SG181890A1 - Polishing pad and method of making the same - Google Patents
Polishing pad and method of making the same Download PDFInfo
- Publication number
- SG181890A1 SG181890A1 SG2012046546A SG2012046546A SG181890A1 SG 181890 A1 SG181890 A1 SG 181890A1 SG 2012046546 A SG2012046546 A SG 2012046546A SG 2012046546 A SG2012046546 A SG 2012046546A SG 181890 A1 SG181890 A1 SG 181890A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- layer
- polishing pad
- composition
- polymer particles
- Prior art date
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- 230000003068 static effect Effects 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- XLAIWHIOIFKLEO-OWOJBTEDSA-N trans-stilbene-4,4'-diol Chemical compound C1=CC(O)=CC=C1\C=C\C1=CC=C(O)C=C1 XLAIWHIOIFKLEO-OWOJBTEDSA-N 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28898209P | 2009-12-22 | 2009-12-22 | |
| US42244210P | 2010-12-13 | 2010-12-13 | |
| PCT/US2010/061199 WO2011087737A2 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG181890A1 true SG181890A1 (en) | 2012-07-30 |
Family
ID=44247814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012046546A SG181890A1 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130012108A1 (enExample) |
| JP (1) | JP5728026B2 (enExample) |
| KR (1) | KR101855073B1 (enExample) |
| SG (1) | SG181890A1 (enExample) |
| TW (1) | TWI517975B (enExample) |
| WO (1) | WO2011087737A2 (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2323808B1 (en) * | 2008-07-18 | 2015-09-30 | 3M Innovative Properties Company | Polishing pad with floating elements and method of making and using the same |
| WO2012093006A1 (de) * | 2011-01-04 | 2012-07-12 | Evonik Degussa Gmbh | Composite-halbzeuge und daraus hergestellte formteile sowie direkt hergestellte formteile auf basis von hydroxyfunktionalisierten (meth) acrylaten, die mittels uretdionen duroplastisch vernetzt werden |
| US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
| US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| WO2013081665A2 (en) * | 2011-11-29 | 2013-06-06 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| KR101847619B1 (ko) * | 2012-01-12 | 2018-04-11 | 엠.씨.케이(주) | 고함량의 연마제 성분을 포함한 연마패드 및 그 연마패드 제조방법 |
| CN104302446B (zh) * | 2012-03-20 | 2017-10-31 | Jh罗得股份有限公司 | 自调理抛光垫及其制备方法 |
| TWI590918B (zh) * | 2013-08-16 | 2017-07-11 | 三芳化學工業股份有限公司 | 硏磨墊、硏磨裝置及製造硏磨墊之方法 |
| US9421666B2 (en) * | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| TWI580524B (zh) * | 2014-02-18 | 2017-05-01 | 中國砂輪企業股份有限公司 | 高性能化學機械研磨修整器及其製作方法 |
| JP6365869B2 (ja) * | 2014-03-19 | 2018-08-01 | Dic株式会社 | ウレタン組成物及び研磨材 |
| JP6315246B2 (ja) * | 2014-03-31 | 2018-04-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| KR20160147700A (ko) * | 2014-05-01 | 2016-12-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 연마 물품 및 이의 사용 방법 |
| US9873180B2 (en) * | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| CN107078048B (zh) * | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| TWI548481B (zh) * | 2014-11-17 | 2016-09-11 | 三芳化學工業股份有限公司 | 拋光墊及其製造方法 |
| US10086500B2 (en) * | 2014-12-18 | 2018-10-02 | Applied Materials, Inc. | Method of manufacturing a UV curable CMP polishing pad |
| US10010106B2 (en) * | 2015-04-30 | 2018-07-03 | Frito-Lay North America, Inc. | Method and apparatus for removing a portion of a food product with an abrasive stream |
| KR101600393B1 (ko) * | 2015-05-20 | 2016-03-07 | 에프엔에스테크 주식회사 | 연마 패드 및 이의 제조 방법 |
| US10005172B2 (en) * | 2015-06-26 | 2018-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-porosity method for forming polishing pad |
| CN105150120B (zh) * | 2015-09-01 | 2018-03-30 | 河南科技学院 | 一种Roll‑to‑Roll化学机械抛光机用固结磨料抛光辊的刚性层及其制备方法 |
| TWI769988B (zh) * | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
| TW202400363A (zh) * | 2015-10-16 | 2024-01-01 | 美商應用材料股份有限公司 | 拋光墊及形成其之方法 |
| JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10456886B2 (en) | 2016-01-19 | 2019-10-29 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| KR101973137B1 (ko) * | 2016-05-23 | 2019-04-26 | 타츠타 전선 주식회사 | 도전성 접착제 조성물 |
| KR101894071B1 (ko) * | 2016-11-03 | 2018-08-31 | 에스케이씨 주식회사 | 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법 |
| WO2018187220A1 (en) * | 2017-04-03 | 2018-10-11 | Jl Darling Llc | Coating for recyclable paper |
