TWI529978B - A phosphor, a method of manufacturing the same, and a light-emitting device using the same - Google Patents

A phosphor, a method of manufacturing the same, and a light-emitting device using the same Download PDF

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Publication number
TWI529978B
TWI529978B TW103142609A TW103142609A TWI529978B TW I529978 B TWI529978 B TW I529978B TW 103142609 A TW103142609 A TW 103142609A TW 103142609 A TW103142609 A TW 103142609A TW I529978 B TWI529978 B TW I529978B
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TW
Taiwan
Prior art keywords
phosphor
light
emitting
peak
emitting device
Prior art date
Application number
TW103142609A
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English (en)
Chinese (zh)
Other versions
TW201530830A (zh
Inventor
平松亮介
田村淳
石田邦夫
恵子 阿爾貝薩
加藤雅礼
Original Assignee
東芝股份有限公司
東芝高新材料公司
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Application filed by 東芝股份有限公司, 東芝高新材料公司 filed Critical 東芝股份有限公司
Publication of TW201530830A publication Critical patent/TW201530830A/zh
Application granted granted Critical
Publication of TWI529978B publication Critical patent/TWI529978B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/57—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing manganese or rhenium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
TW103142609A 2013-12-09 2014-12-08 A phosphor, a method of manufacturing the same, and a light-emitting device using the same TWI529978B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013254437A JP6342146B2 (ja) 2013-12-09 2013-12-09 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置

Publications (2)

Publication Number Publication Date
TW201530830A TW201530830A (zh) 2015-08-01
TWI529978B true TWI529978B (zh) 2016-04-11

Family

ID=53371163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103142609A TWI529978B (zh) 2013-12-09 2014-12-08 A phosphor, a method of manufacturing the same, and a light-emitting device using the same

Country Status (6)

Country Link
US (1) US10519368B2 (enExample)
JP (1) JP6342146B2 (enExample)
KR (2) KR101940439B1 (enExample)
CN (2) CN112500855A (enExample)
TW (1) TWI529978B (enExample)
WO (1) WO2015087861A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101809793B1 (ko) 2014-09-30 2017-12-15 니치아 카가쿠 고교 가부시키가이샤 불화물 형광체 및 그 제조 방법 및 발광 장치
JP2016088950A (ja) * 2014-10-30 2016-05-23 信越化学工業株式会社 赤色蛍光体
CN105181671B (zh) * 2015-09-21 2018-06-26 中国科学院长春光学精密机械与物理研究所 测试氮化物荧光粉老化程度的方法
CN105331360A (zh) * 2015-10-30 2016-02-17 烟台希尔德新材料有限公司 Led红色荧光粉及其组合物的产业化制备方法以及产品和应用
JP2018002813A (ja) 2016-06-29 2018-01-11 株式会社東芝 蛍光体および発光装置
US9929321B2 (en) 2016-08-04 2018-03-27 Kabushiki Kaisha Toshiba Phosphor, producing method thereof and light-emitting device employing the phosphor
JP6812231B2 (ja) * 2016-12-20 2021-01-13 デンカ株式会社 フッ化物蛍光体の製造方法
JP2019044017A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
JP2019044018A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US8491816B2 (en) * 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
WO2009119486A1 (ja) * 2008-03-25 2009-10-01 国立大学法人群馬大学 蛍光体及びその製造方法並びに該蛍光体を用いた白色発光ダイオード
JP5682104B2 (ja) * 2008-09-05 2015-03-11 三菱化学株式会社 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP5105132B1 (ja) 2011-06-02 2012-12-19 三菱化学株式会社 半導体発光装置、半導体発光システムおよび照明器具
JP5418548B2 (ja) * 2011-07-06 2014-02-19 日亜化学工業株式会社 フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置
EP2663611B1 (en) * 2011-12-16 2014-07-23 Koninklijke Philips N.V. Mn-activated hexafluorosilicates for led applications
JP5840540B2 (ja) 2012-03-15 2016-01-06 株式会社東芝 白色照明装置
JP2014177511A (ja) 2013-03-13 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
JP2014177586A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
CN103540314B (zh) * 2013-10-10 2015-01-14 上海师范大学 一种低温合成的氟硅酸盐纳米棒红色荧光粉及其制备方法

Also Published As

Publication number Publication date
JP2015113362A (ja) 2015-06-22
KR20160092003A (ko) 2016-08-03
JP6342146B2 (ja) 2018-06-13
US20160340577A1 (en) 2016-11-24
US10519368B2 (en) 2019-12-31
KR101940439B1 (ko) 2019-01-18
KR20180002893A (ko) 2018-01-08
CN112500855A (zh) 2021-03-16
TW201530830A (zh) 2015-08-01
CN105793388A (zh) 2016-07-20
WO2015087861A1 (ja) 2015-06-18

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