SG181890A1 - Polishing pad and method of making the same - Google Patents

Polishing pad and method of making the same Download PDF

Info

Publication number
SG181890A1
SG181890A1 SG2012046546A SG2012046546A SG181890A1 SG 181890 A1 SG181890 A1 SG 181890A1 SG 2012046546 A SG2012046546 A SG 2012046546A SG 2012046546 A SG2012046546 A SG 2012046546A SG 181890 A1 SG181890 A1 SG 181890A1
Authority
SG
Singapore
Prior art keywords
polishing
layer
polishing pad
composition
polymer particles
Prior art date
Application number
SG2012046546A
Other languages
English (en)
Inventor
Naichao Li
William D Joseph
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG181890A1 publication Critical patent/SG181890A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
SG2012046546A 2009-12-22 2010-12-20 Polishing pad and method of making the same SG181890A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US42244210P 2010-12-13 2010-12-13
PCT/US2010/061199 WO2011087737A2 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Publications (1)

Publication Number Publication Date
SG181890A1 true SG181890A1 (en) 2012-07-30

Family

ID=44247814

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012046546A SG181890A1 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Country Status (6)

Country Link
US (1) US20130012108A1 (enExample)
JP (1) JP5728026B2 (enExample)
KR (1) KR101855073B1 (enExample)
SG (1) SG181890A1 (enExample)
TW (1) TWI517975B (enExample)
WO (1) WO2011087737A2 (enExample)

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KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
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KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102293801B1 (ko) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
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Also Published As

Publication number Publication date
JP2013515379A (ja) 2013-05-02
KR20120120247A (ko) 2012-11-01
CN102762340A (zh) 2012-10-31
WO2011087737A2 (en) 2011-07-21
TW201130656A (en) 2011-09-16
WO2011087737A3 (en) 2011-09-15
JP5728026B2 (ja) 2015-06-03
KR101855073B1 (ko) 2018-05-09
TWI517975B (zh) 2016-01-21
US20130012108A1 (en) 2013-01-10

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