| US11524390B2 (en) * | 2017-05-01 | 2022-12-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Methods of making chemical mechanical polishing layers having improved uniformity |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7089905B2 (ja) * | 2018-03-02 | 2022-06-23 | 富士紡ホールディングス株式会社 | 研磨パッド |
| WO2019217012A1 (en) | 2018-05-07 | 2019-11-14 | Applied Materials, Inc. | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| US20200171623A1 (en) * | 2018-11-30 | 2020-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer backside cleaning apparatus and method of cleaning wafer backside |
| JP2022528401A (ja) * | 2019-04-05 | 2022-06-10 | ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー | ポリウレタン系熱界面材料 |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| KR102718259B1 (ko) * | 2019-07-23 | 2024-10-16 | 케이피엑스케미칼 주식회사 | 탄성 패드 및 그 제조 방법 |
| KR102270392B1 (ko) * | 2019-10-01 | 2021-06-30 | 에스케이실트론 주식회사 | 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치 |
| TWI741753B (zh) * | 2019-10-29 | 2021-10-01 | 南韓商Ｓｋｃ索密思股份有限公司 | 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法 |
| KR102293765B1 (ko) * | 2019-11-21 | 2021-08-26 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| KR102293801B1 (ko) * | 2019-11-28 | 2021-08-25 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11638979B2 (en) | 2020-06-09 | 2023-05-02 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
| US11612978B2 (en) | 2020-06-09 | 2023-03-28 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11807710B2 (en) * | 2020-10-19 | 2023-11-07 | Cmc Materials, Inc. | UV-curable resins used for chemical mechanical polishing pads |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| KR102538440B1 (ko) * | 2021-05-26 | 2023-05-30 | 에스케이엔펄스 주식회사 | 연마 시스템, 연마 패드 및 반도체 소자의 제조방법 |
| CN117677465A (zh) * | 2021-07-06 | 2024-03-08 | 应用材料公司 | 用于化学机械抛光的包含声学窗口的抛光垫 |
| TWI788017B (zh) * | 2021-09-16 | 2022-12-21 | 美商帕拉萊斯集團國際有限責任公司 | 墊體及其製法 |
| JP7441916B2 (ja) * | 2021-10-12 | 2024-03-01 | エスケー エンパルス カンパニー リミテッド | 研磨パッドおよびこれを用いた半導体素子の製造方法 |
| WO2023244740A1 (en) * | 2022-06-15 | 2023-12-21 | Cmc Materials Llc | Uv-curable resins for chemical mechanical polishing pads |
| TW202407002A (zh) * | 2022-06-15 | 2024-02-16 | 美商Ｃｍｃ材料有限責任公司 | 用於製備化學機械拋光墊之雙重固化樹脂 |
| US20240227120A1 (en) * | 2022-12-22 | 2024-07-11 | Applied Materials, Inc. | Uv curable printable formulations for high performance 3d printed cmp pads |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077601A (en) * | 1998-05-01 | 2000-06-20 | 3M Innovative Properties Company | Coated abrasive article |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| KR100905266B1 (ko) * | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| US7097549B2 (en) * | 2001-12-20 | 2006-08-29 | Ppg Industries Ohio, Inc. | Polishing pad |
| US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
| JP2005538571A (ja) * | 2002-09-25 | 2005-12-15 | ピーピージー インダストリーズ オハイオ， インコーポレイテッド | 平坦化するための窓を有する研磨パッド |
| US20070010169A1 (en) * | 2002-09-25 | 2007-01-11 | Ppg Industries Ohio, Inc. | Polishing pad with window for planarization |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| KR20040093402A (ko) * | 2003-04-22 | 2004-11-05 | 제이에스알 가부시끼가이샤 | 연마 패드 및 반도체 웨이퍼의 연마 방법 |
| JP2006114666A (ja) * | 2004-10-14 | 2006-04-27 | Asahi Kasei Electronics Co Ltd | 研磨パッド、その製造方法、およびそれを用いた研磨方法 |
| DE102006035726A1 (de) * | 2006-07-28 | 2008-01-31 | Evonik Röhm Gmbh | Verfahren zur Herstellung von ABA-Triblockcopolymeren auf (Meth)acrylatbasis |
-
2010
- 2010-12-20 US US13/518,475 patent/US20130012108A1/en not_active Abandoned
- 2010-12-20 WO PCT/US2010/061199 patent/WO2011087737A2/en not_active Ceased
- 2010-12-20 KR KR1020127019080A patent/KR101855073B1/ko not_active Expired - Fee Related
- 2010-12-20 JP JP2012546101A patent/JP5728026B2/ja active Active
- 2010-12-20 SG SG2012046546A patent/SG181890A1/en unknown
- 2010-12-21 TW TW099145034A patent/TWI517975B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011087737A3 (en) | 2011-09-15 |
| TWI517975B (zh) | 2016-01-21 |
| JP2013515379A (ja) | 2013-05-02 |
| JP5728026B2 (ja) | 2015-06-03 |
| KR20120120247A (ko) | 2012-11-01 |
| KR101855073B1 (ko) | 2018-05-09 |
| WO2011087737A2 (en) | 2011-07-21 |
| TW201130656A (en) | 2011-09-16 |
| US20130012108A1 (en) | 2013-01-10 |
| CN102762340A (zh) | 2012-10-31 |
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