 55 is provided as a movable wall portion instead of the diaphragm 6 in the hydraulic pressure adjusting valve 31B. Specifically, the piezoelectric element 55 includes, for example, a piezoelectric substrate 56 such as quartz crystal, and a pair of electrode films 57 formed on the left and right surfaces of the piezoelectric substrate 56. Then, when the pulsed high-frequency power is applied to the electrode film 57 from the high-frequency power supply unit 59 serving as the drive unit in a very short time, the bending vibration of the piezoelectric substrate 56 is caused, and the same effect as the above-described example can be obtained. effect. In Fig. 14, a 58-series support portion supports the piezoelectric element 55 and hermetically blocks the outer edge portion of the piezoelectric element 55 from the inner wall surface of the hydraulic pressure adjustment chamber 8.

In addition, FIG. 15 shows an example of the diaphragm 6 in which the disk-shaped magnet 61 is disposed instead of the hydraulic pressure adjusting valve 31B. The magnet 61 is disposed such that the magnetic pole of one of the magnetic poles of the S pole and the N pole faces the second liquid supply path 3B side (opposing manner), and the support portion 62 supports the hydraulic pressure adjustment chamber. The inner wall surface of the airtight chamber 8 and the inner region of the hydraulic pressure adjustment chamber 8 and the liquid flowing in the liquid supply path 3 are hermetically divided. In the internal region, the electromagnetic stone 63 is disposed as a driving portion so as to face the magnet 61, and the magnet 61 can be changed by switching the switch 65 provided between the DC power supply units 64. The magnetic pole in the middle. Therefore, in this example, the magnet 61 is moved forward and backward with respect to the second liquid supply path 3B by switching the magnetic pole on the side of the magnet 61 in the electromagnet 63.

FIG. 16 shows an example in which the film 71 formed of a resin is airtightly disposed on a part of the pipe wall in the first liquid supply path 3A as a movable wall portion instead of the diaphragm 6 in which the hydraulic pressure adjusting valve 31B is provided. In other words, it can be said that the separator 6 is provided on the wall surface portion of the first liquid supply path 3A. In this example, the first liquid supply path 3A and the second liquid supply path 3B are directly connected to each other. then, The film 71 is disposed at a position facing the front end portion on the first liquid supply path 3A side in the second liquid supply path 3B. Therefore, the portion on the second liquid supply path 3B side of the first liquid supply path 3A serves as the hydraulic pressure adjustment chamber 8.

Further, the back side of the film 71 (opposite to the second liquid supply path 3B) is provided with a mechanism for advancing and retracting the film 71. Specifically, the drive unit 72 having the same configuration as that of the above-described FIG. 13 and the advance and retreat are disposed. Axis 73. The front end portion of the advancing and retracting shaft 73 is attached to the film 71, and the central portion of the film 71 is advanced and retracted by driving the driving portion 72.

In each of the above examples, the time point at which the diaphragm 6 in the hydraulic pressure adjusting valve 31B starts to retreat is preferably between the following two time points in FIG. 4 (between the inflection points): the liquid supply path The time point (valley) at which the hydraulic pressure in 3 is lowered due to the closing of the liquid supply path 3, and the time (peak) at which the hydraulic pressure is about to start to rise. Further, as described above, in the case where the inflection point (the pulsation of the hydraulic pressure) formed by the valley or the peak in the hydraulic pressure is sequentially generated, the time point is set to be generated first after the liquid supply path 3 is closed. Between the valley and the peak of the hydraulic pressure, but it can also be set between the valley and the peak generated after the second time in the hydraulic pressure. Fig. 17 shows an example in which the diaphragm 6 in the hydraulic pressure adjusting valve 31B is started to retreat when the valley is generated for the second time in the hydraulic pressure.

Although the liquid supply control unit 4 is provided as an example of the collecting nozzle 1 in the above, the auxiliary nozzle 15 for discharging the diluent may be provided in each processing unit 11, or it may be provided in A nozzle (not shown) for forming a coating film of an organic system containing cerium (Si).

1‧‧‧Collection nozzle

3A‧‧‧1st liquid supply path

3B‧‧‧Second liquid supply path

4‧‧‧Liquid Supply Control Department

5~7‧‧‧Separator

8‧‧‧Hydraulic adjustment room

23‧‧‧Spray

24‧‧‧Nozzles

26‧‧‧ Fixed Department

31A‧‧‧Opening and closing valve

31B‧‧‧Hydraulic adjustment valve

31C‧‧‧Retraction valve

33‧‧‧Inlet

34‧‧‧Export

36‧‧‧Valves

37‧‧‧Flow Adjustment Department

38‧‧‧ Storage Department

41‧‧‧Control Department

Claims (5)

A liquid supply device for supplying a processing liquid from a nozzle to a target object, comprising: a first liquid supply path corresponding to an upstream side of the curved portion among the flow paths having a curved portion, and upstream thereof The end is connected to the liquid supply source of the processing liquid; the valve is inserted into the first liquid supply path for supplying and blocking the processing liquid; and the second liquid supply path corresponds to the flow path. a downstream side of the curved portion, and a nozzle at a downstream end thereof; a movable wall portion for absorbing vibration, forming a wall portion close to the curved portion, freely advancing and retracting; and a driving portion, when the valve is closed, the treatment liquid is pressed out When the nozzle side is sucked back to the valve side, the movable wall portion for absorbing vibration is retracted, and the suction mechanism is provided on the downstream side of the second liquid supply path for the nozzle from the nozzle. After the discharge of the liquid is completed and the movable wall portion for absorbing vibration is receded, the liquid level of the treatment liquid in the nozzle is sucked. The liquid supply device of claim 1, further comprising: a control unit that controls the drive unit. The liquid supply device of claim 2, wherein the control unit outputs a control signal to retract the movable wall portion for absorbing vibration after a set time elapses after the valve is closed. A liquid supply device according to claim 2, wherein the control unit outputs a control signal for advancing the movable wall portion for absorbing vibration while the valve is being opened or being opened. The liquid supply device according to any one of claims 1 to 3, wherein the movable wall portion for absorbing vibration is constituted by a diaphragm.