KR101855073B1 - 연마 패드 및 그의 제조 방법 - Google Patents

연마 패드 및 그의 제조 방법 Download PDF

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Publication number
KR101855073B1
KR101855073B1 KR1020127019080A KR20127019080A KR101855073B1 KR 101855073 B1 KR101855073 B1 KR 101855073B1 KR 1020127019080 A KR1020127019080 A KR 1020127019080A KR 20127019080 A KR20127019080 A KR 20127019080A KR 101855073 B1 KR101855073 B1 KR 101855073B1
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South Korea
Prior art keywords
polishing
layer
composition
polishing pad
delete delete
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Expired - Fee Related
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KR1020127019080A
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English (en)
Korean (ko)
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KR20120120247A (ko
Inventor
나이차오 리
윌리엄 디. 조셉
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20120120247A publication Critical patent/KR20120120247A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
KR1020127019080A 2009-12-22 2010-12-20 연마 패드 및 그의 제조 방법 Expired - Fee Related KR101855073B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US61/288,982 2009-12-22
US42244210P 2010-12-13 2010-12-13
US61/422,442 2010-12-13
PCT/US2010/061199 WO2011087737A2 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Publications (2)

Publication Number Publication Date
KR20120120247A KR20120120247A (ko) 2012-11-01
KR101855073B1 true KR101855073B1 (ko) 2018-05-09

Family

ID=44247814

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127019080A Expired - Fee Related KR101855073B1 (ko) 2009-12-22 2010-12-20 연마 패드 및 그의 제조 방법

Country Status (6)

Country Link
US (1) US20130012108A1 (enExample)
JP (1) JP5728026B2 (enExample)
KR (1) KR101855073B1 (enExample)
SG (1) SG181890A1 (enExample)
TW (1) TWI517975B (enExample)
WO (1) WO2011087737A2 (enExample)

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JP5450622B2 (ja) * 2008-07-18 2014-03-26 スリーエム イノベイティブ プロパティズ カンパニー 浮遊要素を備えた研磨パッド、その製造方法及び使用方法
RU2013136330A (ru) * 2011-01-04 2015-02-10 Эвоник Дегусса Гмбх Заготовки из композиционного материала и изготовленные из них формованные детали, а также формованные детали, изготовленные непосредственно на основе гидроксифункционализированных (мет) акрилатов, которые термореактивно сшиваются с помощью уретдионов
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
KR101819539B1 (ko) * 2011-11-29 2018-01-17 캐보트 마이크로일렉트로닉스 코포레이션 기초 레이어 및 연마면 레이어를 가진 연마 패드
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
KR101847619B1 (ko) * 2012-01-12 2018-04-11 엠.씨.케이(주) 고함량의 연마제 성분을 포함한 연마패드 및 그 연마패드 제조방법
KR101532896B1 (ko) 2012-03-20 2015-06-30 제이에이치 로드스 컴퍼니, 인크 자가-컨디셔닝 연마 패드 및 이를 제조하는 방법
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI580524B (zh) * 2014-02-18 2017-05-01 中國砂輪企業股份有限公司 高性能化學機械研磨修整器及其製作方法
JP6365869B2 (ja) * 2014-03-19 2018-08-01 Dic株式会社 ウレタン組成物及び研磨材
JP6315246B2 (ja) 2014-03-31 2018-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CA2925923A1 (en) * 2014-05-01 2015-11-05 3M Innovative Properties Company Flexible abrasive article and method of using the same
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10010106B2 (en) * 2015-04-30 2018-07-03 Frito-Lay North America, Inc. Method and apparatus for removing a portion of a food product with an abrasive stream
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
US10005172B2 (en) * 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
CN105150120B (zh) * 2015-09-01 2018-03-30 河南科技学院 一种Roll‑to‑Roll化学机械抛光机用固结磨料抛光辊的刚性层及其制备方法
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN112045556B (zh) * 2015-10-16 2022-06-28 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6320660B1 (ja) * 2016-05-23 2018-05-09 タツタ電線株式会社 導電性接着剤組成物
KR101894071B1 (ko) * 2016-11-03 2018-08-31 에스케이씨 주식회사 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법
CA3059095C (en) * 2017-04-03 2023-07-18 Jl Darling Llc Coating for recyclable paper
US11524390B2 (en) * 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7089905B2 (ja) * 2018-03-02 2022-06-23 富士紡ホールディングス株式会社 研磨パッド
KR20200140931A (ko) 2018-05-07 2020-12-16 어플라이드 머티어리얼스, 인코포레이티드 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
US20220209324A1 (en) * 2019-04-05 2022-06-30 Ddp Specialty Electronic Materials Us, Llc Polyurethane based thermal interface material
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102718259B1 (ko) * 2019-07-23 2024-10-16 케이피엑스케미칼 주식회사 탄성 패드 및 그 제조 방법
KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
TWI741753B (zh) * 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102293801B1 (ko) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
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KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
TWI879629B (zh) * 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法
TWI788017B (zh) * 2021-09-16 2022-12-21 美商帕拉萊斯集團國際有限責任公司 墊體及其製法
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
TW202407002A (zh) * 2022-06-15 2024-02-16 美商Ｃｍｃ材料有限責任公司 用於製備化學機械拋光墊之雙重固化樹脂
TW202419495A (zh) * 2022-06-15 2024-05-16 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之uv可固化樹脂
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Also Published As

Publication number Publication date
KR20120120247A (ko) 2012-11-01
TW201130656A (en) 2011-09-16
WO2011087737A3 (en) 2011-09-15
US20130012108A1 (en) 2013-01-10
JP5728026B2 (ja) 2015-06-03
CN102762340A (zh) 2012-10-31
TWI517975B (zh) 2016-01-21
JP2013515379A (ja) 2013-05-02
WO2011087737A2 (en) 2011-07-21
SG181890A1 (en) 2012-07-30

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