TWI517975B - 拋光墊及其製造方法 - Google Patents

拋光墊及其製造方法 Download PDF

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Publication number
TWI517975B
TWI517975B TW099145034A TW99145034A TWI517975B TW I517975 B TWI517975 B TW I517975B TW 099145034 A TW099145034 A TW 099145034A TW 99145034 A TW99145034 A TW 99145034A TW I517975 B TWI517975 B TW I517975B
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
layer
composition
polymer particles
Prior art date
Application number
TW099145034A
Other languages
English (en)
Chinese (zh)
Other versions
TW201130656A (en
Inventor
李乃朝
威廉 戴爾 喬瑟夫
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201130656A publication Critical patent/TW201130656A/zh
Application granted granted Critical
Publication of TWI517975B publication Critical patent/TWI517975B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
TW099145034A 2009-12-22 2010-12-21 拋光墊及其製造方法 TWI517975B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US42244210P 2010-12-13 2010-12-13

Publications (2)

Publication Number Publication Date
TW201130656A TW201130656A (en) 2011-09-16
TWI517975B true TWI517975B (zh) 2016-01-21

Family

ID=44247814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099145034A TWI517975B (zh) 2009-12-22 2010-12-21 拋光墊及其製造方法

Country Status (6)

Country Link
US (1) US20130012108A1 (enExample)
JP (1) JP5728026B2 (enExample)
KR (1) KR101855073B1 (enExample)
SG (1) SG181890A1 (enExample)
TW (1) TWI517975B (enExample)
WO (1) WO2011087737A2 (enExample)

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JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US12673397B2 (en) * 2018-11-30 2026-07-07 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
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KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
TWI741753B (zh) * 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102293801B1 (ko) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
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TWI879629B (zh) * 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法
TWI788017B (zh) * 2021-09-16 2022-12-21 美商帕拉萊斯集團國際有限責任公司 墊體及其製法
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
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Also Published As

Publication number Publication date
JP2013515379A (ja) 2013-05-02
KR20120120247A (ko) 2012-11-01
CN102762340A (zh) 2012-10-31
WO2011087737A2 (en) 2011-07-21
TW201130656A (en) 2011-09-16
WO2011087737A3 (en) 2011-09-15
SG181890A1 (en) 2012-07-30
JP5728026B2 (ja) 2015-06-03
KR101855073B1 (ko) 2018-05-09
US20130012108A1 (en) 2013-01-10

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