TWI530963B - Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste - Google Patents
Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste Download PDFInfo
- Publication number
- TWI530963B TWI530963B TW101115136A TW101115136A TWI530963B TW I530963 B TWI530963 B TW I530963B TW 101115136 A TW101115136 A TW 101115136A TW 101115136 A TW101115136 A TW 101115136A TW I530963 B TWI530963 B TW I530963B
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- Prior art keywords
- silver
- sem
- particles
- paste
- flat
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 147
- 229910052709 silver Inorganic materials 0.000 title claims description 138
- 239000004332 silver Substances 0.000 title claims description 136
- 238000000034 method Methods 0.000 title claims description 20
- 239000011859 microparticle Substances 0.000 title description 38
- 239000002245 particle Substances 0.000 claims description 90
- 239000010419 fine particle Substances 0.000 claims description 46
- 239000000126 substance Substances 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 238000001878 scanning electron micrograph Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 5
- 239000005416 organic matter Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 13
- 239000003638 chemical reducing agent Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 7
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
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- 238000002156 mixing Methods 0.000 description 7
- 229940100890 silver compound Drugs 0.000 description 7
- 150000003379 silver compounds Chemical class 0.000 description 7
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- 108010010803 Gelatin Proteins 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 6
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- 239000007788 liquid Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- -1 amine carboxylic acid Chemical class 0.000 description 5
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- 238000010304 firing Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000002612 dispersion medium Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
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- 239000004302 potassium sorbate Substances 0.000 description 4
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- 229940069338 potassium sorbate Drugs 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
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- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
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- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 2
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
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- 239000010946 fine silver Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
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- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-SZSCBOSDSA-N 2-[(1s)-1,2-dihydroxyethyl]-3,4-dihydroxy-2h-furan-5-one Chemical compound OC[C@H](O)C1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-SZSCBOSDSA-N 0.000 description 1
- IUTKPPDDLYYMBE-UHFFFAOYSA-N 3,4,5-trihydroxybenzoic acid;hydrate Chemical compound O.OC(=O)C1=CC(O)=C(O)C(O)=C1 IUTKPPDDLYYMBE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
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- YASYEJJMZJALEJ-UHFFFAOYSA-N Citric acid monohydrate Chemical compound O.OC(=O)CC(O)(C(O)=O)CC(O)=O YASYEJJMZJALEJ-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-CUHNMECISA-N D-Cellobiose Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-CUHNMECISA-N 0.000 description 1
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- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
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- 239000002211 L-ascorbic acid Substances 0.000 description 1
- 235000000069 L-ascorbic acid Nutrition 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
