KR101940439B1 - 형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치 - Google Patents

형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치 Download PDF

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KR101940439B1
KR101940439B1 KR1020177036905A KR20177036905A KR101940439B1 KR 101940439 B1 KR101940439 B1 KR 101940439B1 KR 1020177036905 A KR1020177036905 A KR 1020177036905A KR 20177036905 A KR20177036905 A KR 20177036905A KR 101940439 B1 KR101940439 B1 KR 101940439B1
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phosphor
light
light emitting
emitting device
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KR20180002893A (ko
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료스케 히라마츠
준 다무라
구니오 이시다
게이코 알베사르
마사히로 가토
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가부시끼가이샤 도시바
도시바 마테리알 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/615—Halogenides
    • C09K11/616—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/57—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing manganese or rhenium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
    • C09K11/617—Silicates
    • H01L33/502—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
KR1020177036905A 2013-12-09 2014-12-09 형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치 Active KR101940439B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-254437 2013-12-09
JP2013254437A JP6342146B2 (ja) 2013-12-09 2013-12-09 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
PCT/JP2014/082516 WO2015087861A1 (ja) 2013-12-09 2014-12-09 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置

Related Parent Applications (1)

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KR1020167017423A Division KR20160092003A (ko) 2013-12-09 2014-12-09 형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치

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KR20180002893A KR20180002893A (ko) 2018-01-08
KR101940439B1 true KR101940439B1 (ko) 2019-01-18

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KR1020177036905A Active KR101940439B1 (ko) 2013-12-09 2014-12-09 형광체 및 그의 제조 방법, 및 상기 형광체를 포함하는 발광 장치
KR1020167017423A Ceased KR20160092003A (ko) 2013-12-09 2014-12-09 형광체, 그의 제조 방법, 및 상기 형광체를 사용한 발광 장치

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Country Status (6)

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US (1) US10519368B2 (enExample)
JP (1) JP6342146B2 (enExample)
KR (2) KR101940439B1 (enExample)
CN (2) CN112500855A (enExample)
TW (1) TWI529978B (enExample)
WO (1) WO2015087861A1 (enExample)

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* Cited by examiner, † Cited by third party
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KR101809793B1 (ko) 2014-09-30 2017-12-15 니치아 카가쿠 고교 가부시키가이샤 불화물 형광체 및 그 제조 방법 및 발광 장치
JP2016088950A (ja) * 2014-10-30 2016-05-23 信越化学工業株式会社 赤色蛍光体
CN105181671B (zh) * 2015-09-21 2018-06-26 中国科学院长春光学精密机械与物理研究所 测试氮化物荧光粉老化程度的方法
CN105331360A (zh) * 2015-10-30 2016-02-17 烟台希尔德新材料有限公司 Led红色荧光粉及其组合物的产业化制备方法以及产品和应用
JP2018002813A (ja) 2016-06-29 2018-01-11 株式会社東芝 蛍光体および発光装置
US9929321B2 (en) 2016-08-04 2018-03-27 Kabushiki Kaisha Toshiba Phosphor, producing method thereof and light-emitting device employing the phosphor
JP6812231B2 (ja) * 2016-12-20 2021-01-13 デンカ株式会社 フッ化物蛍光体の製造方法
JP2019044017A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
JP2019044018A (ja) * 2017-08-30 2019-03-22 デンカ株式会社 フッ化物蛍光体及び発光装置
US10608148B2 (en) 2018-05-31 2020-03-31 Cree, Inc. Stabilized fluoride phosphor for light emitting diode (LED) applications

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WO2009119486A1 (ja) * 2008-03-25 2009-10-01 国立大学法人群馬大学 蛍光体及びその製造方法並びに該蛍光体を用いた白色発光ダイオード
JP2010209311A (ja) 2008-09-05 2010-09-24 Mitsubishi Chemicals Corp 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP2013014715A (ja) 2011-07-06 2013-01-24 Nichia Corp フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置
WO2013137144A1 (ja) 2012-03-15 2013-09-19 株式会社 東芝 白色照明装置

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US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US8491816B2 (en) * 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
JP5105132B1 (ja) 2011-06-02 2012-12-19 三菱化学株式会社 半導体発光装置、半導体発光システムおよび照明器具
EP2663611B1 (en) * 2011-12-16 2014-07-23 Koninklijke Philips N.V. Mn-activated hexafluorosilicates for led applications
JP2014177511A (ja) 2013-03-13 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
JP2014177586A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 蛍光体、およびその製造方法、ならびにその蛍光体を用いた発光装置
CN103540314B (zh) * 2013-10-10 2015-01-14 上海师范大学 一种低温合成的氟硅酸盐纳米棒红色荧光粉及其制备方法

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Publication number Priority date Publication date Assignee Title
WO2009119486A1 (ja) * 2008-03-25 2009-10-01 国立大学法人群馬大学 蛍光体及びその製造方法並びに該蛍光体を用いた白色発光ダイオード
JP2010209311A (ja) 2008-09-05 2010-09-24 Mitsubishi Chemicals Corp 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置
JP2013014715A (ja) 2011-07-06 2013-01-24 Nichia Corp フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置
WO2013137144A1 (ja) 2012-03-15 2013-09-19 株式会社 東芝 白色照明装置

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JP2015113362A (ja) 2015-06-22
KR20160092003A (ko) 2016-08-03
JP6342146B2 (ja) 2018-06-13
US20160340577A1 (en) 2016-11-24
US10519368B2 (en) 2019-12-31
KR20180002893A (ko) 2018-01-08
CN112500855A (zh) 2021-03-16
TW201530830A (zh) 2015-08-01
CN105793388A (zh) 2016-07-20
TWI529978B (zh) 2016-04-11
WO2015087861A1 (ja) 2015-06-18

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