JP5728026B2 - 研磨パッド及びこれの製造方法 - Google Patents

研磨パッド及びこれの製造方法 Download PDF

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Publication number
JP5728026B2
JP5728026B2 JP2012546101A JP2012546101A JP5728026B2 JP 5728026 B2 JP5728026 B2 JP 5728026B2 JP 2012546101 A JP2012546101 A JP 2012546101A JP 2012546101 A JP2012546101 A JP 2012546101A JP 5728026 B2 JP5728026 B2 JP 5728026B2
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Japan
Prior art keywords
polishing
layer
composition
present disclosure
polishing pad
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JP2012546101A
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English (en)
Japanese (ja)
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JP2013515379A5 (enExample
JP2013515379A (ja
Inventor
ナイチャオ リー，
ナイチャオ リー，
ウィリアム ディー． ジョセフ，
ウィリアム ディー． ジョセフ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2013515379A publication Critical patent/JP2013515379A/ja
Publication of JP2013515379A5 publication Critical patent/JP2013515379A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Polyurethanes Or Polyureas (AREA)
JP2012546101A 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法 Active JP5728026B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US61/288,982 2009-12-22
US42244210P 2010-12-13 2010-12-13
US61/422,442 2010-12-13
PCT/US2010/061199 WO2011087737A2 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Publications (3)

Publication Number Publication Date
JP2013515379A JP2013515379A (ja) 2013-05-02
JP2013515379A5 JP2013515379A5 (enExample) 2014-02-13
JP5728026B2 true JP5728026B2 (ja) 2015-06-03

Family

ID=44247814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012546101A Active JP5728026B2 (ja) 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法

Country Status (6)

Country Link
US (1) US20130012108A1 (enExample)
JP (1) JP5728026B2 (enExample)
KR (1) KR101855073B1 (enExample)
SG (1) SG181890A1 (enExample)
TW (1) TWI517975B (enExample)
WO (1) WO2011087737A2 (enExample)

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RU2013136330A (ru) * 2011-01-04 2015-02-10 Эвоник Дегусса Гмбх Заготовки из композиционного материала и изготовленные из них формованные детали, а также формованные детали, изготовленные непосредственно на основе гидроксифункционализированных (мет) акрилатов, которые термореактивно сшиваются с помощью уретдионов
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
KR101819539B1 (ko) * 2011-11-29 2018-01-17 캐보트 마이크로일렉트로닉스 코포레이션 기초 레이어 및 연마면 레이어를 가진 연마 패드
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
KR101847619B1 (ko) * 2012-01-12 2018-04-11 엠.씨.케이(주) 고함량의 연마제 성분을 포함한 연마패드 및 그 연마패드 제조방법
KR101532896B1 (ko) 2012-03-20 2015-06-30 제이에이치 로드스 컴퍼니, 인크 자가-컨디셔닝 연마 패드 및 이를 제조하는 방법
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
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JP6365869B2 (ja) * 2014-03-19 2018-08-01 Dic株式会社 ウレタン組成物及び研磨材
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TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN112045556B (zh) * 2015-10-16 2022-06-28 应用材料公司 使用增材制造工艺形成先进抛光垫的方法和设备
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KR101894071B1 (ko) * 2016-11-03 2018-08-31 에스케이씨 주식회사 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법
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Also Published As

Publication number Publication date
KR101855073B1 (ko) 2018-05-09
KR20120120247A (ko) 2012-11-01
TW201130656A (en) 2011-09-16
WO2011087737A3 (en) 2011-09-15
US20130012108A1 (en) 2013-01-10
CN102762340A (zh) 2012-10-31
TWI517975B (zh) 2016-01-21
JP2013515379A (ja) 2013-05-02
WO2011087737A2 (en) 2011-07-21
SG181890A1 (en) 2012-07-30

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