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- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
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- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0551—Flake form nanoparticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011100657 | 2011-04-28 | ||
| PCT/JP2012/061448 WO2012147945A1 (ja) | 2011-04-28 | 2012-04-27 | 平板状の銀微粒子とその製造方法およびそれを用いたペーストとペーストを用いた印刷回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201306049A TW201306049A (zh) | 2013-02-01 |
| TWI530963B true TWI530963B (zh) | 2016-04-21 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101115136A TWI530963B (zh) | 2011-04-28 | 2012-04-27 | Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste |
| TW104133555A TWI530964B (zh) | 2011-04-28 | 2012-04-27 | Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104133555A TWI530964B (zh) | 2011-04-28 | 2012-04-27 | Sheet-like silver microparticles and methods for producing the same, and a paste using the same and a paste |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5969988B2 (ja) |
| TW (2) | TWI530963B (ja) |
| WO (1) | WO2012147945A1 (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6366140B2 (ja) * | 2012-11-29 | 2018-08-01 | 国立大学法人九州大学 | 金属微粒子含有構造体 |
| JP6168837B2 (ja) * | 2013-05-13 | 2017-07-26 | 国立大学法人東北大学 | 銅微粒子およびその製造方法 |
| US10071420B2 (en) | 2013-06-25 | 2018-09-11 | Kaken Tech Co., Ltd. | Flake-like silver powder, conductive paste, and method for producing flake-like silver powder |
| JP2015050120A (ja) * | 2013-09-03 | 2015-03-16 | 株式会社小森コーポレーション | 機能性膜のパターニング方法、電子デバイスの製造方法、透明導電性フィルム |
| KR101886263B1 (ko) * | 2014-02-27 | 2018-08-07 | 더 스쿨 코포레이션 칸사이 유니버시티 | 구리 나노 입자 및 그 제조 방법, 구리 나노 입자 분산액, 구리 나노 잉크, 구리 나노 입자의 저장 방법 및 구리 나노 입자의 소결 방법 |
| JP6325878B2 (ja) * | 2014-04-22 | 2018-05-16 | 株式会社ノリタケカンパニーリミテド | 平板状銀ナノ粒子の製造方法および平板状銀ナノ粒子含有組成物 |
| JP6628351B2 (ja) * | 2015-07-24 | 2020-01-08 | 国立大学法人大阪大学 | 銀粒子製造方法 |
| JP6920029B2 (ja) | 2016-04-04 | 2021-08-18 | 日亜化学工業株式会社 | 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法 |
| JP6762848B2 (ja) * | 2016-11-02 | 2020-09-30 | 東洋アルミニウム株式会社 | ペースト組成物 |
| JP6859799B2 (ja) * | 2017-03-29 | 2021-04-14 | 三菱マテリアル株式会社 | ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法 |
| KR102509366B1 (ko) * | 2018-01-26 | 2023-03-10 | 닛신 엔지니어링 가부시키가이샤 | 은 미립자의 제조 방법 |
| WO2024070271A1 (ja) * | 2022-09-27 | 2024-04-04 | ナミックス株式会社 | 導電性組成物、その焼結体、積層構造体、電子部品及び半導体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4759271B2 (ja) * | 2005-01-12 | 2011-08-31 | バンドー化学株式会社 | 複合粒子分散体および複合粒子分散体の製造方法 |
| JP4848674B2 (ja) * | 2005-06-03 | 2011-12-28 | 日本電気株式会社 | 樹脂金属複合導電材料およびその製造方法 |
| US9011726B2 (en) * | 2005-09-29 | 2015-04-21 | Alpha Scientific, Corporation | Electrically conductive powder and production thereof, paste of electrically conductive powder and production of paste of electrically conductive powder |
| JP5065607B2 (ja) * | 2006-03-10 | 2012-11-07 | 三井金属鉱業株式会社 | 微粒銀粒子製造方法及びその製造方法で得られた微粒銀粒子 |
| JP5074837B2 (ja) * | 2007-07-02 | 2012-11-14 | 三井金属鉱業株式会社 | 扁平銀粉の製造方法、扁平銀粉、及び導電性ペースト |
| JP2009179879A (ja) * | 2008-01-06 | 2009-08-13 | Dowa Electronics Materials Co Ltd | 極性媒体との親和性に優れた銀微粉および銀インク |
| JP5139848B2 (ja) * | 2008-03-14 | 2013-02-06 | Ｄｏｗａエレクトロニクス株式会社 | 没食子酸の誘導体に被覆された銀ナノ粒子 |
| JP5824201B2 (ja) * | 2009-09-11 | 2015-11-25 | Ｄｏｗａエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
-
2012
- 2012-04-27 JP JP2013512485A patent/JP5969988B2/ja active Active
- 2012-04-27 TW TW101115136A patent/TWI530963B/zh active
- 2012-04-27 WO PCT/JP2012/061448 patent/WO2012147945A1/ja active Application Filing
- 2012-04-27 TW TW104133555A patent/TWI530964B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012147945A1 (ja) | 2014-07-28 |
| WO2012147945A1 (ja) | 2012-11-01 |
| TWI530964B (zh) | 2016-04-21 |
| TW201306049A (zh) | 2013-02-01 |
| JP5969988B2 (ja) | 2016-08-17 |
| TW201603049A (zh) | 2016-01-16 |
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